JP4700686B2 - 電子部品の実装装置及び実装方法 - Google Patents
電子部品の実装装置及び実装方法 Download PDFInfo
- Publication number
- JP4700686B2 JP4700686B2 JP2007510334A JP2007510334A JP4700686B2 JP 4700686 B2 JP4700686 B2 JP 4700686B2 JP 2007510334 A JP2007510334 A JP 2007510334A JP 2007510334 A JP2007510334 A JP 2007510334A JP 4700686 B2 JP4700686 B2 JP 4700686B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- tape
- spacer
- reel
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
- B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
- B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H18/00—Winding webs
- B65H18/08—Web-winding mechanisms
- B65H18/10—Mechanisms in which power is applied to web-roll spindle
- B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
- B65H23/02—Registering, tensioning, smoothing or guiding webs transversely
- B65H23/032—Controlling transverse register of web
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2301/00—Handling processes for sheets or webs
- B65H2301/40—Type of handling process
- B65H2301/41—Winding, unwinding
- B65H2301/412—Roll
- B65H2301/4127—Roll with interleaf layer, e.g. liner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/19—Specific article or web
- B65H2701/1942—Web supporting regularly spaced non-adhesive articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Winding Of Webs (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007510334A JP4700686B2 (ja) | 2005-03-28 | 2006-02-15 | 電子部品の実装装置及び実装方法 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005091976 | 2005-03-28 | ||
JP2005091976 | 2005-03-28 | ||
JP2007510334A JP4700686B2 (ja) | 2005-03-28 | 2006-02-15 | 電子部品の実装装置及び実装方法 |
PCT/JP2006/302656 WO2006103839A1 (ja) | 2005-03-28 | 2006-02-15 | 電子部品の実装装置及び実装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2006103839A1 JPWO2006103839A1 (ja) | 2008-09-04 |
JP4700686B2 true JP4700686B2 (ja) | 2011-06-15 |
Family
ID=37053108
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007510334A Expired - Fee Related JP4700686B2 (ja) | 2005-03-28 | 2006-02-15 | 電子部品の実装装置及び実装方法 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4700686B2 (ko) |
KR (1) | KR101095882B1 (ko) |
CN (1) | CN100533700C (ko) |
TW (1) | TWI385737B (ko) |
WO (1) | WO2006103839A1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5059693B2 (ja) * | 2008-06-06 | 2012-10-24 | Juki株式会社 | 部品供給装置 |
US20150076273A1 (en) * | 2012-05-31 | 2015-03-19 | Hewlett-Packard Development Company, L.P. | Spooling process films |
JP2015532786A (ja) * | 2012-08-31 | 2015-11-12 | ファン、ヨン スHWANG, Young Soo | 自動部品露出機器を含むキャリアテープの自動供給装置 |
JP6239362B2 (ja) * | 2013-12-05 | 2017-11-29 | Juki株式会社 | 電子部品供給装置 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01187161A (ja) * | 1988-01-19 | 1989-07-26 | Toshiba Corp | キャリアテープの定量搬送装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06244246A (ja) * | 1993-02-13 | 1994-09-02 | Shibuya Kogyo Co Ltd | ボンディング装置 |
JP3223780B2 (ja) * | 1996-01-19 | 2001-10-29 | 松下電器産業株式会社 | チップの実装装置 |
JP2001127086A (ja) * | 1999-10-26 | 2001-05-11 | Hitachi Cable Ltd | 半導体装置の製造方法 |
-
2006
- 2006-02-15 WO PCT/JP2006/302656 patent/WO2006103839A1/ja active Application Filing
- 2006-02-15 JP JP2007510334A patent/JP4700686B2/ja not_active Expired - Fee Related
- 2006-02-15 KR KR1020077019827A patent/KR101095882B1/ko not_active IP Right Cessation
- 2006-02-15 CN CNB2006800066178A patent/CN100533700C/zh not_active Expired - Fee Related
- 2006-03-08 TW TW095107743A patent/TWI385737B/zh not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01187161A (ja) * | 1988-01-19 | 1989-07-26 | Toshiba Corp | キャリアテープの定量搬送装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2006103839A1 (ja) | 2006-10-05 |
CN101133485A (zh) | 2008-02-27 |
TW200711011A (en) | 2007-03-16 |
JPWO2006103839A1 (ja) | 2008-09-04 |
TWI385737B (zh) | 2013-02-11 |
CN100533700C (zh) | 2009-08-26 |
KR101095882B1 (ko) | 2011-12-21 |
KR20070100824A (ko) | 2007-10-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4700686B2 (ja) | 電子部品の実装装置及び実装方法 | |
JP4871769B2 (ja) | ロール材巻取り装置 | |
JP5350615B2 (ja) | 電子部品の打ち抜き装置及び打ち抜き方法 | |
JP4781788B2 (ja) | ワイヤ送給装置 | |
JP2009004652A (ja) | 電子部品の実装装置及び実装方法 | |
JP2007311497A (ja) | プリント基板保持装置 | |
WO2004053974A1 (ja) | 電子部品実装用フィルムキャリアテープの処理装置におけるスペーサの巻き取り装置および電子部品実装用フィルムキャリアテープの処理装置におけるスペーサの巻き取り方法 | |
JP4454504B2 (ja) | フィルム搬送装置 | |
JP3662786B2 (ja) | レーザ加工装置 | |
JP2009137705A (ja) | テープ部材搬送装置 | |
KR20050038450A (ko) | 커버레이 필름 펀칭장치 | |
JP4700579B2 (ja) | 電子部品の実装装置及び実装方法 | |
JP2006168929A (ja) | 剥離装置及び粘着テープの貼着装置 | |
JP4387985B2 (ja) | テープ状部品の巻き取り装置、巻き取り方法及び電子部品の実装装置 | |
JP5148309B2 (ja) | 電子部品の実装装置及び実装方法 | |
JP7088581B1 (ja) | 電子部品の製造方法および電子部品の製造装置 | |
JP7397765B2 (ja) | キャリアテープの巻取方法 | |
JP3881204B2 (ja) | 電子部品実装用フィルムキャリアテープの搬送装置および電子部品実装用フィルムキャリアテープの搬送方法 | |
JP2007335461A (ja) | 基板搬送方法および基板搬送装置 | |
JP2996088B2 (ja) | 電線送給装置およびそれに用いる弛み量制御ユニット | |
JP5078787B2 (ja) | 電子部品の実装装置及び実装方法 | |
KR100861506B1 (ko) | 필름 이송장치 | |
CN114665231A (zh) | 用于制造二次电池引线接头的金属引线退绕装置 | |
JP2000165090A (ja) | テープ送り装置 | |
JPH07283270A (ja) | 電子部品の供給装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20080812 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20101221 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20110202 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20110301 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20110304 |
|
LAPS | Cancellation because of no payment of annual fees |