JP5949254B2 - Power converter - Google Patents

Description

  The present invention relates to a power converter configured to include a plurality of switching elements.

  For example, Patent Document 1 below proposes that a contact pin to be connected to a component mounted on a board is inserted into a guide hole formed in a plate-like member made of synthetic resin. Here, the guide hole becomes larger as the diameter of the hole is closer to the opening. This is intended to guide the contact pin to an appropriate position on the substrate by inserting the contact pin from the opening.

  Further, in Patent Document 1, it is possible to automate the work of mounting the plate-like member on the mounting board by forming a smooth portion serving as an adsorption surface on the plate-like member.

JP 2010-146873 A

  By the way, when providing an adsorption surface as mentioned above, since a plate-shaped member becomes large, there exists a possibility that a board | substrate may enlarge.

  The present invention has been made in the process of solving the above-described problems, and an object thereof is to provide a new power conversion device configured to include a plurality of switching elements.

  Hereinafter, means for solving the above-described problems and the operation and effect thereof will be described.

In the first invention, a plurality of switching elements (S ¥ #; ¥ = u, v, w; # = p, n) constituting the power conversion circuit (INV) and terminals of the switching elements are electrically connected. An electronic component (DU) to be mounted, a substrate (20) on which the electronic component is mounted, and a connector (30) provided on the substrate. The terminal of the switching element is inserted.

  When connecting each of a plurality of switching elements to a component, avoid interference between the thick portions of the switching elements and the members that package the switching elements, ensure an insulation distance between the switching elements, and provide a cooling space. In general, a space is provided between terminals of a plurality of switching elements. On the other hand, when a connector is mounted on a board, a technique is known in which the suction surface is sucked and moved to a place where the board is arranged. However, if the connector is provided with a suction surface, the connector becomes large, which may result in an increase in the size of the substrate.

  In this regard, in the above-described invention, by using a single connector for a plurality of switching elements, an area used as an adsorption surface when the connector is mounted in a state where the connector is fixed to the substrate, the plurality of switching elements The projection surface can be a space to be provided between the terminals. For this reason, it is possible to avoid a situation in which the connector is enlarged due to the provision of the suction surface on the connector, and the board is enlarged accordingly.

  In addition, about the expansion of the concept regarding the following typical embodiment concerning this invention, it describes in the column of "other embodiment" after typical embodiment.

1 is a system configuration diagram according to a first embodiment. FIG. The figure which shows the connection method of the semiconductor substrate and power card concerning the embodiment. The perspective view which shows the structure of the cooling device concerning the embodiment. The figure which shows the semiconductor substrate concerning 2nd Embodiment. The figure which shows the arrangement structure of the connector concerning 3rd Embodiment. The figure which shows the semiconductor substrate concerning 4th Embodiment. The circuit diagram which shows the inverter concerning 5th Embodiment. The figure which shows the arrangement structure of the connector concerning the embodiment. The figure which shows the arrangement structure of the connector concerning 6th Embodiment. The figure which shows the connection method of the power card and semiconductor substrate concerning 7th Embodiment. The figure which shows the connection method of the power card concerning a 8th Embodiment, and a semiconductor substrate.

<First Embodiment>
Hereinafter, a first embodiment in which a power conversion device according to the present invention is applied to an apparatus connected to an in-vehicle main machine will be described with reference to the drawings.

  A motor generator 10 shown in FIG. 1 is an in-vehicle main machine, and is mechanically coupled to drive wheels (not shown). The motor generator 10 is connected to the high voltage battery 12 via a DC / AC conversion circuit (inverter INV). Here, the inverter INV includes a series connection body of the switching elements Sup and Sun, a series connection body of the switching elements Svp and Svn, and a series connection body of the switching elements Swp and Swn. Connection points are connected to the U, V, and W phases of the motor generator 10, respectively. As these switching elements S ¥ # (¥ = u, v, w; # = p, n), an insulated gate bipolar transistor (IGBT) is used in the present embodiment. In addition, a diode D ¥ # is connected in antiparallel to each of these.

