JP4706175B2 - ペースト付与装置および電子部品の製造方法 - Google Patents

ペースト付与装置および電子部品の製造方法 Download PDF

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Publication number
JP4706175B2
JP4706175B2 JP2004051284A JP2004051284A JP4706175B2 JP 4706175 B2 JP4706175 B2 JP 4706175B2 JP 2004051284 A JP2004051284 A JP 2004051284A JP 2004051284 A JP2004051284 A JP 2004051284A JP 4706175 B2 JP4706175 B2 JP 4706175B2
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paste
slit
width
electronic component
penetrating region
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JP2004051284A
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Japanese (ja)
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JP2005238285A (ja
JP2005238285A5 (https=
Inventor
良樹 中川
政明 谷口
慶雄 川口
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Priority to JP2004051284A priority Critical patent/JP4706175B2/ja
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JP2004051284A 2004-02-26 2004-02-26 ペースト付与装置および電子部品の製造方法 Expired - Lifetime JP4706175B2 (ja)

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JP2004051284A JP4706175B2 (ja) 2004-02-26 2004-02-26 ペースト付与装置および電子部品の製造方法

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JP2004051284A JP4706175B2 (ja) 2004-02-26 2004-02-26 ペースト付与装置および電子部品の製造方法

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JP2005238285A JP2005238285A (ja) 2005-09-08
JP2005238285A5 JP2005238285A5 (https=) 2007-04-05
JP4706175B2 true JP4706175B2 (ja) 2011-06-22

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JP2004051284A Expired - Lifetime JP4706175B2 (ja) 2004-02-26 2004-02-26 ペースト付与装置および電子部品の製造方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130052875A (ko) * 2011-11-14 2013-05-23 삼성전기주식회사 적층 세라믹 전자부품 및 그 제조방법
KR20130085646A (ko) * 2012-01-20 2013-07-30 삼성전기주식회사 용융솔더 사출헤드
JP5689143B2 (ja) * 2013-03-19 2015-03-25 太陽誘電株式会社 低背型積層セラミックコンデンサ
JP7238607B2 (ja) * 2019-05-31 2023-03-14 株式会社村田製作所 電子部品の製造方法および導電性ペースト塗布装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0782974B2 (ja) * 1989-07-31 1995-09-06 株式会社村田製作所 電子部品の電極形成方法
JPH09162084A (ja) * 1995-12-12 1997-06-20 Murata Mfg Co Ltd 電子部品の製造方法
JP3164103B2 (ja) * 1999-05-27 2001-05-08 株式会社村田製作所 電子部品の製造方法および製造装置
JP3918083B2 (ja) * 2000-11-13 2007-05-23 株式会社村田製作所 電子部品の製造装置および電子部品の製造方法
JP3890920B2 (ja) * 2001-05-17 2007-03-07 株式会社村田製作所 電子部品へのペースト付与装置およびペースト付与方法

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JP2005238285A (ja) 2005-09-08

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