JP6147000B2 - Component mounting method - Google Patents

Description

  The present invention relates to a method of mounting a component on a board that is long in the transport direction.

  In Patent Document 1, when a component is mounted on a long substrate exceeding the component mounting range of the component mounting device, the substrate mounting area is divided into ranges that fit within the component mounting range of the component mounting device. A technique for mounting by a side-by-side component mounting apparatus is disclosed.

  When mounting a component on the component mounting apparatus arranged side by side on a long belt-like body in which such a substrate is continuously provided in the conveying direction, each component mounting apparatus itself mounts a component. It is necessary to recognize the mounting area to be mounted. Accordingly, a method is conceivable in which a recognition mark is provided in each mounting area, the recognition mark is read by a reading device provided in each mounting apparatus, and each component mounting apparatus recognizes the mounting area in which the component is mounted.

JP 2008-277770 A

  However, if the recognition mark provided in each mounting area is read by the reading device provided in each mounting device, it takes time to read the recognition mark, and there is a problem that the mounting time of components on the board becomes long. Will occur. In addition, if a recognition mark is provided in each mounting area, a component cannot be mounted on a portion where the recognition mark is provided, and a problem that the mounting area of the component is reduced occurs.

  The present invention has been made in view of such circumstances, and a plurality of component mounting apparatuses arranged side by side are formed in a plurality of mounting regions of a substrate formed continuously in a transport direction on a long strip. An object of the method for mounting components is to provide a technique capable of reducing the mounting time of components on a substrate.

  The invention according to claim 1, which has been made to solve the above-described problem, includes a plurality of strips each having a plurality of substrates each provided with a plurality of pitch regions having a pitch length in the transport direction and continuously provided in the transport direction. A component mounting method in which each of the plurality of component mounting devices sequentially mounts components on the substrate after being transported for each pitch length by a transport device disposed so as to cross the installed component mounting device. In the pitch area of each substrate in the pitch area of the transport direction, a leading recognition part storing leading information is formed, and a reading part for reading the leading recognition part is provided, and the reading part The component mounting devices should be mounted on the basis of the head information read by the head recognition unit and the number of times the belt-like body has been transported by the transport device since the head recognition unit was read. Position on the pitch region of the component and the component is recognized, the respective component mounting apparatus for mounting said component to said position.

  As described above, the head recognition unit is formed only in the pitch area at the top in the transport direction in the pitch area of each substrate. Then, based on the number of times the belt-like body is transported from when the leading recognition unit is read by the transport device, the component to be mounted by each component mounting device and the mounting position on the pitch region of the component are recognized.

  Thereby, it is not necessary to form a recognition unit for recognizing a component to be mounted by each component mounting apparatus and a mounting position of the component on the pitch region in each pitch region. For this reason, there is no need to read the recognition unit formed in each pitch area, and only by reading the head recognition unit, the component to be mounted by each component mounting device and the mounting position of the component on the pitch area are recognized. The mounting time of components on the board can be shortened, and the production efficiency of electronic board production can be improved.

  In addition, since it is not necessary to form the recognition section in each pitch area, the component mounting area can be increased by the amount that the recognition section is not formed.

According to a second aspect of the present invention, in the first aspect of the invention, the reading unit may include the first component mounting device on the upstream side in the transport direction among the plurality of component mounting devices or the transport direction of the component mounting device. The head recognition unit is read on the upstream side.

Thereby, when the belt-like body is transported to the first component mounting apparatus on the upstream side in the transport direction , the head of the board can be recognized with certainty. For this reason, it is possible to reliably recognize the component to be mounted by each component mounting apparatus and the mounting position on the pitch region of the component. In addition, the recognition time at the top of the substrate can be shortened.

  According to a third aspect of the present invention, in the invention according to the first or second aspect, the transport device is configured such that when each of the pitch regions is located in a component mounting range in each of the component mounting devices, Each of the component mounting apparatuses that stop conveying and transmit a band-like body stop signal to each of the component mounting apparatuses and receive the band-like body stop signal mounts the parts at positions where the parts should be mounted.

  As a result, the stop of the belt-like body is recognized based on the belt-like body stop signal, and the number of times the belt-like body is conveyed is recognized. The mounting position of is recognized.

  According to a fourth aspect of the present invention, in the first to third aspects of the present invention, an end recognition unit is formed on the upstream side in the transport direction from the final end of the substrate of the strip, and the component mounting device Stops mounting the component based on the end recognition unit read by the reading unit.

  As described above, since the end recognition part is formed on the upstream side in the transport direction from the final end of the substrate of the belt-like body, the end of the substrate can be reliably recognized.

  According to a fourth aspect of the present invention, in the invention according to the third aspect, when the end recognition unit is read by the reading unit, the component transport device is a component in which the end recognition unit is located. It is preferable that the belt-like body stop signal is not transmitted to the component mounting apparatus located upstream in the transport direction from the positions of the mounting apparatus and the end recognition unit. As described above, since the belt-like body stop signal is not transmitted to the component mounting device where the terminal recognition unit is located and the component mounting device located upstream in the transport direction from the position of the terminal recognition unit, The mounting of the component on the upstream strip can be reliably stopped.

  According to a fifth aspect of the present invention, in the first to fourth aspects of the invention, the pitch length is set to be equal to or less than half of a component mounting range by the component mounting device in the transport direction.

Thus, when the belt-like body is conveyed for each pitch length, each pitch area stops within the component mounting range in a state where the entire pitch area is included. Therefore, it is possible to prevent the entire pitch area due to not enter into the full component mounting range, the component mounting of the said pitch region resulting in Tsu kuna such can. For this reason, all the component mounting devices can be operated and components can be mounted in the pitch region, the operating rate of the component mounting device can be improved, and the mounting time of components on the board can be shortened, The production efficiency of electronic board production can be improved.

