JP4700579B2 - Electronic component mounting apparatus and mounting method - Google Patents

Description

  The present invention relates to a mounting apparatus and a mounting method for mounting an electronic component on a carrier tape that is fed from a supply reel and wound on a take-up reel.

  For example, in TAB (Tape Automated Bonding), COF (Chip On Film), etc., an electronic component such as a semiconductor chip is mounted on a terminal portion formed on a film-like carrier tape, which is a tape-like component.

  Generally, a mounting apparatus for mounting an electronic component on the carrier tape has a supply reel around which the carrier tape is wound. On the carrier tape, a device hole and a lead provided with one end projecting from the device hole are formed. Therefore, the carrier tape is wound around the supply reel so as to overlap the spacer tape for protecting the lead.

  The carrier tape fed out from the supply reel is guided to the transport rail. A mounting means having a mounting stage and a mounting tool opposed to the mounting stage is provided in the middle of the transport rail, and an electronic component is mounted on the carrier tape by the mounting means. The carrier tape on which the electronic component is mounted by the mounting means is wound around a take-up reel.

  When the electronic component is mounted on the carrier tape, the bumps provided on the electronic component and the terminal portion that is the mounting position of the electronic component formed on the carrier tape must be positioned with high accuracy. Patent Document 1 discloses that the mounting position of the carrier tape is positioned with respect to the mounting means on the basis of the perforations formed on the carrier tape.

  Recently, carrier tapes tend to be thinner. When the thickness of the carrier tape is reduced, the carrier tape stretched between the supply reel and the take-up reel is inevitably wrinkled or unevenly deformed, thereby causing slack. Moreover, the thinned carrier tape may elongate over time due to changes in temperature, humidity, and the like.

Therefore, prior to operating the mounting apparatus, it is required to remove the slack of the carrier tape and position the mounting position and the mounting means.
JP 2004-71773 A

  Incidentally, in Patent Document 1, when mounting the electronic component by pitch-feeding the carrier tape stretched between the supply reel and the take-up reel, the perforation formed on the carrier tape is used as a reference. It has been shown to increase accuracy.

  However, Patent Document 1 does not show that the slack generated in the carrier tape is removed prior to the start of operation of the mounting apparatus. Accordingly, when mounting the electronic component by pitch feeding the carrier tape based on the perforation formed on the carrier tape, the slack generated in the carrier tape is extended, and the mounting accuracy of the electronic component is reduced by the elongation. It turns out that.

  If the positioning accuracy when the carrier tape is first pitch-fed decreases, then the carrier tape will be pitch-fed in the same state, and therefore the positioning accuracy decline caused by the first slackening will continue. Will do.

  According to the present invention, first, the mounting position of the carrier tape and the mounting means are positioned in a state in which the slack generated in the carrier tape is surely removed, so that the mounting accuracy of the electronic component can be improved. To provide a mounting apparatus and a mounting method.

The present invention is a mounting apparatus for mounting electronic components on a carrier tape,
A supply reel wound with the carrier tape;
Mounting means for mounting the electronic component on the carrier tape fed out from the supply reel;
A take-up reel that winds up the carrier tape on which electronic components are mounted by this mounting means;
A drive roller that is provided downstream of the mounting means in the feeding direction of the carrier tape and that feeds the carrier tape on which electronic components are mounted by the mounting means;
A back tension roller that is provided upstream of the mounting means in the feeding direction of the carrier tape and applies tension to the carrier tape that is fed by the driving roller;
A sensor for detecting perforations formed at both ends in the width direction of the carrier tape;
An imaging camera for imaging a recognition pattern provided on the carrier tape;
Before mounting the electronic component on the carrier tape, after the Kiyariatepu the recognition pattern was rewound by the supply reel to a state out of the field of view of the imaging camera, the Kiyariatepu sending predetermined distance by the drive roller After removing the deformation of the carrier tape, the carrier tape is positioned at the mounting position based on the imaging of the recognition pattern by the imaging camera and the electronic component is mounted. Thereafter, the sensor detects the perforation. An electronic component mounting apparatus comprising: a control means for mounting the electronic component by positioning the carrier tape at a mounting position .

  The back tension roller has a lower back tension roller that contacts the lower surface of the carrier tape and an upper back tension roller that contacts the upper surface, and at least one of the back tension rollers can be opened and closed in a direction away from the carrier tape. It is preferable that

  The back tension roller is preferably driven to open and close after positioning the carrier tape at the mounting position.

