JP4700686B2 - 電子部品の実装装置及び実装方法 - Google Patents

電子部品の実装装置及び実装方法 Download PDF

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Publication number
JP4700686B2
JP4700686B2 JP2007510334A JP2007510334A JP4700686B2 JP 4700686 B2 JP4700686 B2 JP 4700686B2 JP 2007510334 A JP2007510334 A JP 2007510334A JP 2007510334 A JP2007510334 A JP 2007510334A JP 4700686 B2 JP4700686 B2 JP 4700686B2
Authority
JP
Japan
Prior art keywords
carrier tape
tape
spacer
reel
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007510334A
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English (en)
Japanese (ja)
Other versions
JPWO2006103839A1 (ja
Inventor
忠 伊東
誠 太田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2007510334A priority Critical patent/JP4700686B2/ja
Publication of JPWO2006103839A1 publication Critical patent/JPWO2006103839A1/ja
Application granted granted Critical
Publication of JP4700686B2 publication Critical patent/JP4700686B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/02—Registering, tensioning, smoothing or guiding webs transversely
    • B65H23/032—Controlling transverse register of web
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00—Handling processes for sheets or webs
    • B65H2301/40—Type of handling process
    • B65H2301/41—Winding, unwinding
    • B65H2301/412—Roll
    • B65H2301/4127—Roll with interleaf layer, e.g. liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/19—Specific article or web
    • B65H2701/1942—Web supporting regularly spaced non-adhesive articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Winding Of Webs (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
JP2007510334A 2005-03-28 2006-02-15 電子部品の実装装置及び実装方法 Expired - Fee Related JP4700686B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007510334A JP4700686B2 (ja) 2005-03-28 2006-02-15 電子部品の実装装置及び実装方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005091976 2005-03-28
JP2005091976 2005-03-28
JP2007510334A JP4700686B2 (ja) 2005-03-28 2006-02-15 電子部品の実装装置及び実装方法
PCT/JP2006/302656 WO2006103839A1 (ja) 2005-03-28 2006-02-15 電子部品の実装装置及び実装方法

Publications (2)

Publication Number Publication Date
JPWO2006103839A1 JPWO2006103839A1 (ja) 2008-09-04
JP4700686B2 true JP4700686B2 (ja) 2011-06-15

Family

ID=37053108

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007510334A Expired - Fee Related JP4700686B2 (ja) 2005-03-28 2006-02-15 電子部品の実装装置及び実装方法

Country Status (5)

Country Link
JP (1) JP4700686B2 (ko)
KR (1) KR101095882B1 (ko)
CN (1) CN100533700C (ko)
TW (1) TWI385737B (ko)
WO (1) WO2006103839A1 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5059693B2 (ja) * 2008-06-06 2012-10-24 Ｊｕｋｉ株式会社 部品供給装置
US20150076273A1 (en) * 2012-05-31 2015-03-19 Hewlett-Packard Development Company, L.P. Spooling process films
JP2015532786A (ja) * 2012-08-31 2015-11-12 ファン、ヨン スHWANG, Young Soo 自動部品露出機器を含むキャリアテープの自動供給装置
JP6239362B2 (ja) * 2013-12-05 2017-11-29 Juki株式会社 電子部品供給装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187161A (ja) * 1988-01-19 1989-07-26 Toshiba Corp キャリアテープの定量搬送装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244246A (ja) * 1993-02-13 1994-09-02 Shibuya Kogyo Co Ltd ボンディング装置
JP3223780B2 (ja) * 1996-01-19 2001-10-29 松下電器産業株式会社 チップの実装装置
JP2001127086A (ja) * 1999-10-26 2001-05-11 Hitachi Cable Ltd 半導体装置の製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01187161A (ja) * 1988-01-19 1989-07-26 Toshiba Corp キャリアテープの定量搬送装置

Also Published As

Publication number Publication date
WO2006103839A1 (ja) 2006-10-05
CN101133485A (zh) 2008-02-27
TW200711011A (en) 2007-03-16
JPWO2006103839A1 (ja) 2008-09-04
TWI385737B (zh) 2013-02-11
CN100533700C (zh) 2009-08-26
KR101095882B1 (ko) 2011-12-21
KR20070100824A (ko) 2007-10-11

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