It is a top view of a component mounting line. It is a perspective view of a component mounting apparatus. It is AA sectional drawing of FIG. 1, and is a side view of a conveying apparatus and a fixing device. It is explanatory drawing of a strip | belt shaped object. It is explanatory drawing which represented typically a mode that components were mounted in each mounting area | region of a board | substrate by each component mounting apparatus as a strip | belt-shaped body is conveyed. It is explanatory drawing which showed the communication connection state of each control part. It is a flowchart of "first component mounting process" of the first embodiment executed by the control unit of the first component mounting device. It is a flowchart of “conveyance device processing” executed by the conveyance control unit. It is a flowchart of "2nd component mounting process" of 1st embodiment performed by the control part of a 2nd component mounting apparatus. It is a flowchart of "3rd component mounting process" of 1st embodiment performed by the control part of a 3rd component mounting apparatus. It is explanatory drawing which showed the "component mounting information" showing the relationship between the frequency | count of conveyance showing the frequency | count which the board | substrate was conveyed and stopped, and the address which each component mounting apparatus should mount | wear. It is a flowchart of "the 1st component mounting process" of a second embodiment performed by the control part of the 1st component mounting apparatus. It is a flowchart of "2nd component mounting process" of 2nd embodiment performed by the control part of a 2nd component mounting apparatus. It is a flowchart of "3rd component mounting process" of 2nd embodiment performed by the control part of a 3rd component mounting apparatus. It is explanatory drawing which showed the strip | belt-shaped body and component mounting method of 3rd embodiment. It is explanatory drawing of 4th embodiment, and is a top view of a strip | belt shaped object.

(Parts mounting line)
First, the component mounting line 1 will be described with reference to FIG. The component mounting line 1 includes a plurality of component mounting devices 101 to 103 and a transport device 200. The component mounting apparatuses 101 to 103 are arranged side by side in the conveyance direction of the substrate 901 (band-like body 900). In the embodiment shown in FIG. 1, three component mounting devices 101 to 103, which are a first component mounting device 101, a second component mounting device 102, and a third component mounting device 103, are arranged in order in the transport direction. ing.

(Description of component mounting device)
Next, the component mounting apparatuses 101 to 103 will be described with reference to FIG. Since the component mounting apparatuses 101 to 103 have the same structure, the first component mounting apparatus 101 will be described as a representative in FIG. In the following description, the transport direction of the substrate 901 is referred to as the X-axis direction, the horizontal direction perpendicular to the X-axis direction in the horizontal plane is referred to as the Y-axis direction, and the vertical direction is perpendicular to the X-axis direction and the Y-axis direction. Is referred to as the Z-axis direction. In the present embodiment, a plurality of substrates 901 are formed on the long strip 900 in the transport direction. The strip 900 is made of a flexible resin or the like. Then, an electronic circuit such as a copper foil is formed on the strip 900, and a plurality of substrates 901 are formed.

  The component mounting device 101 includes a component supply device 20, a fixing device 10, and a component mounting unit 40. A plurality of slots 22 are juxtaposed in the X-axis direction at the front part of the component mounting apparatus 101 (component mounting unit 40). The component supply device 20 includes a plurality of feeders 21 that are detachably attached to the slots 22. A reel 23 is detachably held on the feeder 21. The reel 23 is wound with a tape (not shown) containing a large number of parts in a row.

  A sprocket (not shown) is rotatably supported in the feeder 21. The outer peripheral portion of the sprocket engages with a feed hole formed in the tape. The feeder 21 is provided with a servo motor (not shown) that is a drive source for rotating the sprocket.

  The tape wound around the reel 23 is sent out one pitch at a time by the rotation of the sprocket. Then, the components accommodated in the tape are sequentially supplied to the component supply unit 21 a provided at the tip of the feeder 21.

  The fixing device 10 positions and fixes (clamps) the conveyed substrate 901 at the mounting position in the component mounting apparatus 101. The fixing device 10 will be described in detail later.

  The component mounting unit 40 includes a guide rail 42, a Y-axis slide 43, a Y-axis servo motor 44, an X-axis slide 45, an X-axis servo motor 46, a component mounting head 47, a suction nozzle 48, and an imaging device 49.

  The guide robot 42, the Y-axis slide 43, and the Y-axis servo motor 44 constitute a Y robot. The guide rail 42 is mounted on the base 41 in the Y direction and is disposed above the fixing device 10. The Y-axis slide 43 is provided so as to be movable along the guide rail 42 in the Y-axis direction. The Y-axis slide 43 is moved in the Y-axis direction by a ball screw mechanism having a ball screw 44 a connected to the output shaft of the Y-axis servo motor 44.

  The X-axis slide 45 and the X-axis servo motor 46 constitute an X robot. The X-axis slide 45 is provided on the Y-axis slide 43 so as to be movable in the X-axis direction. An X-axis servo motor 46 is provided on the Y-axis slide 43. The X-axis slide 45 is moved in the X-axis direction by a ball screw mechanism (not shown) connected to the output shaft of the X-axis servomotor 46.

  The X-axis slide 45 is provided with a component mounting head 47 and an imaging device 49. The component mounting head 47 holds a suction nozzle 48. Each suction nozzle 48 is movable in the Z direction. The suction nozzle 48 sucks parts. The imaging device 49 images a component mounting range b, which will be described later, and outputs imaging data to the control unit 50.

  The suction robot 48 is moved onto the component supply unit 21a by the Y robot and the X robot, and the suction nozzle 48 sucks the component supplied to the component supply unit 21a. Then, the suction nozzle 48 is moved onto the fixing device 10 by the Y robot and the X robot, and the suction nozzle 48 mounts a component on the substrate 901 positioned and fixed by the fixing device 10.

  The control unit 50 performs overall control of the component mounting apparatus 101. The control unit 50 controls these by outputting commands to the servo motors of the feeder 21, the fixing device 10, and the component mounting unit 40.

(Transport device)
Next, the conveyance device 200 will be described with reference to FIGS. 1 and 3. As shown in FIGS. 1 and 3, the transport device 200 includes a supply-side roller 201, a take-up roller 202, a transport device servomotor 203, a transmission mechanism 204, and a transport control unit 205. The supply side roller 201 is rotatably provided on the upstream side in the transport direction of the plurality of component mounting apparatuses 101 to 103. The winding side roller 202 is rotatably provided on the downstream side in the transport direction of the plurality of component mounting apparatuses 101 to 103.