  The control device 18 is a control device that includes a central processing unit (CPU 18a) and uses the low-voltage battery 16 as a power source. The control device 18 operates the inverter INV in order to control the motor generator 10 as a control target and to control the control amount as desired. Specifically, an operation signal g ¥ # is output to the drive unit DU in order to operate the switching element S ¥ # of the inverter INV. Here, the high-potential side operation signal g ¥ p and the corresponding low-potential side operation signal g ¥ n are complementary to each other. In other words, the high-potential side switching element S ¥ p and the corresponding low-potential side switching element S ¥ n are alternately turned on.

  The switching element S ¥ # is provided with a temperature sensitive diode SD for detecting the temperature thereof, and both terminals of the temperature sensitive diode SD are electrically connected to the drive unit DU.

  The high voltage system including the high voltage battery 12 and the low voltage system including the low voltage battery 16 are insulated from each other and have different reference potentials. Specifically, for example, the median value of the positive electrode potential and the negative electrode potential of the high voltage battery 12 is set as the vehicle body potential, and the negative electrode potential of the low voltage battery 16 is set as the vehicle body potential. Then, transmission and reception of signals between these two systems is performed via an interface 14 including an insulating communication means such as a photocoupler.

  FIG. 2A shows a substrate (semiconductor substrate 20) on which electronic components constituting the drive unit DU are mounted.

  The illustrated semiconductor substrate 20 has both a low voltage circuit area LVCA in which the CPU 18a included in the control device 18 is mounted and a high voltage circuit area HVCA in which the drive unit DU is mounted. Here, basically, in the drawing, the right region is the low voltage circuit region LVCA, and the left region is the high voltage circuit region HVCA. However, in the high voltage circuit area HVCA, there are a mixture of components constituting both the low voltage system and the high voltage system, such as a photocoupler. The transformer 22 for the flyback converter that serves as the power supply for the drive circuit of each switching element S ¥ # of the inverter INV also constitutes both the low voltage system and the high voltage system. Has been placed.

  In the figure, a connector 24 is used to connect the ground (body of the vehicle body) of the low voltage system, the power line of the low voltage battery 16, the CAN communication line, etc. to the circuit of the low voltage circuit area LVCA on the semiconductor substrate 20. It is. Incidentally, the CPU 18a receives torque command values and the like of the motor generator 10 from an external higher-level electronic control unit (ECU) via the connector 24 to control them.

  Each switching element S ¥ # of the inverter INV is connected by inserting its terminal into the semiconductor substrate 20 from the back surface (lower surface in the drawing) side of the semiconductor substrate 20 as shown in FIG. 2B. ing. Here, each of the switching elements S ¥ # is packaged by being housed in the power card PC #. The power card PC # also contains a diode D ¥ # and a temperature sensitive diode SD.

  The power card PC # has the same structure as that of the upper arm switching element S ¥ p and the lower arm switching element S ¥ n of the power card PC #. G), the Kelvin emitter terminal KE, the sense terminal SE, the anode terminal A and the cathode terminal K of the temperature sensitive diode SD are inserted and connected to the semiconductor substrate 20. Here, the Kelvin emitter terminal KE is a terminal having the same potential as the emitter of the switching element Sw #, and the sense terminal SE is a terminal for outputting a minute current having a correlation with the current flowing through the switching element S ¥ #. It is.

  The power card PC # is arranged in the cooling device 40 as shown in FIG. Here, the cooling device 40 has a structure in which the cooling water flowing in from the inflow port 42 flows out from the outflow port 46 through the cooling passage 44, and power is provided so as to be sandwiched between each pair of cooling passages 44. Card PC # is arranged.

  Since the switching element S ¥ # constitutes a high voltage system, as shown in FIG. 2A, the switching element S ¥ # is connected to a circuit having a potential different from that of the switching element S ¥ #. An insulating region IA is provided in the semiconductor substrate 20 for insulation. The insulating region IA is a region where a circuit (element or wiring) is not arranged. Incidentally, in FIG. 2A, only the transformer 22, the CPU 18 a, and the connector 24 are described as examples, but various electronic components are actually mounted on the semiconductor substrate 20. The insulating region IA is a region where such electronic components are not mounted. Although the semiconductor substrate 20 is a double-sided substrate, an electronic component having a large length in the normal direction of the mounting surface on the semiconductor substrate 20 (an electronic component having a large height) does not face the power card PC #. To be implemented.