  The positioning of the carrier tape by the control means is preferably performed before the electronic component is first mounted on the carrier tape.

According to the present invention, a carrier tape stretched between a supply reel and a take-up reel is tensioned by a back tension roller and fed by a predetermined pitch by a feed roller, and an electronic device is mounted on the carrier tape mounting position by a mounting means. A mounting method for mounting a component,
Detecting perforations formed on the carrier tape by a sensor, and feeding the carrier tape by a predetermined pitch based on the detection;
Imaging a recognition pattern formed on the carrier tape pitch-fed based on detection of perforation by the sensor with an imaging camera, and positioning the mounting means with respect to the carrier tape based on the imaging ,
Before mounting the electronic component on the carrier tape, the carrier tape is rewound by the supply reel until the recognition pattern deviates from the field of view of the imaging camera, and then the carrier tape is fed by a predetermined distance by the driving roller. After removing the deformation of the carrier tape, the carrier tape is positioned at the mounting position based on the imaging of the recognition pattern by the imaging camera and the electronic component is mounted. Thereafter, the sensor detects the perforation. An electronic component mounting method is characterized in that the electronic tape is mounted by positioning the carrier tape at a mounting position .

  The carrier tape is preferably rewound by the supply reel to a position where the recognition pattern deviates from the field of view of the imaging camera before the mounting means is first positioned at the mounting position of the carrier tape.

  After returning the carrier tape to the supply reel side until the recognition pattern deviates from the field of view of the imaging camera, the carrier tape is placed within the field of view of the imaging camera based on detection of perforation by the sensor. Preferably, the recognition pattern is imaged by the imaging camera after being positioned, and the mounting means is positioned at the mounting position of the carrier tape based on the imaging.

  According to this invention, after the carrier tape is largely rewound to a position where the recognition pattern is out of the field of view of the imaging camera, the carrier tape is conveyed in the winding direction to correct the positional deviation of the carrier tape based on the imaging of the imaging camera. Position the mounting means.

  Therefore, the looseness can be surely removed by rewinding and winding the carrier tape, and the carrier tape and the mounting means can be accurately positioned based on the imaging of the imaging camera.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 shows a mounting apparatus for mounting electronic components on a carrier tape 1. This mounting apparatus has an apparatus main body 2, which is provided with a loader section 3 at one end, an unloader section 4 at the other end, and a mounting section 5 at the center.

  The loader unit 3 has a supply reel 7 around which the carrier tape 1 is wound. As shown in FIG. 2, the carrier tape 1 is formed with terminal portions 8 having device holes 8a and leads 8b provided with one ends protruding from the device holes 8a at predetermined intervals. The carrier tape 1 is wound around the supply reel 7 so as to overlap with the spacer tape 9 a that protects the leads 8 b of the terminal portion 8.

The widthwise ends of the Kiyariatepu 1 have been rectangular shape of the perforations 11 at a predetermined pitch G with respect to the longitudinal direction is formed, and formed at twice the spacing of the pitch G of the device hole 8a is perforation 11 Has been. Then, the electronic component 16 indicated by a chain line in FIG. 2 is positioned and mounted on the terminal portion 8 as will be described later. That is, the terminal portion 8 is a mounting position of the electronic component 16.

  The carrier tape 1 fed out from the supply reel 7 is guided to the conveyance rail 13 and is taken up by the take-up reel 23 described later from the conveyance rail 13. The transport rail 13 is provided from the loader unit 3 to the unloader unit 4.

  The carrier tape 1 is fed out from the supply reel 7 so that a slack is generated between the supply reel 7 and one end of the transport rail 13. The amount of sag of the carrier tape 1 is detected and controlled by the first lower sensor 15a and the first upper sensor 15b.

That is, when the amount of sag of the carrier tape 1 increases and the first lower sensor 15a detects the sag, the feeding of the carrier tape 1 by the supply reel 7 is stopped. When the sag of the carrier tape 1 is reduced and the sag is not detected by the first upper sensor 15b, the carrier tape 1 is fed out by the supply reel 7. Thereby, the amount of sag of the carrier tape 1 is controlled to be within a predetermined range.
Note that the spacer tape 9 a fed out together with the carrier tape 1 from the supply reel 7 is taken up by the spacer tape take-up reel 21.