  The take-up roller 202 is rotated by a conveying device servo motor 203 via a transmission mechanism 204 such as a pulley, a belt, and a gear. The transport device servomotor 203 is controlled by the transport control unit 205. A belt-like body 900 before component mounting is wound around the supply side roller 201. The belt-like body 900 after the components are mounted on each substrate 901 is taken up by the take-up roller 202. That is, the belt-like body 900 is formed in the X direction on the fixing device 10 in the component mounting devices 101 to 103 arranged in parallel by having both ends thereof wound around the supply side roller 201 and the winding side roller 202. Is inserted through the transport path.

  A conveyance path imaging device 206 is provided in the conveyance path of the belt-like body 900 of each of the component mounting apparatuses 101 to 103. The conveyance path imaging device 206 images a side portion of the band 900, reads a stop position recognition unit 904 and a termination recognition unit 905, which will be described later, and transmits the read data to the conveyance control unit 205.

(Fixing device)
Next, the fixing device 10 will be described with reference to FIGS. As shown in FIGS. 2 and 3, the fixing device 10 includes a fixing rail 11, a support plate 12, and a lifting device 13. A pair of the fixed rails 11 is provided above the base 41 along the transport direction (X direction). The lifting device 13 is provided on the base 41 between the pair of fixed rails 11 in the Y direction. The elevating device 13 includes an elevating device servo motor controlled by the control unit 50, a support portion 13a that supports the support plate 12 at its upper end, a gear, a belt, and the like that transmit power from the elevating device servo motor to the support portion 13a. And a transmission mechanism.

  The support plate 12 is moved in the Z direction by the elevating device 13 and moved upward to clamp and fix the belt-like body 900 to and from the fixed rail 11. That is, the belt-like body 900 is transported between the pair of fixed rails 11 in the Y direction, and is transported in the transport path formed between the pair of fixed rails 11 and the support plate 12 in the Z direction. The support plate 12 is porous. The perforations communicate with an air supply / suction device (not shown) controlled by the control unit 50.

When the strip 900 is transported, air is supplied in a porous manner by the air supply and suction device, so that the strip 900 is lifted from the support plate 12 so that the strip 900 and the support plate 12 do not come into contact with each other. During clamping of the belt 900, porous or we air is inhaled by insufflation suction device, so that the strip 900 is fixed by suction to the support plate 12.

(Band)
Next, the band-shaped body 900 will be described with reference to FIG. As shown in FIG. 4, the substrate 901 has a plurality of pitch regions 902 having a constant (same) pitch length a in the transport direction. In the present embodiment, a first pitch region 902a, a second pitch region 902b, and a third pitch region 902c are provided in order from the downstream side (leading side) to the upstream side in the transport direction. The pitch lengths a of the pitch regions 902a to 902c are the same. The pitch length a is less than half the length b (shown in FIG. 5) in the conveying direction of the component mounting ranges of the component mounting apparatuses 101 to 103.

  In the present embodiment, each pitch area 902a to 902c is divided into a plurality of mounting areas 903a, 903b, and 903c. In the present embodiment, the second pitch area 902b and the third pitch area 902c other than the head in the transport direction are divided into a first mounting area 903a and a second mounting area 903b in the Y direction. The first pitch area 902a on the leading side in the transport direction has a third mounting area 903c that is vertically long in the Y direction on the top side in the transport direction in addition to the first mounting area 903a and the second mounting area 903b.

  In addition, as shown in FIG. 4, each address of each attachment area | region 903a-903c is represented as follows. The first mounting area 903a in the first pitch area 902a is 1-1, the first mounting area 903a in the second pitch area 902b is 1-2, and the first mounting area 903a in the third pitch area 902c is 1-3. It expresses. Similarly, the second mounting region 903b in the first pitch region 902a is 2-1, the second mounting region 903b in the second pitch region 902b is 2-2, and the second mounting region 903b in the third pitch region 902c is This is expressed as 2-3. And the 3rd mounting area | region 903c in the 1st pitch area | region 902a is represented as 3-1.

  A component is mounted by the first component mounting apparatus 101 at each address in the first mounting region 903a. A component is mounted by the second component mounting apparatus 102 at each address in the second mounting region 903b. A component is mounted on each address of the third mounting region 903c by the third component mounting device 103.

  Since the first pitch area 902a includes the third mounting area 903c, the first mounting area 903a (1-1) and the second mounting area 903b (2-1) of the first pitch area 902a are provided. The length in the transport direction is the transport of the first mounting region 903a (1-2, 1-2) and the second mounting region 903b (2-2, 2-3) of the second pitch region 902b and the third pitch region 902c. Compared to the length in the direction, the third mounting region 903c (3-1) is shorter by the length in the transport direction.

  Such a substrate 901 is continuously formed in the transport direction. A circuit non-formation region 907 in which no circuit is formed is located further downstream in the transport direction than the topmost substrate 901 and upstream in the transport direction from the rearmost substrate 901.

  A head recognition unit 908 is formed in the first pitch area 902a at the head in the transport direction. The head recognition unit 908 describes “head information” for identifying the head of each substrate 901. The head recognition unit 908 is imaged and read by the imaging device 49 of the first component mounting device 101 in the first conveyance direction, and is output to the control unit 50 of the first component mounting device 101.

  A fiducial mark 909 is formed in each of the pitch regions 902a to 902c. In the present embodiment, a pair of fiducial marks 909 are formed at both ends of the diagonal lines of the pitch regions 902a to 902c. The fiducial mark 909 is for recognizing the positions of the pitch regions 902a to 902c in the component mounting apparatuses 101 to 103, that is, relative positions in the component mounting range b shown in FIG. The fiducial mark 909 is imaged and read by the imaging device 49 of each of the component mounting devices 101 to 103 and is output to each control unit 50.

  A stop position recognizing unit 904 is provided at each boundary between the pitch regions 902a to 902c on the side of the substrate 901. That is, the boundary between the pitch regions 902a to 902c is located in the intermediate portion between the pair of stop position recognition units 904 in the transport direction. The stop position recognition unit 904 is read by the conveyance path imaging device 206 and output to the conveyance control unit 205. The stop position recognition unit 904 recognizes the stop positions of the board 901 in the component mounting apparatuses 101 to 103 and recognizes the boundaries between the pitch regions 902a to 902c.

  Further, a termination recognition unit 905 is provided on the upstream side in the transport direction of the substrate 901 at the final end. In the present embodiment, the terminal end recognition unit 905 is provided in the circuit non-formation region 907 at the side position of the substrate 901 with respect to the Y direction. The end recognition unit 905 is read by each conveyance path imaging device 206 and output to the conveyance control unit 205. The termination recognition unit 905 recognizes the termination of the substrate 901.