  The lower row formed by five circles in FIG. 2A shows the terminals of the power card PCn provided with the switching element S ¥ n of the lower arm. The insulating region IA is not provided between them, because the Kelvin emitter terminals KE corresponding to the switching elements S ¥ n of these lower arms are all at the same reference potential (the negative potential of the high-voltage battery 12). Because there is. For this reason, the drive circuit that drives the switching element S ¥ n of the lower arm operates with a predetermined voltage width with reference to this potential. Here, the operating voltage itself of the components of these drive circuits is not necessarily higher than the components in the low voltage circuit area LVCA. For this reason, it is not always necessary to provide the insulating region IA on the semiconductor substrate 20 between the drive circuits of the different lower-arm switching elements S ¥ n.

  On the other hand, the upper row in the figure shows the terminals of the power card PCp provided with the switching element S ¥ p of the upper arm, which are separated from each other by the insulating region IA. This is because the potential difference at the Kelvin emitter terminal KE of the switching element S ¥ p of each upper arm varies greatly depending on whether the corresponding switching element S ¥ n of the lower arm is on or off. Because. For this reason, although the operating voltage itself of these drive circuits is small, it is necessary to insulate them from each other.

  The width of the insulating region IA is determined from the viewpoint of avoiding legal requirements, dielectric breakdown, and the like.

  As shown in FIG. 2B, a guide connector 30 is provided on the power card PC side of the semiconductor substrate 20. The guide connector 30 is provided with a hole 32 into which each of the terminals of the power card PC is inserted in a main body 30 a made of an insulating material such as a resin, and guides each of the terminals to an appropriate position on the semiconductor substrate 20. Specifically, the hole 32 has a shape in which the aperture becomes smaller as it moves from one opening side to the other opening side. Then, the side with the larger diameter is the power card PC side, and by inserting the terminal, a slight shift of the terminal or the like is corrected by the hole 32, and the terminal is guided to an appropriate portion of the semiconductor substrate 20.

  The guide connector 30 is effective when it is difficult to attach the power card PC # to the semiconductor substrate 20 using a jig, such as when the gap between the housing for housing the semiconductor substrate 20 and the semiconductor substrate 20 is small. is there.

  The guide connector 30 is provided with a fixing member 34 in the short direction thereof, and is fixed to the semiconductor substrate 20 thereby. The fixing member 34 fixes the main body 30 a while separating the main body 30 a, which is a part other than the fixing member 34, from the semiconductor substrate 20. Here, an electronic component can be formed between the main body 30 a and the semiconductor substrate 20. In the figure, a MOS field effect transistor 39 is particularly illustrated. This is because the Kelvin emitter terminal KE and the gate G of the switching element S ¥ # are connected with a low impedance so that the OFF state is maintained regardless of noise or the like when the switching element S ¥ # is in the OFF state. Holding means.

  In FIG. 2A, the arrangement area of the main body 30a of the guide connector 30 is indicated by a broken line. The guide connector 30 uses an area between the hole 32 into which the terminal of the power card PCp of the upper arm is inserted and the hole 32 into which the terminal of the power card PC of the lower arm is inserted as a suction surface. It is. That is, when the guide connector 30 is arranged at a corresponding portion of the semiconductor substrate 20 in order to fix the guide connector 30 to the semiconductor substrate 20, the region is used as a surface for suction by the suction means.

  Here, in a state where the guide connector 30 is fixed to the semiconductor substrate 20, the surface used as the suction surface includes the projection surface of the insulating region IA of the semiconductor substrate 20 shown in FIG. Since the insulating region IA should be provided in the semiconductor substrate 20 regardless of the presence or absence of the guide connector 30, according to this setting, the semiconductor substrate 20 itself needs to be enlarged because the guide connector 30 has a suction surface. Does not occur. Furthermore, since an electronic component cannot be mounted in the insulating region IA, a situation where the area for mounting the component is reduced by fixing the guide connector 30 to the semiconductor substrate 20 is preferably suppressed. In the figure, the provision of the guide connector 30 in a region other than the insulating region IA, such as the mounting region of the MOS field effect transistor 39, restricts the height of components that can be mounted. In FIG. 2B, the MOS field effect transistor 39 is illustrated as a component that satisfies this restriction.

