JP2001156116A - Electronic component mounting apparatus and mounting method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus and mounting method which enable effective use of facility spaces by making shorter the whole mounter for assembling multi-chip modules. SOLUTION: A mount stage 11 has heating function and is fed with carrier tapes CT to mount IC chips. An IC chip assembly head 12 actuates an X-Y table 121, in response to information from image processors 123, 124, so that the head 122 itself can be moved freely on coordinates matching carrier tapes. A carrier tape CT transported to the mounting stage 11 is sensed by the image processor 123 for rough positioning and by the image processor 124 for detailed positioning, and the assembly head 12 is sighted to descend, pressurized the carrier tape toward the mount stage 11, and mount desired IC chip CHIP thereon with heating.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing method, and more particularly to a tape carrier type electronic component mounting apparatus and method for positioning a plurality of electronic components and incorporating them into a flexible tape-shaped substrate. .

[0002]

2. Description of the Related Art A tape carrier type electronic component mounting apparatus is an apparatus for positioning a film base material (carrier tape) fed from a reel or the like wound with a carrier tape on a mounting table and mounting an IC chip using a built-in head. It is.

[0003] The carrier tape has, for example, fingers protruding from the periphery of the tape opening, and is made of TAB (Tape Automated).
(ated bonding) technology, and is connected to the connection pads of the IC chip by thermocompression bonding. The mounting table and the built-in head are important elements constituting a tool for thermocompression bonding using TAB.

FIG. 3A is a schematic view showing a configuration of a main part of a conventional electronic component mounting apparatus, and FIG. 3B is a schematic view showing a carrier tape and a mounting table thereof. Positioning of the carrier tape CT3 on the mounting table 41 is important for accurate mounting of the IC chip on the carrier tape CT3.

[0005] The carrier tape CT3 has sprocket holes 31 formed on both sides thereof, between which conductive patterns 32 for IC chips and fingers 33 of each conductive pattern 32 to which the IC chips are to be connected are formed on the periphery 34 of the opening.
Projecting from.

The mounting table 41 has pins 42 to be inserted corresponding to the sprocket holes 31 formed on both sides of the carrier tape CT3, and constitutes an XY table 411 capable of coordinate movement control.

[0007] A pin 42 is inserted into the sprocket hole 31 on the mounting table 41 with respect to the carrier tape CT3 fed at a pitch by the sprocket wheel 43. As a result, the approximate positioning is performed.

The built-in head 51 includes an image processing device 52
Has been deployed. That is, the built-in head 51
The user holds the C chip and moves to the mounting table 41 to acquire a predetermined image on the carrier tape CT3. Thereafter, the XY table 411 of the mounting table 41 linked with the image processing apparatus
Thereby, positioning is performed with high accuracy.

After the completion of such detailed positioning, the built-in head 51 descends and thermally press-bonds the connection pads (not shown) of the IC chip and the fingers 33 of the carrier tape CT3 at once. Thereby, the connection by the TAB technology is achieved.

[0010]

In recent years, semiconductor devices have been highly integrated in semiconductor devices, and miniaturized semiconductor chips can be realized at low cost. Accordingly, a multi-chip module that mounts a plurality of semiconductor chips on a single base material and realizes a desired function by combining individual functions has attracted attention.

The multi-chip module is assembled by, for example, a tape carrier type electronic component mounting apparatus having the above-described configuration. In this case, as many electronic component mounting devices as the number of IC chips to be mounted are required.

FIG. 4 is a schematic view showing a configuration of a main part of a conventional electronic component mounting apparatus constituting a multichip module. In this example, a tape carrier type electronic component mounting apparatus for a multichip module mounting two IC chips is shown.

In FIG. 4, each of the tools C and D has the same combination of the mounting table (41) and the built-in head (51) as in FIG. 3 (a). The first IC chip (not shown) is mounted on the tool 1, and the second IC chip (not shown) is mounted on the tool 2.