(Communication connection status)
Next, communication connection states of the control units 50 and 205 will be described with reference to FIG. As shown in FIG. 6, the control unit 50 of the first component mounting apparatus 101 is communicably connected to the control unit 50 of the second component mounting apparatus 102 adjacent to the conveyance direction side. Moreover, the control part 50 of the 2nd component mounting apparatus 102 is connected so that communication is mutually possible with the control part 50 of the 3rd component mounting apparatus 103 adjacent on the conveyance direction side. The conveyance control unit 205 is connected to the control units 50 of the component mounting apparatuses 101 to 103 so as to communicate with each other.

(Outline of this embodiment)
Next, an outline of the present embodiment will be described with reference to FIGS. 5 and 11. FIG. 5 is an explanatory view schematically showing how components are mounted on the mounting regions 903a to 903b of the substrate 901 by the component mounting apparatuses 101 to 103 as the belt-shaped body 900 is conveyed. In the present embodiment, the belt-like body 900 is transported by the transport device 200 by the pitch length a and stopped (stepping), and is fixed by the fixing device 10. And each component mounting apparatus 101-103 mounts components in the mounting area 903a-903c which self receives.

  FIG. 11 shows the relationship between the “number of times of conveyance” (conveyance order) indicating the number of times (order) that the substrate 901 has been conveyed and stopped by the conveyance device 200 and the addresses to which the component mounting apparatuses 101 to 103 should be mounted. It is explanatory drawing which showed "component mounting information." Depending on the address of each of the mounting areas 903a to 903c, the mounted component and the mounting position of the component differ. That is, when each of the component mounting apparatuses 101 to 103 recognizes the addresses of the mounting areas 903a to 903c, the component mounting apparatuses 101 to 103 can recognize the component to be mounted at the address and the mounting position, and the components are mounted on the mounting area 903a. Attach to 903c.

  When the first component mounting apparatus 101 reads and acquires the head recognition unit 908, the first component mounting apparatus 101 creates “component mounting information” as shown in FIG.

  That is, when the belt-like body 900 advances, it is conveyed to the component mounting ranges b of the component mounting apparatuses 101 to 103 in the order of the first pitch region 902a, the second pitch region 902b, and the third pitch region 902c. The first component mounting apparatus 101 recognizes. For this reason, when the first component mounting apparatus 101 reads the head recognition unit 908, each component mounting apparatus 101-103 should be mounted in which mounting area 903a-903c for each step of the band-shaped body 900. Can be recognized, and based on the recognition, “component mounting information” as shown in FIG. 11 is created.

  Then, the first component mounting apparatus 101 transmits “component mounting information” shown in FIG. 11 to the second component mounting apparatus 102 adjacent to the conveyance direction. The second component mounting apparatus 102 that has received the “component mounting information” transmits “component mounting information” to the third component mounting apparatus 103 adjacent to the conveyance direction.

  The component mounting apparatuses 101 to 103 mount components in the mounting regions 903a to 903c based on “component mounting information”. This will be described in detail below with reference to the flowcharts shown in FIGS.

(First component mounting process)
Next, the “first component mounting process” executed by the control unit 50 (hereinafter, abbreviated as the control unit 50) of the first component mounting apparatus 101 of the first embodiment will be described using the flowchart shown in FIG. When the first component mounting apparatus 101 becomes operable, the process proceeds to S101.

In S101, the control unit 50, when determining that the transport of the strip 900 is started (S101: YES), the control program in S102, if it is determined that the transport of the strip 900 is not started (S101: NO), the process of S101 is repeated. Note that when the “transport start signal” is received from the transport control unit 205 (S503 in FIG. 8), the control unit 50 determines that the transport of the strip 900 has started.

  In S102, when the control unit 50 determines that the head recognition unit 908 has already been read in the same substrate 901 (S102: YES), the program proceeds to S108, and the head recognition unit 908 is moved in the same substrate 901. If it is determined that it has not been read yet (S102: NO), the program proceeds to S103.

  In S103, when the control unit 50 determines that the head recognition unit 908 has been read (S103: YES), the program proceeds to S104, and when it is determined that the head recognition unit 908 has not been read (S103: NO). ), The program proceeds to S104.

  In S <b> 104, the control unit 50 generates “component mounting information” (shown in FIG. 11) for mounting a component on the board 901 on which the head recognition unit 908 is located, starting from the read head recognition unit 908. Specifically, the control unit 50 determines the address at which each of the component mounting apparatuses 101 to 103 should be mounted in each mounting area 903 in each “number of times of conveyance” from the read head recognition unit 908 as a starting point. "Installation information" is generated and stored. When S104 ends, the program proceeds to S105.

  In S105, “component mounting information” is transmitted to the control unit 50 of the second component mounting apparatus, and the program proceeds to S108.

  In S108, the control unit 50 determines that the “band-like body stop completion signal” has been received from the transport control unit 205, and if it is determined that the band-like body 900 has stopped (S108: YES), the program proceeds to S109. If it is determined that the “band-like body stop completion signal” has not been received (S108: NO), the process of S108 is repeated.

  In S <b> 109, the control unit 50 outputs a control signal to the lifting device 13 (shown in FIG. 3), and clamps and fixes the belt-like body 900 with the support plate 12 and the fixed rail 11. And the control part 50 outputs a control signal to an air supply sound absorption apparatus (not shown), and makes the strip | belt-shaped body 900 adsorb | suck to the support plate 12. FIG. When S109 ends, the program proceeds to S110.

  In S110, the control unit 50 recognizes the address of the first mounting area 903a to be mounted by itself. Then, the control unit 50 recognizes the component to be mounted and the mounting position of the component on the first mounting region 903a based on the recognized address, and outputs a control signal to each servo motor, thereby the first mounting region 903a. Start mounting parts to the. When S110 ends, the program proceeds to S111.

  In S111, when the control unit 50 determines that the mounting of the component in the first mounting region 903a is completed (S111: YES), the program proceeds to S112, and the mounting of the component in the first mounting region 903a is performed. If it is determined that the process has not been completed (S111: NO), the process of S111 is repeated.