  According to the embodiment described above, the following effects can be obtained.

  (1) A plurality of terminals of the power card PC whose potentials are different from each other are inserted into the guide connector 30. As a result, the surface of the guide connector 30 used as the suction surface at the time of mounting can be used as the projection surface of the insulating region IA, thereby avoiding the situation where the semiconductor substrate 20 is enlarged due to the size of the guide connector 30. it can.

  (2) The fixing member 34 is provided in the short direction of the main body 30a of the guide connector 30. As a result, when it is necessary to secure an insulation distance from the fixing member 34, it is possible to expand the area where the electronic component can be mounted on the semiconductor substrate 20 as compared with the case where it is provided in the longitudinal direction. Here, when it is necessary to ensure an insulation distance from the fixing member 34, the fixing member 34 is made of a metal material, and the assembly of the fixing member 34 and the semiconductor substrate 20 is provided on the semiconductor substrate 20. In some cases, this is performed by bonding the solder pattern to the conductor pattern. Regarding the fixing of the fixing member 34, it is easy to connect the conductor material to the pattern. On the other hand, in this case, the pattern to be assembled tends to be a potential approximately equal to the potential of the Kelvin emitter terminal KE of the corresponding power card. This is because a pattern connected to the Kelvin emitter terminal KE has to be used due to pattern restrictions, and it tends to be difficult to secure an insulation distance from the pattern connected to the Kelvin emitter terminal KE. It is. For this reason, it is necessary to secure an insulating distance from the fixing member 34.

(3) The main body 30 a of the guide connector 30 is disposed so as to be separated from the semiconductor substrate 20. Thereby, it can be confirmed from the side that the terminal of the power card PC is inserted into the guide connector 30. In addition, electronic components can be mounted during this time. Further, when the fixing member 34 is fixed to the semiconductor substrate 20 with solder or the like, it is possible to avoid damage to the main body 30a due to heat at that time.
<Second Embodiment>
Hereinafter, the second embodiment will be described with reference to the drawings with a focus on differences from the first embodiment.

  FIG. 4 shows a substrate (semiconductor substrate 20) on which the drive circuit for the inverter INV and the like according to this embodiment are mounted. In FIG. 4, the same reference numerals are assigned for convenience to the members corresponding to the members shown in FIG.

  As shown in the drawing, in the present embodiment, a slit S1 is provided in the semiconductor substrate 20 between the insertion position of the terminal of the power card PCp of the upper arm and the insertion position of the terminal of the power card PCn of the lower arm. . In this case, the insulation distance to be provided between the insertion position of the terminal of the power card PCp of the upper arm and the insertion position of the terminal of the power card PCn of the lower arm is handled as a spatial distance, not a creepage distance, in the slit Sl portion. be able to. Therefore, the distance between the insertion locations can be reduced.

The reduction effect is sufficiently exhibited by using the same guide connector 30 for the upper arm power card PCp and the lower arm power card PCn. On the other hand, for example, when the guide connector 30 is made different between the power card PCp of the upper arm and the power card PCn of the lower arm, if the fixing member 34 is provided in a region where they face each other, the fixing member 34 is caused. The distance cannot be shortened sufficiently.
<Third Embodiment>
Hereinafter, the third embodiment will be described with reference to the drawings with a focus on differences from the first embodiment.

  FIG. 5 shows a substrate (semiconductor substrate 20) on which the drive circuit for the inverter INV and the like according to this embodiment are mounted. In FIG. 5, the same reference numerals are given for the sake of convenience to those corresponding to the members shown in FIG. 2.