  In the mounting portion 5, the electronic component 16 such as a semiconductor chip is mounted on the carrier tape 1 as shown in FIG. The mounting unit 5 includes a mounting stage 17 constituting the mounting means 5A, a mounting tool 18, and a pair of upper and lower clampers 18a that are driven to open and close. The mounting stage 17 is driven in the X, Y, and θ directions by the stage driving mechanism 19, and the mounting tool 18 is driven in the X, Y, θ, and Z directions by the tool driving mechanism 20.

  When the electronic component 16 is supplied onto the mounting stage 17, the mounting stage 17 is positioned below the terminal portion 8 of the carrier tape 1 as described later. Next, after the peripheral portion of the terminal portion 8 is clamped by the clamper 18a, the mounting tool 18 is driven in the downward direction. Thereby, as shown in FIG. 3, the lead 8 b of the terminal portion 8 is bent and connected to the bump 16 a of the electronic component 16.

  A pair of drive rollers 31 are disposed at both ends in the width direction of the carrier tape 1 at the end of the transport rail 13 on the unloader unit 4 side. The pair of drive rollers 31 includes an upper drive roller 31a and a lower drive roller 31b that sandwich both ends of the carrier tape 1 in the width direction. The upper drive roller 31a and the lower drive roller 31b are rotationally driven by a roller drive source 32, whereby the carrier tape 1 is conveyed from the loader unit 3 side to the unloader unit 4 side.

  Back tension rollers 34 are disposed at both ends of the transport rail 13 on the loader unit 3 side and at both ends in the width direction of the carrier tape 1. The pair of back tension rollers 34 includes an upper tension roller 34a and a lower tension roller 34b, and these tension rollers 34a and 34b sandwich both ends of the carrier tape 1 in the width direction.

  The pair of upper tension rollers 34 a are provided so that one end of the upper tension roller 34 a rotates at a predetermined rotational resistance to the other end of the rotating body 37 supported by the rotating shaft 36. The rotating body 37 is urged in a downward direction by a spring 38, and is driven in an upward direction against the urging force of the spring 38 by a cylinder 39.

Thereby, the back tension roller 34 applies a predetermined tension to the carrier tape 1 conveyed by the drive roller 31. When the rotating body 37 is rotated in the upward direction to move the upper tension roller 34a away from the upper surface of the carrier tape 1, the tension applied to the carrier tape 1 by the back tension roller 34 is removed.
The carrier tape 1 can be fed to the supply reel 7 side by a back tension roller 34.

  A perforation sensor 41 that detects the perforation 11 of the carrier tape 1 is disposed near the drive roller 31 and upstream of the drive roller 31 in the transport direction of the carrier tape 1. The perforation sensor 41 includes a projector 41a and a light receiver 41b, and the projector 41a and the light receiver 41b are arranged to be opposed to above and below one end portion in the width direction where the perforation 11 of the carrier tape 1 is formed.

  When the carrier tape 1 is transported by the drive roller 31 and the perforation 11 of the carrier tape 1 passes through the portion facing the perforation sensor 41, the light receiver 41b of the perforation sensor 41 receives the light from the projector 41a.

  The light reception signal of the perforation sensor 41 is output to the control device 42 shown in FIG. Accordingly, the control device 42 controls the driving of the driving roller 31 so as to feed the carrier tape 1 at a distance twice the pitch G of the perforation 11.

  An imaging camera 43 is disposed near the mounting tool 18. The imaging camera 43 is preset with respect to the terminal portion 8 near the terminal portion 8 of the carrier tape 1 when the carrier tape 1 is pitch-fed and positioned based on the detection signal from the perforation sensor 41. A recognition pattern P (shown in FIG. 2) provided in the positional relationship is imaged.

  An imaging signal from the imaging camera 43 is input to the control device 42 and subjected to image processing. Based on the image processing, the mounting stage 17 and the mounting tool 18 are driven in the X, Y, and θ directions to be positioned with respect to the terminal portion 8.

  That is, the carrier tape 1 has its terminal portion 8 positioned with a predetermined accuracy based on the pitch G of the perforation 11 detected by the perforation sensor 41. Next, the mounting stage 17 and the mounting tool 18 are driven in the X and Y directions based on the imaging signal from the imaging camera 43, and the mounting stage 17 and the mounting tool 18 are positioned with higher accuracy with respect to the terminal portion 8. Is done.

  The carrier tape 1 on which the electronic component 16 is mounted and pitch-fed by the driving roller 31 is overlapped with the spacer tape 9 b supplied from the spacer tape supply reel 22 and is taken up by the take-up reel 23. As a result, the electronic component 16 mounted on the carrier tape 1 is protected by the spacer tape 9b.

