JP4708449B2 - ヘッド駆動制御方法および表面実装装置 - Google Patents

ヘッド駆動制御方法および表面実装装置 Download PDF

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JP4708449B2
JP4708449B2 JP2008070939A JP2008070939A JP4708449B2 JP 4708449 B2 JP4708449 B2 JP 4708449B2 JP 2008070939 A JP2008070939 A JP 2008070939A JP 2008070939 A JP2008070939 A JP 2008070939A JP 4708449 B2 JP4708449 B2 JP 4708449B2
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component
time
motor
value
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JP2009231303A (ja
JP2009231303A5 (enExample
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亮介 中村
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Yamaha Motor Co Ltd
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Yamaha Motor Co Ltd
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JP2008070939A 2008-03-19 2008-03-19 ヘッド駆動制御方法および表面実装装置 Active JP4708449B2 (ja)

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JP2008070939A JP4708449B2 (ja) 2008-03-19 2008-03-19 ヘッド駆動制御方法および表面実装装置

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JP2008070939A JP4708449B2 (ja) 2008-03-19 2008-03-19 ヘッド駆動制御方法および表面実装装置

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JP2009231303A JP2009231303A (ja) 2009-10-08
JP2009231303A5 JP2009231303A5 (enExample) 2011-01-13
JP4708449B2 true JP4708449B2 (ja) 2011-06-22

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5488427B2 (ja) * 2010-11-26 2014-05-14 パナソニック株式会社 部品実装装置および部品実装装置におけるモータ制御方法
JP5774971B2 (ja) 2011-11-25 2015-09-09 ヤマハ発動機株式会社 表面実装装置およびヘッド駆動制御方法
JP5828141B2 (ja) * 2011-11-30 2015-12-02 パナソニックＩｐマネジメント株式会社 部品挿入装置および部品挿入検出方法
EP2981163B1 (en) * 2013-03-26 2020-02-26 FUJI Corporation Electronic circuit component mounting system
JP6574953B2 (ja) * 2014-09-30 2019-09-18 ハンファ精密機械株式会社 部品吸着ヘッド
JP6713060B2 (ja) * 2016-12-14 2020-06-24 株式会社Ｆｕｊｉ 部品装着機
JP6967696B2 (ja) * 2017-09-25 2021-11-17 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法
JP6967695B2 (ja) * 2017-09-25 2021-11-17 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法
JP7050219B2 (ja) * 2017-09-25 2022-04-08 パナソニックＩｐマネジメント株式会社 部品搭載装置および部品搭載方法
WO2020115912A1 (ja) * 2018-12-07 2020-06-11 株式会社Ｆｕｊｉ ユニット管理装置およびユニット管理方法
JP2023101842A (ja) * 2022-01-11 2023-07-24 パナソニックＩｐマネジメント株式会社 部品装着装置および部品装着方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000269692A (ja) * 1999-03-16 2000-09-29 Matsushita Electric Ind Co Ltd 基板の反り検出方法とこれを用いた部品装着方法および装置
JP3578118B2 (ja) * 2001-07-17 2004-10-20 松下電器産業株式会社 ボンディング装置およびボンディング方法
JP4359545B2 (ja) * 2004-09-01 2009-11-04 パナソニック株式会社 電子部品実装装置のコンタクト荷重制御方法

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