  As shown in the figure, in this embodiment, a single guide connector 30 is used for three upper-arm power cards PCp, and a single guide connector 30 is used for three lower-arm power cards PCn. In this case, since the potentials of the power cards PCp of the upper arm can be different from each other, the insulating region IA is secured. Therefore, for the guide connector 30 of the upper arm, the surface used as the suction surface in the mounting process is a region including the projection surface of the insulating region IA interposed between the power cards PCp of the adjacent upper arms. Can do. Also in this case, it is desirable to provide the fixing member 34 in the short direction of the main body 30a of the guide connector 30. In this case, the short direction is the arrangement direction of the power cards PC # of the arms.

Incidentally, since the potentials of the lower-arm power cards PCn are the same, the insulating region IA is not provided between adjacent ones. However, in the case of the present embodiment, due to the housing method in the cooling device 40 shown in FIG. 3 and the like, the interval between the power cards PCp of the upper arm and the interval between the power cards PCn of the lower arm are Identical. For this reason, the semiconductor substrate 20 does not increase in size due to the provision of the guide connector 30 corresponding to the power card PCn of the lower arm.
<Fourth Embodiment>
Hereinafter, the fourth embodiment will be described with reference to the drawings with a focus on differences from the third embodiment.

  FIG. 6 shows a substrate (semiconductor substrate 20) on which the drive circuit for the inverter INV and the like according to this embodiment are mounted. In FIG. 6, the same reference numerals are assigned to the members corresponding to those shown in FIG.

As shown in the figure, in the present embodiment, a slit S1 is provided in a section of the semiconductor substrate 20 that is sandwiched between the insertion positions of the terminals of the power card PCp of the adjacent upper arm. In this case, the insulation distance to be provided between the insertion positions of the terminals of the power card PCp of the adjacent upper arm can be handled as a spatial distance instead of a creepage distance for the slit Sl portion. Therefore, the section between the above can be reduced.
<Fifth Embodiment>
Hereinafter, the fifth embodiment will be described with reference to the drawings with a focus on differences from the third embodiment.

  FIG. 7 shows an inverter INV according to the present embodiment. As illustrated, the inverter INV according to the present embodiment includes two sets of U-phase legs, V-phase legs, and W-phase legs. That is, the legs of the ¥ (¥ = u, v, w) phase are composed of a series connection body of the switching element S ¥ p1 and the switching element S ¥ n1, and a series connection body of the switching element S ¥ p2 and the switching element S ¥ n2. It has.

  FIG. 8 shows a substrate (semiconductor substrate 20) on which the drive circuit of the inverter INV and the like according to this embodiment are mounted. In FIG. 8, components corresponding to those shown in FIG. 2 are given the same reference numerals for convenience.

  As illustrated, in the present embodiment, the same guide connector 30 is used in the switching elements S ¥ # 1, S ¥ # 2 of the same phase and the same arm. Here, since the switching elements S ¥ # 1 and S ¥ # 2 having the same phase and the same arm maintain the same potential, the insulating region IA does not exist between them. However, between the power cards PC # corresponding to the switching elements S ¥ # 1, S ¥ # 2 of the same phase and the same arm due to the housing method in the cooling device 40 shown in FIG. A certain amount of interval occurs. For this reason, if the same guide connector 30 is used for these, the suction surface at the time of mounting can be set as the projection surface of the said space | interval.

By the way, when using each different guide connector 30 for each different power card PC # and forming a suction surface on the main body 30a, a suction surface is required for each guide connector 30. There is a possibility that the semiconductor substrate 20 may be increased in size due to a request to avoid interference between the guide connectors 30.
<Sixth Embodiment>
Hereinafter, the sixth embodiment will be described with reference to the drawings with a focus on differences from the first embodiment.

  FIG. 9 shows a substrate (semiconductor substrate 20) on which the drive circuit of the inverter INV according to the present embodiment is mounted. In FIG. 9, the same reference numerals are given for the sake of convenience for those corresponding to the members shown in FIG. 2.

  As shown in the figure, in this embodiment, the power card PCp of the upper arm and the power card PCn of the corresponding lower arm are parallel to each other and only a part of the line segments connected by the terminals of each power card PC #. Are placed adjacent to each other.

The same guide connector 30 is used for the upper arm power card PCp and the corresponding lower arm power card PCn.
<Seventh Embodiment>
Hereinafter, the seventh embodiment will be described with reference to the drawings with a focus on differences from the first embodiment.