  In step S <b> 112, the control unit 50 transmits a “component mounting completion signal” to the conveyance control unit 205. When S112 ends, the program returns to S102.

(Conveyor processing)
Next, the “conveyance device process” executed by the conveyance control unit 205 of the conveyance device 200 will be described using the flowchart shown in FIG. When the transport apparatus 200 is ready for operation, the process proceeds to S501.

  In S501, when the conveyance control unit 205 determines that the operation of the operation unit (not shown) has started the conveyance of the band 900 (S501: YES), the program proceeds to S502, and the band 900 If it is determined that the conveyance has not been started (S501: NO), the process of S501 is repeated.

  In step S <b> 502, the conveyance control unit 205 outputs a control signal to the conveyance device servomotor 203 to rotate the winding-side roller 202 and start conveyance of the belt-shaped body 900. When S502 ends, the program proceeds to S503.

  In step S <b> 503, the conveyance control unit 205 outputs a “conveyance start signal” to the control unit 50 of each of the component mounting apparatuses 101 to 103. When S503 ends, the program proceeds to S504.

  If the conveyance control unit 205 determines in S504 that the mounting area 903 has been transported to the stop position in the component mounting range b based on the stop position recognition unit 904 (S504: YES), the program proceeds to S505. When it is determined that the mounting area 903 is not conveyed to the stop position in the component mounting range b (S505: NO), the process of S504 is repeated.

  In step S <b> 505, the conveyance control unit 205 stops the conveyance device servomotor 203 and stops conveyance of the strip 900. When S505 ends, the program proceeds to S506.

  In S506, when the conveyance control unit 205 determines that the end recognition unit 905 has been recognized (S506: YES), the program proceeds to S517, and when the end recognition unit 905 is not recognized (S506: NO). ), The program proceeds to S507.

  In step S <b> 507, the conveyance control unit 205 transmits a “band-like body stop completion signal” to the control unit 50 of each of the component mounting apparatuses 101 to 103. When S507 ends, the program proceeds to S509.

  In S509, when it is determined that the conveyance control unit 205 has received the “component mounting completion signal” from all the component mounting apparatuses 101 to 103 (S509: YES), the program is returned to S502, and all the component mounting apparatuses are returned. If it is determined that the “component mounting completion signal” has not been received from 101 to 103 (S509: NO), the processing of S509 is repeated.

  In step S517, the conveyance control unit 205 transmits a “band-like body stop signal” to the control unit 50 of the component mounting apparatuses 102 and 103 downstream of the component mounting apparatuses 101 to 103 located at the position where the end recognition unit 905 is recognized. To do. That is, the “band-like body stop signal” is not transmitted to the position where the end recognition unit 905 is recognized and the control unit 50 of the component mounting apparatuses 101 to 103 upstream of the position.

  In S518, when the transfer control unit 205 determines that the mounting of the component on the board 901 is completed (S518: YES), the program proceeds to S520, and the mounting of the component on the board 901 is not completed. If it is determined (S518: NO), the program proceeds to S519. In addition, when the conveyance path imaging device 206 provided in the third component mounting device 103 located on the most downstream side in the conveyance direction reads the end recognition unit 905, the control unit 50 mounts the component on the board 901. Judge that it is finished. On the other hand, when the conveyance path imaging device 206 provided other than the third component mounting device 103 located on the most downstream side in the transport direction reads the end recognition unit 905, the second component mounting device 102 or the third component mounting is performed. In the apparatus 103, it is determined that it is necessary to mount a component in the mounting area 903b or 903c, and the termination process of S520 is not executed.

  If it is determined in step S519 that the conveyance control unit 205 has received the “component mounting completion signal” from all of the component mounting devices 102 and 103 that have performed component mounting (the “band-like body stop signal” has been transmitted). (S519: YES), the program proceeds to S502, and if it is determined that the “component mounting completion signal” has not been received from all of the component mounting apparatuses 102 and 103 (S519: NO), the processing of S519 is repeated. .

  In step S <b> 520, the conveyance control unit 205 drives the conveyance device servomotor 203 to take up all of the belt-shaped body 900 (circuit non-formation region 907) with the take-up roller 202, and then convey the device servomotor 203. Stop. When S520 ends, the “conveyance device process” ends.

(Second part mounting process)
Next, a “second component mounting process” executed by the control unit 50 (hereinafter, abbreviated as the control unit 50) of the second component mounting apparatus 102 according to the first embodiment will be described with reference to the flowchart shown in FIG. When the second component mounting apparatus 102 becomes operable, the process proceeds to S201.

  In S201, when the control unit 50 determines that the transport of the strip 900 has started (S201: YES), the program proceeds to S202, and when the transport of the strip 900 has not started, (S201: NO), the process of S201 is repeated. Note that when the “transport start signal” is received from the transport control unit 205 (S503 in FIG. 8), the control unit 50 determines that the transport of the strip 900 has started.

  In S202, when the control unit 50 determines that “component mounting information” (shown in FIG. 11) has already been received in the same board 901 (S202: YES), the program proceeds to S205, and the same board 901 is obtained. If it is determined that “component mounting information” has not yet been received (S202: NO), the program proceeds to S203.

  When the control unit 50 determines in S203 that the “component mounting information” has been received from the control unit 50 of the first component mounting apparatus 101 on the upstream side in the transport direction (S203: YES), the “component mounting information” And the program proceeds to S204, and if it is determined that “component mounting information” has not been received (S203: NO), the processing of S203 is repeated.

  In S <b> 204, the control unit 50 transmits “component mounting information” to the control unit 50 of the third component mounting apparatus 103 on the downstream side in the transport direction. When S204 ends, the program proceeds to S205.

  In S205, when it is determined that the “band-like body stop completion signal” has been received (S205: YES), the control unit 50 advances the program to S209 and determines that the “band-like body stop completion signal” has not been received. If so (S205: NO), the process of S205 is repeated.

  In S <b> 209, the control unit 50 outputs a control signal to the lifting device 13 (shown in FIG. 3), and clamps and fixes the belt-like body 900 with the support plate 12 and the fixed rail 11. And the control part 50 outputs a control signal to an air supply sound absorption apparatus (not shown), and makes the strip | belt-shaped body 900 adsorb | suck to the support plate 12. FIG. When S209 ends, the program proceeds to S210.