  The carrier tape 1 on which the electronic component 16 is mounted and pitch-fed by the driving roller 31 has a sagging amount of the second lower sensor 24a and the second upper sensor before being wound on the take-up reel 23 on the unloader portion 4 side. 24b.

  When the second lower sensor 24a detects that the amount of sag of the carrier tape 1 exceeds a predetermined value, the take-up reel 23 is driven by the detection signal to wind the carrier tape 1 and the spacer tape 9b. Taking is started. When winding is started and the amount of sag of the carrier tape 1 on the unloader unit 4 side is reduced, and the second upper sensor 24b does not detect the carrier tape 1, the winding is stopped.

  As shown by a chain line in FIG. 1, the supply reel 7 is rotationally driven by a first drive motor 26, and the spacer tape take-up reel 21 is rotationally driven by a second drive motor 27.

  The take-up reel 23 is rotationally driven by a third drive motor 28, and the spacer tape supply reel 22 is rotationally driven by a fourth drive motor 29.

  As shown in FIG. 4, detection signals from the first lower sensor 15a, the first upper sensor 15b, the second lower sensor 24a, and the second upper sensor 24b are output to the control device 42. The control device 42 controls the driving of the first to fourth drive motors 26 to 29 based on the detection signals from the respective sensors so that the carrier tape 1 is fed out from the supply reel 7 and taken up on the take-up reel 23. .

  Further, the control device 42 controls the driving of the stage driving mechanism 19, the tool driving mechanism 20, and the roller driving source 32 that drives the driving roller 31 based on the imaging signals from the perforation sensor 33 and the imaging camera 43.

Next, a procedure for mounting the electronic component 16 on the terminal portion 8 of the carrier tape 1 by the mounting apparatus having the above configuration will be described.
When the electronic device 16 is first mounted on the terminal portion 8 of the carrier tape 1 after the mounting device is started, the mounting is performed on the terminal portion 8 of the carrier tape 1 in a state where slack due to temporal deformation of the carrier tape 1 is removed. The mounting stage 17 and the mounting tool 18 of the means 5A must be positioned.

  In this positioning, first, the carrier tape 1 fed out from the supply reel 7 is rewound by the supply reel 7. The unwinding length at that time is a state in which the recognition pattern P provided near the terminal portion 8 of the carrier tape 1 is within the visual field range S of the imaging camera 43 as shown in FIG. The recognition pattern P is recognized, and the recognition pattern P is largely rewound to a rewind position where the recognition pattern P is out of the visual field range S as shown in FIG. In FIG. 5A, the recognition pattern P is located on the driving roller 31 side, that is, on the downstream side with respect to the transport direction of the carrier tape 1 indicated by the arrow X in FIG. .

  The rewinding length of the carrier tape 1 by the supply reel 7 is L1, as shown in FIG. 5B, and L1 is a distance larger than the pitch of the perforations 11 formed on the carrier tape 1.

  Then, the control device 42 calculates the distance L1 at which the recognition pattern P is activated from the initial position B1 where the recognition pattern P is in the visual field range S to the rewind position where the recognition pattern P is out of the visual field range S.

  After the carrier tape 1 has been rewound by the length L1, the carrier tape 1 is then fed in the transport direction by the drive roller 31 as shown in FIG. The feed length L2 at this time is a length that is upstream of the center O of the field-of-view range S of the imaging camera 43 and that the recognition pattern P at a position outside the field-of-view range S of the imaging camera 43 enters the field-of-view range S again. To do.

Specifically, the distance from the rewinding position to the center O of the field of view range S of the imaging camera 43 is set so that the recognition pattern P is positioned closer to the back tension roller 34 than the center O of the field of view range S. The feed length L2 calculated by the control device 42 is set.
Note that the length L2 is indicated by the distance at which the recognition pattern P returns to the visual field range S from the position B2 out of the visual field range S in FIG.

  When the rewound carrier tape 1 is sent in the direction opposite to the rewind direction at a distance of length L2, the clamper 18a is operated to clamp the carrier tape 1. As a result, the portion of the carrier tape 1 located between the clamper 18a and the back tension roller 34 is fixed.

If the carrier tape 1 is fixed, the recognition pattern P located in the opening of the clamper 18a is imaged by the imaging camera 43, and the control device 42 uses the imaging signal to determine the visual field center O of the imaging camera 43 and the recognition pattern P. And the clamper 18a is opened, the carrier tape 1 is fed in the X direction, and the terminal portion 8 of the carrier tape 1 is corrected in position.