  FIG. 10 shows a configuration of the guide connector 30 according to the present embodiment. Note that, in FIG. 10, the same reference numerals are assigned for convenience to those corresponding to the members shown in FIG.

As shown in the drawing, in the present embodiment, a thin portion 30b that is thin is provided in a portion of the main body 30a of the guide connector 30 where the hole 32 is not formed. According to such a configuration, it is possible to reduce restrictions on the height of electronic components mounted on the back surface side (power card PC # side) of the semiconductor substrate 20.
<Eighth Embodiment>
Hereinafter, the eighth embodiment will be described with reference to the drawings with a focus on differences from the first embodiment.

  FIG. 11 shows a configuration of the guide connector 30 according to the present embodiment. Note that, in FIG. 11, the same reference numerals are given for convenience to those corresponding to the members shown in FIG.

As illustrated, in the present embodiment, the guide connector 30 is provided with a positioning boss 36. Then, by inserting the positioning boss 36 into the boss hole 20a formed in the semiconductor substrate 20, the guide connector 30 can be easily arranged at an appropriate position. Here, the positioning boss 36 is formed of an insulating material such as resin. The positioning boss 36 is coupled to a region between the pair of power cards PCp and PCn in the main body 30a. For this reason, since the formation part of the boss hole 20a is originally a part that becomes the insulating region IA between the upper and lower arms, the mounting area is not reduced due to the formation of the boss hole 20a.
<Other embodiments>
Each of the above embodiments may be modified as follows.

“About High Voltage and Low Voltage Systems”
It is not restricted to the structure which insulates between these. For example, when a high voltage battery 12 having a terminal voltage of about 70 V is adopted, the system including the high voltage battery 12 and the system including the control device 18 can be made non-insulated. However, even in this case, for example, the potential may be different between the switching element S ¥ p of the upper arm and the switching element S ¥ n of the lower arm, and thus there is a demand for ensuring a certain creepage distance. For this reason, it is effective to apply the present invention in which a projection surface onto the guide connector 30 in a space provided to ensure a creepage distance or the like is an adsorption surface when the guide connector 30 is mounted. In addition, as shown in FIG. 3 above, it is essential that a certain amount of space is generated between the power card PCp of the upper arm and the power card PCn of the lower arm due to restrictions on the arrangement on the cooling device 40. In the guide connector 30, the surface that becomes the suction surface at the time of mounting is used as a projection surface onto the guide connector 30 with the above-described spacing, so that the semiconductor substrate 20 can be prevented from being enlarged due to the provision of the guide connector 30. However, even if the cooling device 40 is not provided, due to the thickness of the thick portion of the power card PC #, for example, the terminals of the power card PCp of the upper arm and the terminals of the power card PCn of the lower arm If a certain amount of space is generated at the location of the semiconductor substrate 20, it is effective to use the projection surface on the guide connector 30 with this space as the suction surface during mounting.

“Switching elements with the same leg and arm”
In the fifth embodiment (FIG. 7), two switching elements having the same leg and the same arm are used, but three or more switching elements may be used. Even when there are a plurality of switching elements of the same leg and the same arm, it is not essential to insert them into the same guide connector 30. For example, as in the first embodiment, the power of the upper arm The same guide connector 30 may be used for each of the card PCp and the power card PCn of the lower arm.

  However, the present invention is not limited to this. For example, all switching elements of the same phase (leg) may be inserted into the same connector.

  In the fifth embodiment (FIG. 8), instead of inserting the same leg and the same arm for each switching element into the same guide connector 30, for example, the switching element Sup and the V phase of the U-phase upper arm The upper arm switching element Svp may be inserted into the same guide connector 30.

“About inserting the switching elements of the upper and lower arms into a single connector”
In the sixth embodiment (FIG. 9), the switching elements S ¥ p and S ¥ n having the same phase are inserted into the same guide connector 30, but this is not essential. For example, the switching element Sup of the U-phase upper arm and the switching element Svn of the V-phase lower arm may be inserted into the same guide connector 30.