A slack SLK relating to the carrier tape CT3 is provided between the tool C and the tool D. The reason is that one is the relation of the positioning method of the carrier tape CT3 on the mounting table, and the other is to absorb the difference in the cycle time in the mounting (connection) processing of the tool C and the tool D.

That is, in the former, the carrier tape CT3 pitch-fed to the mounting tables 41c and 41d of the tools C and D is inserted into the sprocket holes by the pins 42 of the mounting tables.
c and d are inserted and roughly positioned. afterwards,
The XY tables 411c and 411d of the mounting tables 41c and 41d are
The embedded head 51 is moved to a detailed position where the first IC chip and the second IC chip (not shown) are actually mounted.
Must move for c and d. Therefore, it is necessary to provide a considerable slack of the carrier tape CT3 between the tool C and the tool D in order to absorb a difference in pitch feed between the tools C and D and a difference in an IC chip mounting position (pitch).

In the latter case, if the IC chips mounted on the tool C and the tool D are different, the processing (thermocompression bonding) time of the TAB connection, that is, the cycle time differs. Therefore, it is necessary to provide a considerable slack of the carrier tape CT3 between the tool C and the tool D in order to absorb a difference in cycle time between the tools C and D.

As described above, in configuring the multichip module, the conventional electronic component mounting apparatus needs to provide a sufficient slack of the carrier tape between the tools for mounting each IC chip. In order to provide the slack of the carrier tape, an appropriate space is required.
The multi-chip module on which the C chip is mounted has a problem that the entire device becomes long.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and has as its object to reduce the overall length of an apparatus in assembling a multi-chip module on which a plurality of IC chips are mounted, thereby making it possible to effectively use equipment space. A mounting apparatus and an electronic component mounting method are provided.

[0019]

According to the present invention, there is provided an electronic component mounting apparatus comprising: at least one mounting table on which a flexible substrate for mounting an IC chip is guided; and an image processing apparatus which faces the mounting table. And at least one IC chip built-in head which operates and moves the XY table in accordance with information from the image processing apparatus.

According to the electronic component mounting method of the present invention, there is provided a mounting table on which a flexible tape-shaped base for mounting an IC chip is guided, and a positioning table provided at least by image processing provided so as to face the mounting table. Mobile IC
Comprising a chip-embedded head, a transport process in which the tape-shaped base material is guided along with the mounting table, without tension,
The approximate position on the mounting table is recognized by the first image processing with respect to the base material, and the IC is moved to a detailed position where the IC chip is mounted by the second image processing with respect to the base material.
A positioning process of moving the chip-incorporating head; and a mounting process of applying pressure to the mounting table by lowering the IC-chip-incorporating head, and attaching the IC chip to the substrate with heating. It is characterized by.

According to the electronic component mounting apparatus and the electronic component mounting method, the IC chip mounting head itself performs a positioning operation on the base material transported to the mounting table by using the image processing apparatus. Thereby, positioning suitable for mounting a plurality of IC chips on a base material is realized.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic diagram showing a main part configuration of an electronic component mounting apparatus constituting a multi-chip module according to a first embodiment. The figure shows the front side in the transport direction of the substrate on which the IC chip is mounted. The configuration of this embodiment is suitable for a tape carrier type electronic component mounting apparatus relating to a multi-chip module mounting a plurality of IC chips, as described below.

In FIG. 1, a carrier tape CT, which is a flexible tape-shaped base material for mounting an IC chip, is guided to the mounting table 11. The mounting table 11 has a heating function. And the IC chip built-in head 12
The XY table 121 allows the built-in head 12 to freely move on coordinates corresponding to the carrier tape CT.

That is, the image processing device 123 and the image processing device 123 are arranged so as to face the mounting table 11 near the built-in head 12.
124 are deployed. Thereby, the image processing apparatus 1
XY table 121 according to the information by 23 and 124
Is operated, so that the built-in head 12 itself can be positioned and moved.