When the position of the terminal portion 8 of the carrier tape 1 is corrected, the clamper 18 is clamped by driving the clamper 18a in the closing direction. After clamping, the rotating body 37 of the back tension roller 34 is rotated in the upward direction, and the upper tension roller 34a is instantaneously separated from the upper surface of the carrier tape 1.

  As a result, the carrier tape 1 is conveyed by the pair of left and right tension rollers 34a and 34b, so that the carrier tape 1 is caused by the stress applied by the parallelism and flatness errors of the pair of left and right upper and lower tension rollers 34a and 34b. Even if deformation occurs due to depression in the width direction or pulling, the deformation is removed. When the deformation of the carrier tape 1 is removed, the upper tension roller 34a is immediately returned to the original position, and the carrier tape 1 is held and fixed.

  If the deformation generated in the carrier tape 1 by the back tension roller 34 is removed, the electronic component 16 is mounted on the carrier tape 1. In addition, since the position correction of the carrier tape 1 is performed by being conveyed by the driving roller 31, it is inevitable that a minute positional deviation occurs due to the conveyance accuracy.

  Therefore, first, the recognition pattern P of the carrier tape 1 is recognized by the imaging camera 43, and the amount of positional deviation between the recognition pattern P and the center O of the imaging camera 43 is calculated based on the recognition. The mounting stage 17 and the mounting tool 18 are subjected to position correction with respect to the terminal portion 8 of the carrier tape 1 based on the amount of positional deviation. Then, after the position correction, the electronic component 16 is mounted on the carrier tape 1.

  After the electronic component 16 is mounted, the clamper 18a is opened, the driving roller 31 is driven, and the carrier tape 1 is conveyed. The transport distance of the carrier tape 1 at this time is determined based on the pitch G of the perforations 11 formed on the carrier tape 1 detected by the perforation sensor 41.

  Thereafter, the carrier tape 1 is pitch-fed based on the pitch G of the perforations 11 formed on the carrier tape 1 and the terminal portion 8 is positioned with respect to the mounting means 5A. Is implemented.

  As described above, before the electronic component 16 is first mounted on the terminal portion 8 of the carrier tape 1, the carrier tape 1 is largely rewound to a position where the recognition pattern P deviates from the visual field range S of the imaging camera 43, and then the recognition is performed. The pattern P is sent in the conveyance direction at a length L2 that reenters the field of view S of the imaging camera 43.

  Therefore, the carrier tape 1 can be fed with a sufficient length L2 by the drive roller 31 in the conveying direction in a state in which the tension is applied by the back tension roller 34, so that the slack that has occurred in the carrier tape 1 can be reliably ensured. In the removed state, the mounting stage 17 and the mounting tool 18 of the mounting means 5A can be positioned with respect to the terminal portion 8 of the carrier tape 1.

  Accordingly, when the carrier tape 1 is pitch-fed next time, the slack of the carrier tape 1 does not extend and the positioning accuracy of the terminal portion 8 with respect to the mounting means 5A does not deteriorate. It becomes possible to carry out with high accuracy.

  Note that since the imaging camera 43 has a high magnification according to the mounting accuracy of the electronic component 16, the visual field range S is very narrow. Therefore, if the length of rewinding of the carrier tape 1 is set so that the recognition pattern P does not deviate from the visual field range S, the length becomes very small. The feeding length is also shortened, and the slack generated on the carrier tape 1 may not be sufficiently removed.

  However, as described above, the carrier tape 1 is fed after being rewound by a large length L1 where the recognition pattern P deviates from the visual field range S. Therefore, the slack generated in the carrier tape 1 due to a sufficient feed length. Can be reliably removed.

  In the above embodiment, when positioning the mounting means with respect to the terminal portion of the carrier tape, the carrier tape is rewound at a distance L1, and then sent at a distance L2 shorter than this distance, and then taken by the imaging camera. The carrier tape 1 is precisely positioned on the basis of this, but the distances L1 and L2 may be the same or L2 may be larger than L1. In short, the recognition pattern is obtained when the carrier tape is sent at the distance L2. It suffices to enter the upstream side of the center in the visual field range.

  Also, the upper tension roller of the back tension roller was lifted away from the carrier tape to remove the deformation that occurred in this carrier tape, but the lower tension roller was lowered, and both the upper and lower rollers were removed from the carrier tape. You may make it remove from the upper and lower surfaces of this, and the deformation | transformation which arose in this carrier tape may be removed.