  In S <b> 210, the control unit 50 refers to the “component mounting information” (shown in FIG. 11) by referring to the “number of times of conveyance” (the number of times the “band-like body stop completion information” has been received), so that the second mounting area to be mounted by itself. Recognizing the address 903b, a control signal is output to each servo motor, and the mounting of the component in the second mounting area 903b is started. When S210 ends, the program proceeds to S211.

  In S211, when the control unit 50 determines that the mounting of the component in the second mounting area 903b is completed (S211: YES), the program proceeds to S212, and the mounting of the component in the second mounting area 903b is performed. If it is determined that the process has not been completed (S211: NO), the process of S211 is repeated.

  In step S <b> 212, the control unit 50 transmits a “component mounting completion signal” to the conveyance control unit 205. When S212 ends, the program returns to S202.

(Third component mounting process)
Next, the “third component mounting process” executed by the control unit 50 (hereinafter, abbreviated as the control unit 50) of the third component mounting apparatus 103 of the first embodiment will be described using the flowchart shown in FIG. When the third component mounting apparatus 103 becomes operable, the process proceeds to S301.

  In S301, when the control unit 50 determines that the conveyance of the band-shaped body 900 has started (S301: YES), the program proceeds to S302, and when it is determined that the conveyance of the band-shaped body 900 has not started (S301: NO), the process of S301 is repeated. Note that when the “transport start signal” is received from the transport control unit 205 (S503 in FIG. 8), the control unit 50 determines that the transport of the strip 900 has started.

  In S302, if the control unit 50 determines that “component mounting information” (shown in FIG. 11) has already been received in the same board 901 (S302: YES), the program proceeds to S305, and the same board 901 is obtained. If it is determined that “component mounting information” has not yet been received (S302: NO), the program proceeds to S303.

  In S303, when the control unit 50 determines that “component mounting information” has been received from the control unit 50 of the second component mounting device 102 on the upstream side in the transport direction (S303: YES), the “component mounting information” And the program proceeds to S305, and if it is determined that “component mounting information” has not been received (S303: NO), the processing of S303 is repeated.

  In S305, when it is determined that the “band-like body stop completion signal” has been received (S305: YES), the control unit 50 advances the program to S309 and determines that the “band-like body stop completion signal” has not been received. If so (S305: NO), the process of S05 is repeated.

  In S <b> 309, the control unit 50 outputs a control signal to the lifting device 13 (shown in FIG. 3), and clamps and fixes the belt-like body 900 with the support plate 12 and the fixed rail 11. And the control part 50 outputs a control signal to an air supply sound absorption apparatus (not shown), and makes the strip | belt-shaped body 900 adsorb | suck to the support plate 12. FIG. When S309 ends, the program proceeds to S310.

  In S310, the control unit 50 recognizes the address of the third mounting region 903c to be mounted by referring to the “part mounting information” (shown in FIG. 11) and controls each servo motor. A signal is output to start mounting the component on the third mounting area 903c. When S310 ends, the program proceeds to S311.

  In S311, when the control unit 50 determines that the mounting of the component in the second mounting area 903b is completed (S311: YES), the program proceeds to S312 and the mounting of the component in the second mounting area 903b is performed. If it is determined that the process has not been completed (S311: NO), the process of S311 is repeated.

  In step S <b> 312, the control unit 50 transmits a “component mounting completion signal” to the conveyance control unit 205. When S312 ends, the program returns to S302.

(Second embodiment)
The second embodiment will be described with respect to differences from the embodiment described above. In the second embodiment, the control unit 50 of the first component mounting apparatus 101 does not generate the “component mounting information” shown in FIG. Is transmitted to the second component mounting apparatus 102 on the downstream side in the transport direction.

  When the control unit 50 of the second component mounting apparatus 102 transmits “head information” to the third component mounting apparatus 103 downstream in the transport direction in S203 of FIG. 13 (S203: YES), the third component mounting apparatus 103 is transmitted in S204. The "head information" is transmitted to the control unit 50. Then, in S210 of FIG. 13, the control unit 50 of the second component mounting apparatus 102 is based on the received “head information” and “strip-shaped body conveyance completion signal”, that is, after receiving “head information”. Based on the number of times the “strip conveyance completion signal” has been received (“number of conveyances”), the address to be mounted by itself is recognized and components are mounted.

In 310 of FIG. 14, the control unit 50 of the third component mounting apparatus 103 is based on the received “leading information” and “strip-shaped body conveyance completion signal”, that is , the “strip-like” after receiving the “ leading information”. Based on the number of times the “body conveyance completion signal” is received (“number of times of conveyance”), the address to be mounted is recognized, and the component is mounted.

(Third embodiment)
The third embodiment will be described with respect to differences from the embodiment described above. In the third embodiment, as shown in FIG. 15B, the fiducial mark 909 is provided only in the first pitch region 902a and the third pitch region 902c, and is provided in the second pitch region 902b. Not.

  When a component is mounted on the second pitch region 902b, the position of the second pitch region 902b relative to the component mounting range b of each of the component mounting devices 101 to 103 is detected by the first pitch region 902a adjacent to the second pitch region 902b. And a fiducial mark 909 (fiducial mark 909 surrounded by a two-dot oblique line in FIG. 15B) provided in the third pitch region 902c.

  This eliminates the need to provide the fiducial mark 909 in the second pitch area 902b, and thus increases the component mounting range of the second pitch area 902b.

(Fourth embodiment)
Below, 4th embodiment is described. In addition, about 4th embodiment, the description is abbreviate | omitted about the same structure as embodiment described above. When there is a defective portion such as a scratch on the substrate 901 when the substrate 901 is manufactured, if a component is mounted on the substrate 901, a defective electronic substrate is manufactured. Therefore, as shown in FIG. 16, when the skip mark 906 is printed on the board 901 having the defective portion and the imaging device 49 of each of the component mounting apparatuses 101 to 103 reads the skip mark 906, the skip mark 906 is concerned. The component is not mounted on the board 901 having the gap.

  In the fourth embodiment, the skip mark 906 is printed only in the mounting areas 903a to 903c of the first pitch area 902a, and the skip mark 906 is not printed in the other pitch areas 902b and 902c.