The IC chip CHIP placed on the tray 13 including the XY table 131 is picked up by the robot arm 14 dedicated to pickup, and the IC chip built-in head 1 is used.
2 is held. Alternatively, the IC chip built-in head 12 may include an arm that can move so as to obtain the IC chip CHIP placed on the tray 13 by itself. In this case, the robot arm 14 dedicated to pickup is not required.

According to the above configuration, the IC chip built-in head 12 itself can be freely moved on the coordinates corresponding to the carrier tape CT. The approximate position of the carrier tape CT conveyed to the mounting table 11 is detected by the image processing device 123, and the more detailed position is detected by the image processing device 124.

For example, the detection of the approximate position is performed by recognizing a predetermined sprocket hole by feeding the carrier tape CT at a pitch. The latter detailed position detection is performed by recognizing an alignment mark provided near the sprocket hole of the carrier tape CT.

The built-in head 12 is aimed at a desired mounting position in accordance with the position detection. Thereafter, the built-in head 12 is lowered and pressurized toward the mounting table 11, and the desired IC chip CH is attached to the carrier tape CT with heating.
Implement IP.

With respect to such positioning and mounting, it is not necessary to move the mounting table 11 side, and it is not always necessary to loosen the carrier tape CT in the transport direction. Carrier tape CT
There is no need to provide a slack space. Therefore, the configuration is optimal for a multi-chip module in which a plurality of IC chips are mounted at predetermined positions on the carrier tape CT.

FIG. 2 is a schematic view showing a main part configuration of an electronic component mounting apparatus constituting a multi-chip module according to a second embodiment. In this example, a tape carrier type electronic component mounting apparatus for a multichip module mounting two IC chips is shown.

Each of the tools A and B has a combination of the mounting table 11a and the built-in head 12a and the combination of the mounting table 11b and the built-in head 12b having the same configuration as that of FIG. A first IC chip (not shown) is mounted on the tool A, and a second IC chip (not shown) is mounted on the tool B.

There is no slack in the carrier tape CT between the tool A and the tool B. The reason is that, as described in the first embodiment, the mounting tables 11a and 11b do not adjust the position of the carrier tape CT, but each of the IC chip built-in heads 12a and 12b moves the predetermined position with respect to the carrier tape CT. This is because positioning is performed by moving to the position.

In the second embodiment, the carrier tape C
T is rather back-tensioned by a tape guide wheel (111) or the like, and is always stretched. That is, the carrier tape CT is stretched by the tape guide wheel 111 on the mounting table 11a side while
The pitch is fed by the sprocket wheel 112 on the b side. With such a configuration, the tool A and the tool B can be installed close to each other, and an electronic component mounting device can be realized in a smaller device space.

The positions of the carrier tapes CT fed to the mounting tables 11a and 11b of the tools A and B at pitches are detected by the built-in heads 12a and 12b, respectively. That is,
Each of the built-in heads 12a and 12b includes an image processing device 123.
The predetermined sprocket holes of the carrier tape CT on each mounting table are recognized by a and b, and are roughly positioned. After that, each of the built-in heads 12a and 12b recognizes the alignment mark using the image processing devices 124a and 124b, and activates the XY tables 121a and 121b of each arrangement to be positioned in detail.

Thus, each built-in head 12a, b
Moves to a position above the detailed position where the first IC chip and the second IC chip are actually mounted, and the aiming is completed. Thereafter, the built-in heads 12a and 12b are respectively lowered and pressurized toward the mounting tables 11a and 11b.
A second IC chip is mounted (for example, TAB (Tape Automat
ed Bonding).

According to the above configuration, each built-in head 12
Regarding a and b, even if there is a difference in the pitch feed of the tools A and B and a difference in the mounting position (pitch) of the IC chip, the movement can be absorbed. Therefore, no space is required between the tool A and the tool B for providing the slack of the carrier tape CT.