  Furthermore, if at least one of the pair of upper and lower drive rollers can be driven in a direction away from the carrier tape and is separated from the carrier tape at a predetermined timing, the deformation generated on the carrier tape by the drive roller is removed. Can do.

BRIEF DESCRIPTION OF THE DRAWINGS The schematic block diagram of the mounting apparatus which shows one embodiment of this invention. The top view which shows a part of carrier tape. Explanatory drawing when mounting an electronic component on a carrier tape by a mounting means. The block diagram which shows a control system. Explanatory drawing which shows the relationship between the recognition pattern when positioning the terminal part of a carrier tape, and a mounting means, and the visual field range of an imaging camera.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Carrier tape, 7 ... Supply reel, 8 ... Terminal part (mounting position), 11 ... Perforation, 16 ... Electronic component, 17 ... Mounting stage (mounting means), 18 ... Mounting tool (mounting means), 23 ... Winding Reel, 31 ... drive roller, 41 ... perforation sensor, 42 ... control device, 43 ... imaging camera, P ... recognition pattern.

Claims (7)

A mounting device for mounting electronic components on a carrier tape,
A supply reel wound with the carrier tape;
Mounting means for mounting the electronic component on the carrier tape fed out from the supply reel;
A take-up reel that winds up the carrier tape on which electronic components are mounted by this mounting means;
A drive roller that is provided downstream of the mounting means in the feeding direction of the carrier tape and that feeds the carrier tape on which electronic components are mounted by the mounting means;
A back tension roller that is provided upstream of the mounting means in the feeding direction of the carrier tape and applies tension to the carrier tape that is fed by the driving roller;
A sensor for detecting perforations formed at both ends in the width direction of the carrier tape;
An imaging camera for imaging a recognition pattern provided on the carrier tape;
Before mounting the electronic component on the carrier tape, after the Kiyariatepu the recognition pattern was rewound by the supply reel to a state out of the field of view of the imaging camera, the Kiyariatepu sending predetermined distance by the drive roller After removing the deformation of the carrier tape, the carrier tape is positioned at the mounting position based on the imaging of the recognition pattern by the imaging camera and the electronic component is mounted. Thereafter, the sensor detects the perforation. An electronic component mounting apparatus comprising: control means for mounting the electronic component by positioning the carrier tape at a mounting position .   The back tension roller has a lower back tension roller that contacts the lower surface of the carrier tape and an upper back tension roller that contacts the upper surface, and at least one of the back tension rollers can be opened and closed in a direction away from the carrier tape. The electronic component mounting apparatus according to claim 1, wherein:   2. The electronic component mounting apparatus according to claim 1, wherein the back tension roller is driven to open and close after the carrier tape is positioned at the mounting position.   2. The electronic component mounting apparatus according to claim 1, wherein the positioning of the carrier tape by the control means is performed before the electronic component is first mounted on the carrier tape. The carrier tape mounted between the supply reel and the take-up reel is tensioned by the back tension roller and fed at a predetermined pitch by the feed roller, and the electronic component is mounted by the mounting means at the mounting position of the carrier tape. An implementation method,
Detecting perforations formed on the carrier tape by a sensor, and feeding the carrier tape by a predetermined pitch based on the detection;
Imaging a recognition pattern formed on the carrier tape pitch-fed based on detection of perforation by the sensor with an imaging camera, and positioning the mounting means with respect to the carrier tape based on the imaging ,
Before mounting the electronic component on the carrier tape, the carrier tape is rewound by the supply reel until the recognition pattern deviates from the field of view of the imaging camera, and then the carrier tape is fed by a predetermined distance by the driving roller. After removing the deformation of the carrier tape, the carrier tape is positioned at the mounting position based on the imaging of the recognition pattern by the imaging camera and the electronic component is mounted. Thereafter, the sensor detects the perforation. An electronic component mounting method comprising mounting the electronic component by positioning the carrier tape at a mounting position based on the above .   The carrier tape is rewound by the supply reel to a position where the recognition pattern deviates from the field of view of the imaging camera before the mounting means is first positioned at a mounting position of the carrier tape. 5. The electronic component mounting method according to 5.   After returning the carrier tape to the supply reel side until the recognition pattern deviates from the field of view of the imaging camera, the carrier tape is sent so that the recognition pattern is located within the field of view of the imaging camera, and then the recognition is performed. 6. The electronic component mounting method according to claim 5, wherein the pattern is imaged by the imaging camera, and the carrier tape is positioned at a mounting position based on the imaging.

Images