  When the imaging device 49 of each of the component mounting apparatuses 101 to 103 reads the skip mark 906, not only the first pitch region 902a but also the second pitch region 902b and the third pitch region 902c are not mounted. That is, when there is a skip mark at 1-1 which is the address of the first mounting area 903a of the first pitch area 902a, the first mounting areas of 1-2 and 1-3 where the head number of the address is the same address No components are attached to 903a. Similarly, when there is a skip mark at the address 2-1 of the second mounting area 903b of the first pitch area 902a, the first mounting of the addresses 2-2 and 2-3 having the same address start address Parts are not mounted on the region 903a.

  As described above, the skip mark 906 is printed only in the first pitch area 902a, the skip mark 906 is detected by the imaging device 49, and no component is mounted on the defective board 901. Compared to the case where the skip mark 906 is printed, the time for reading the skip mark 906 in the imaging device 49 can be shortened, and the manufacturing time of the electronic board can be shortened. Further, since a space for printing the skip mark 906 in the second pitch region 902b and the third pitch region 902c is not necessary, the mounting range of components in the second pitch region 902b and the third pitch region 902c increases.

(Effect of this embodiment)
As is clear from the above description, as shown in FIG. 4, the head recognition unit 908 is formed only in the first pitch area 902 a at the top in the transport direction among the pitch areas 902 a to 902 c of each substrate 901. The addresses in the mounting regions 903a to 903c are recognized based on the “number of times of transport” of the belt-shaped body 900 by the transport device 200 from when the head recognition unit 908 is read, and the component mounting devices 101 to 101 are identified by the addresses. The components to be mounted by 103 and the mounting positions of the components on the mounting regions 903a to 903c (pitch regions 902a to 902c) are recognized.

  Accordingly, it is not necessary to form a recognition unit for recognizing the components to be mounted by the component mounting apparatuses 101 to 103 and the mounting positions of the components on the mounting regions 903a to 903c in the mounting regions 903a to 903c. For this reason, it is not necessary to read the recognition unit formed in each of the mounting regions 903a to 903c, and only by reading the head recognition unit 908, the component mounting devices 101 to 103 are to be mounted on the pitch region and the component to be mounted Since the mounting position is recognized, the mounting time of components on the board 901 can be shortened, and the production efficiency of electronic board production can be improved.

  Moreover, since it is not necessary to form the recognition part in each of the mounting areas 903a to 903c (each of the pitch areas 902a to 902b), the part mounting area can be increased by the amount that the recognition part is not formed.

  Further, the head recognition unit 908 is read by the imaging device 49 (reading unit) provided in the first first component mounting device 101 among the plurality of component mounting devices 101 to 103. Then, in S105 of FIG. 7 and S105 of FIG. 12, the first component mounting apparatus 101 sends the recognition information (“component mounting information”, “leading information”) at the top of the board 901 downstream of the second component mounting apparatus 102 in the transport direction. Send to. The second component mounting apparatus 102 that has received the recognition information at the top of the board 901 transmits the recognition information at the top of the board 901 to the third component mounting apparatus 103 downstream in the transport direction in S204 of FIG. 9 or S204 of FIG.

  As described above, by reading the head recognition unit 908 by the imaging device 49 provided in the first first component mounting apparatus 101, each of the component mounting apparatuses 101 to 103 can surely recognize the head of the board 901. it can. For this reason, the control part 50 of each component mounting apparatus 101-103 can recognize the address which mounts components reliably, the component which should be mounted | worn to mounting area 903a-903c corresponding to the said address, and mounting | wearing of the said component The mounting positions on the areas 903a to 903c can be recognized.

  In addition, since only the imaging device 49 of the first component mounting apparatus 101 reads the head recognition unit 908 once, each component mounting apparatus 101 to 103 can recognize the head of the substrate 901, so Is read by the imaging device 49 provided in each of the component mounting apparatuses 101 to 103, and each of the component mounting apparatuses 101 to 103 recognizes the top of the substrate 901. Compared to the above, the recognition time of the top of the substrate 901 can be shortened. For this reason, the mounting time of components on the board 901 can be shortened, and the production efficiency of the electronic board can be improved.

  Further, the transport control unit 205 (transport device) determines that each of the pitch regions 902a to 902c is located at the mounting position b in each of the component mounting devices 101 to 103 (YES in S504), in S505 of FIG. While the conveyance of the belt-like body 900 is stopped, a “band-like body stop signal” is transmitted to each of the component mounting apparatuses 101 to 103 in S507 of FIG. Then, each of the component mounting apparatuses 101 to 103 that has received the “band-like body stop signal” mounts the components in S110 of FIGS. 7 and 12, FIG. 9, 210 of 210, FIG. 10, and S310 of FIG. Mount the part at the mounting position to be installed.

  As described above, since the stop of the band 900 is recognized based on the “band stop signal” and the “number of times of conveyance” (shown in FIG. 11) of the band 900 is recognized, the component mounting apparatus can be surely used. The components 101 to 103 are to be mounted and the mounting positions on the mounting areas 903a to 903c of the components are recognized.

  Also, as shown in FIG. 4, a termination recognition unit 905 is formed on the upstream side of the final end of the substrate 901 of the strip 900, and the termination recognition unit 905 is read by the conveyance path imaging device 206 (reading unit). 8 (determined as YES in S506 in FIG. 8), in S517 in FIG. 8, the conveyance control unit 205 (component conveyance device) determines the component mounting apparatuses 101 to 103 in which the end recognition unit 905 is located and the position. The “band-like body stop signal” is not transmitted to the component mounting apparatuses 101 to 103 on the upstream side in the transport direction.

  As described above, since the terminal end recognition unit 905 is formed on the upstream side in the transport direction with respect to the final end of the substrate 901 of the band-shaped body 900, the end of the substrate 901 can be reliably recognized. In addition, since the “band-like body stop signal” is not transmitted to the component mounting apparatuses 101 to 103 in which the terminal end recognition unit 905 is located and the component mounting apparatuses 101 to 103 on the upstream side in the transport direction from the terminal end recognition unit 905, The mounting of the component to the belt-like body 900 on the upstream side in the transport direction with respect to the substrate 901 can be reliably stopped.