Further, I which is mounted on the tool A and the tool B
Even if the C chip is different and the TAB connection processing (thermocompression bonding) time, that is, the cycle time differs, the pitch feed may be adjusted to the longer cycle time.
Accordingly, there is no need to provide a space between the tool A and the tool B for providing the slack of the carrier tape CT.

According to the above configuration, the IC chip mounting heads 12a and 12b can be freely moved on the coordinates corresponding to the carrier tape CT. This allows
In configuring a multichip module, it is necessary to provide a slack in the carrier tape between the tools.
It is not necessary to provide the carrier tape slack. As a result, even in a multi-chip module in which a plurality of IC chips are mounted, the entire electronic component mounting apparatus can be shortened,
Equipment space can be used effectively.

In each embodiment, the mounting table (11, 1
1a and b) have no XY table, but an XY table may be provided so that fine adjustment can be made according to the mounting position of each IC chip in the multichip module. At this time, a mode in which a pin is inserted into a sprocket hole as in the related art may be adopted.

[0040]

As described above, according to the present invention, the IC chip built-in head itself performs the positioning operation on the base material transported to the mounting table by using the image processing apparatus. As a result, it is possible to provide an electronic component mounting apparatus and an electronic component mounting method in which the entire apparatus can be shortened when assembling a multi-chip module mounting a plurality of IC chips, and the equipment space can be used effectively.

[Brief description of the drawings]

FIG. 1 is an outline view showing a main part configuration of an electronic component mounting apparatus constituting a multichip module according to a first embodiment.

FIG. 2 is an outline view showing a main part configuration of an electronic component mounting apparatus constituting a multi-chip module according to a second embodiment.

FIG. 3A is a schematic view showing a main part configuration of a conventional electronic component mounting apparatus, and FIG. 3B is a schematic view showing a carrier tape and a mounting table thereof.

FIG. 4 is a schematic view showing a configuration of a main part of a conventional electronic component mounting apparatus constituting a multichip module.

[Description of Signs] 11, 11a, 11b: Mounting table 111: Tape guide wheel 112: Sprocket wheel 12, 12a, 12b: IC chip built-in head 121, 121a, 121b, 131: XY table 123, 123a, 123b, 124, 124a, 12
4b: Image processing device 13: Tray 14: Robot arm A, B: Tool for mounting table and IC built-in head CHIP: IC chip CT: Carrier tape R1, R2: Reel

Claims (6)

[Claims] At least one mounting table on which a flexible tape-shaped substrate for mounting an IC chip is guided, and an image processing apparatus is provided so as to face the mounting table.
An electronic component mounting device, comprising: at least one IC chip built-in head that moves and positions an XY table in accordance with information from an image processing device. 2. The electronic component mounting apparatus according to claim 1, wherein the mounting table includes a mechanism that stretches the tape-shaped base material without loosening the base material in a direction of guiding the base material. 3. The electronic component mounting apparatus according to claim 1, wherein a plurality of pairs of one system configuration including the mounting table and the IC chip built-in head are provided. 4. A mounting table on which a flexible tape-shaped substrate for mounting an IC chip is guided, and an IC chip mounting head provided to face the mounting table and capable of at least positioning and moving by image processing. Comprising, a transport process in which the tape-shaped base material is guided to the mounting table with tension, and the first image processing with respect to the base material recognizes a general position on the mounting table, The IC is mounted on a substrate by a second image processing to a detailed position where the IC chip is mounted.
A positioning process for moving the chip-incorporating head; and a mounting process in which the IC chip-incorporating head is lowered to apply pressure toward the mounting table and to attach the IC chip to the base material with heating. An electronic component mounting method, characterized in that: 5. The electronic component mounting method according to claim 4, wherein in the first image processing, an opening used for transporting the base material is specified to detect a position. 6. The electronic component mounting method according to claim 4, wherein in the second image processing, a position is detected by using an alignment mark of the base material.