"Fixing member (34)"
It is not essential that the guide connector 30 is provided in the short direction, and the guide connector 30 may be provided in the long direction. Furthermore, you may make it provide a fixing member in the position of the positioning boss | hub 36 of the said 8th Embodiment (FIG. 11).

"About storage means (12)"
Not only the secondary battery (high voltage battery 12) but also a fuel cell, for example.

"About power conversion circuit (INV)"
It is not limited to the inverter INV. For example, the present invention may be applied to a configuration in which a step-up / step-down chopper circuit is interposed between the high-voltage battery 12 and the inverter INV and at the time of connection of switching elements constituting the step-up / step-down chopper circuit.

"About switching elements"
For example, a MOS field effect transistor may be used instead of the IGBT. Even in this case, since the flow path is opened and closed by the potential difference between the reference terminal (source) and the open / close control terminal (gate) of the current flow paths (source and drain), the reference terminal and An open / close control terminal is connected to the semiconductor substrate 20 side. Therefore, it is effective to guide these terminals to the semiconductor substrate 20 using a guide connector.

  The switching element is not limited to one that is modularized together with detection means (temperature sensitive diode) for detecting the state.

  INV: Inverter (one embodiment of power conversion circuit), S ¥ #: Switching element, DU: Drive unit.

Claims (13)

A plurality of switching elements (S ¥ #; ¥ = u, v, w; # = p, n) constituting the power conversion circuit (INV);
An electronic component (DU) to which a terminal of the switching element is electrically connected;
A substrate (20) on which the electronic component is mounted;
A connector (30) provided on the substrate;
With
Two or more terminals of the switching element are inserted in the single connector ,
The connector includes a fixing member (34) for fixing the connector to the substrate,
A portion of the connector other than the fixing member is disposed away from the substrate, and an electronic component is formed between the portion of the connector other than the fixing member and the substrate. Power conversion device. The power conversion circuit is interposed between a rotating machine (10) as a vehicle-mounted main machine and storage means (12) for storing energy supplied to the rotating machine,
The power converter according to claim 1, wherein the two or more switching elements into which the terminals are inserted into a single connector can have different potentials. The power conversion circuit includes an upper arm switching element and a lower arm switching element,
The power converter according to claim 2, wherein the two or more switching elements into which the terminals are inserted into a single connector include a switching element of the upper arm and a switching element of the lower arm. .   Of the substrate, a slit (Sl) is provided between a terminal of the switching element of the upper arm and a terminal of the switching element of the lower arm inserted into the single connector. The power conversion device according to claim 3. The power conversion circuit is interposed between a rotating machine as an in-vehicle main machine and a storage unit that stores energy supplied to the rotating machine, and includes an upper arm switching element and a lower arm switching element. With multiple legs
The two or more switching elements into which the terminals are inserted into a single connector are provided with different legs for either the switching element of the upper arm or the switching element of the lower arm. The power converter according to claim 1, wherein   The power conversion according to claim 5, wherein the two or more switching elements into which the terminals are inserted into the single connector are switching elements of an upper arm that is opened / closed by different operation signals. apparatus.   The power converter according to claim 6, wherein a slit is formed between the terminals inserted into the single connector among the switching elements different from each other. The power conversion circuit includes a plurality of switching elements that are opened and closed by the same operation signal,
6. The power converter according to claim 5, wherein the two or more switching elements into which the terminals are inserted into the single connector are opened / closed by the same operation signal.   The power conversion device according to claim 8, wherein the switching element is cooled by a cooling device. A portion of the connector other than the fixing member and a portion that is not a portion into which the terminal of the switching element is inserted is provided with a portion that is thinner than the other portions. The power converter of any one of Claims 1-9 . The said connector is provided with the positioning boss | hub (36), The power converter device of any one of Claims 1-10 characterized by the above-mentioned. The power conversion device according to any one of claims 1 to 11 , wherein a terminal inserted into the connector includes an open / close control terminal for performing open / close control on a flow path of the switching element. The switching element is modularized with detection means for detecting the state of the switching element,
The power converter according to claim 12 , wherein a terminal inserted into the connector includes a terminal of the detection unit.

Images