  If the leading edge of the substrate 901 is recognized based on the presence or absence of the leading edge recognition unit 908, the leading edge recognition unit 908 is dirty and the leading edge recognition unit 908 cannot be read by the imaging device 49. It will be judged as the end. On the other hand, in the present embodiment, since the end recognition unit 905 is formed, the final end of the substrate 901 can be reliably recognized.

  As shown in FIG. 4, the pitch length a of each pitch region 902a-902c is constant. As a result, when the strip 900 is stepped for each pitch length a, the pitch regions 902a to 902c are conveyed and positioned at the same position every time in the component mounting range b. For this reason, when the strip 900 is stepped, the relative position does not shift in the pitch regions 902a to 902c in the component mounting range b. As a result, an operation for correcting the deviation is unnecessary, and the time for mounting the component on the board 901 can be shortened.

  As shown in FIG. 5, the pitch length a of each of the pitch regions 902a to 902c is set to be less than or equal to half of the component mounting range b by the component mounting devices 101 to 103 in the transport direction. Thereby, each pitch area | region 902a-902c stops in the components mounting range b in the state in which the whole each pitch area | region 902a-902c entered. Therefore, it is possible to prevent the components from being mounted on the pitch regions 902a to 902c from becoming impossible due to the fact that the entire pitch regions 902a to 902c are not completely within the component mounting range b. For this reason, all the component mounting apparatuses 101-103 can be operated and components can be mounted in the pitch regions 902a-902c, and the operating rate of the component mounting apparatuses 101-103 can be improved. As a result, the mounting time of components on the board 901 can be shortened, and the production efficiency of electronic board production can be improved.

(Another embodiment)
In the embodiment described above, the head recognition unit 908 is read by the imaging device 49 of the first component mounting apparatus 101. However, the imaging device 49 of each component mounting apparatus 101 to 103 may read the head recognition unit 908 so that each component mounting apparatus 101 to 103 recognizes the address in each of the mounting areas 903a to 903c. .

  The head recognition unit 908 may be an embodiment that is read by an imaging device (reading unit) provided on the upstream side of the first component mounting apparatus 101 in the transport direction. Similarly, in the embodiment, the conveyance path imaging device 206 that reads the end recognition unit 905 and the stop position recognition unit 904 is read by an imaging device (reading unit) provided on the upstream side of the first component mounting device 101 in the conveyance direction. There is no problem even if it exists.

  In the embodiment described above, the conveyance path imaging device 206 recognizes the final end of the substrate 901 by reading the end recognition unit 905. However, the conveyance path imaging device 206 may recognize the final end of the substrate 901 by recognizing the color difference between the final end substrate 901 and the circuit non-formation region 907.

  In the embodiment described above, the conveyance path imaging device 206 and the imaging device 49 are different. However, the conveyance path imaging device 206 and the imaging device 49 may be configured by a common imaging device 49 (reading unit).

  In the embodiment described above, the imaging device 49 is provided on the X-axis slide 45. However, the imaging device 49 may be an embodiment that is fixed above the base 41 (fixing device 10).

  In the embodiment described above, the number of component mounting apparatuses is three. However, the number of component mounting apparatuses is not limited to three, and there may be two or four or more. When there are two component transport apparatuses, the process of S204 is not necessary in the “second component mounting process” shown in FIGS. 9 and 13. When there are four or more component mounting apparatuses, the component mounting apparatuses other than both ends in the transport direction execute the “second component mounting process” shown in FIGS. 9 and 13. And the control part 50 of the component mounting apparatus arrange | positioned in the conveyance direction most downstream performs the "3rd component mounting process" shown in FIG.10 and FIG.14.

  In the embodiment described above, the head recognition unit 908, the stop position recognition unit 904, and the end recognition unit 905 are formed by being printed on the substrate 901 or the band-like body 900. Then, the imaging device 49 and the conveyance path imaging device 206 capture and read the head recognition unit 908, the stop position recognition unit 904, and the end recognition unit 905. However, the head recognition unit 908, the stop position recognition unit 904, and the end recognition unit 905 are configured by an IC tag (RFID (Radio Frequency Identification)), an IC chip, a magnetic storage unit, and the like, and read by a reading unit that reads them. However, there is no problem.

  49 ... Imaging device (reading unit) 101-103 ... Component mounting device, 200 ... Conveying device, 206 ... Conveyance path imaging device (reading unit), 900 ... Band-shaped body, 901 ... Substrate, 902a-902c ... Pitch region, 903a 903c: Mounting area, 904: Stop position recognition unit, 907 ... Circuit non-formation area, 908 ... Lead recognition part, a ... Pitch length, b ... Component mounting range

Claims (5)

A belt-like body in which a plurality of substrates having a plurality of pitch regions having a pitch length in the carrying direction are continuously provided in the carrying direction is provided by the carrying device arranged so as to cross a plurality of component mounting devices arranged in parallel. A component mounting method in which each of the plurality of component mounting apparatuses sequentially mounts components on the board after being transported for each pitch length,
A leading recognition portion is formed in the leading pitch region in the transport direction in the pitch region of each substrate,
A reading unit for reading the head recognition unit is provided,
Based on the number of times the belt-like body is conveyed by the conveying device since the reading unit is read by the reading unit, the components to be mounted by the component mounting devices and the positions of the components on the pitch region are A component mounting method in which each component mounting device is recognized and mounts the component at the position. Wherein the reading unit, the component mounting method according to claim 1 for reading the said first recognition section in the upstream side of the plurality FIRST upstream side of the component mounting apparatus of the component mounting apparatus or the component mounting apparatus . The transport device, when each pitch area is located in a component mounting range in each component mounting device, stops the transport of the strip, and transmits a strip stop signal to each component mounting device,
3. The component mounting method according to claim 1, wherein each of the component mounting apparatuses that has received the belt-like body stop signal mounts a component at a position where the component mounting device should mount the component.   An end recognition unit is formed on the upstream side of the belt in the transport direction from the final end of the substrate, and the component mounting apparatus mounts components based on the end recognition unit read by the reading unit. The component mounting method according to any one of claims 1 to 3, wherein the component mounting method is stopped.   The said pitch length is the component mounting method as described in any one of Claims 1-4 set to the half or less of the component mounting range by the said component mounting apparatus regarding a conveyance direction.

Images