JPH04343240A - Tape carrier equipment - Google Patents

Abstract

PURPOSE:To inflict no damage on a specimen and to miniaturize a tape feeder and a tape container. CONSTITUTION:The slack detecting means 48, 49 and 68, 69 are arranged between a tape feeding reel 41 and a guide member 47 as well as between another guide member 67 and a tape winding reel 61 to form slackening parts 31a, 31b within specific range so that the rotation of the reels 41 and 61 may be controlled by the signals from the slack detecting means 48, 49 and 68, 69.

Description

[Detailed description of the invention]

0001

[Industrial Field of Application] The present invention relates to a tape conveying device.
In particular, it relates to a tape conveying device that sends a tape wound around a tape supply reel to a processing device such as a processing device or an inspection device section, performs processing such as processing or inspection, and then winds the tape onto a tape take-up reel after the processing is completed. .

0002

2. Description of the Related Art For example, a tape conveying device in a conventional tape bonding apparatus has a configuration as shown in FIG. The tape supply section 10 and tape storage section 20 are
They have almost the same structure and are disposed on both sides of the bonding device 30. The tape supply section 10 and the tape storage section 20 each include a tape supply reel 11 wound with a tape 31 and a spacer tape 32, a tape take-up reel 21 wound with the tape 31 and the spacer tape 32, and a guide for the tape 31. guide rollers 12 and 22 that apply tension to the tape 31; and tension rollers 13 and 2 that apply tension to the tape 31.
3, guide members 14 and 24 for horizontally holding the tape 31 in the bonding device 30 section, and a spacer tape take-up reel 15 for winding the spacer tape 32.
and a spacer tape supply reel 25 around which spacer tape 33 is wound. The tension rollers 13, 2
3 is rotatably supported at one end of dancer arms 17, 27 which are rotatably supported on support shafts 16, 26. Springs 18 and 28 are hung on the other ends of the dancer arms 17 and 27, and the tension rollers 13 and 23 apply tension to the tape 31 by the urging force of the springs 18 and 28.

Therefore, the tape 31 supplied from the tape supply reel 11 passes through the guide roller 12, tension roller 13, and guide member 14 to the bonding device 30.
The tape 31 that has been supplied to the bonding device 30 and processed or inspected by the bonding device 30 passes through the guide member 24, the tension roller 23, and the guide roller 22, and is wound onto the tape take-up reel 21. Further, the spacer tape 32 wound on the tape supply reel 11 is wound on the spacer tape take-up reel 15. Further, when the tape 31 is wound onto the tape take-up reel 21, it is wound together with the spacer tape 33 supplied from the spacer tape supply reel 25. Incidentally, examples of this type of tape conveying device include those disclosed in Japanese Patent Laid-Open Nos. 58-165335 and 63-20846.

0004

SUMMARY OF THE INVENTION In the prior art described above, in order to bend the tape 31 by the guide rollers 12, 22 and the tension rollers 13, 23, the lead formed on the tape 31 and the tape 31 are bonded by the bonding device 30. Excessive bending stress is applied to the semiconductor chips and the like, which may damage the tape 31 and the samples such as the semiconductor chips. In addition, tension mechanisms 13 and 1 are provided in the tape supply section 10 and the tape storage section 20, respectively.
7, 18 and 23, 27, 28, the unit of tape supply section 10 and tape storage section 20 becomes large in size.

SUMMARY OF THE INVENTION An object of the present invention is to provide a tape conveying device that does not damage a sample and can reduce the size of the tape supply unit and tape storage unit.

[0006]

[Means for Solving the Problems] In order to achieve the above object, the present invention has a configuration in which guide members for guiding the tape to the inlet and outlet sides of the processing section of the processing device are arranged on both sides of the processing device. The tape is sent from a tape supply reel wound with the tape to a processing device through the guide member on the entrance side, and the tape processed by the processing device is wound onto a tape take-up reel through the guide member on the exit side. In the conveyance device, a slack detection means is provided between the tape supply reel and the guide member on the entrance side and between the guide member on the exit side and the tape take-up reel so as to form a slack in the tape within a certain range, and this The present invention is characterized in that the rotation of the tape supply reel and the tape take-up reel is controlled by a signal from the slack detection means.

[0007]

[Operation] When the tape is subjected to a process such as bonding or inspection by the processing device and the tape is fed by a certain amount, the slack portion between the tape supply reel and the guide member in the tape supply section becomes smaller. Therefore, when the slack portion becomes smaller than a certain range, it is detected by the slack detection means, and the tape supply reel is rotated to supply the tape. When the slack portion increases beyond a certain range, it is detected by the slack detection means and the tape supply reel is stopped.

In the tape storage section, when a certain amount of processed tape is fed, the slack between the guide member and the tape take-up reel increases. Therefore, when the slack portion increases beyond a certain range, it is detected by the slack detection means, and the tape take-up reel is rotated to take up the tape. When the slack portion becomes smaller than a certain range, it is detected by the slack detection means and the tape take-up reel is stopped.

[0009]

[Embodiment] An embodiment of the present invention will be explained below with reference to FIG. A tape supply section 4 is provided on both sides of the bonding device 30.
0 and a tape storage section 60 are provided. tape 31
tape supply reel 4 wound with spacer tape 32 and
The supply reel shaft 42 on which the tape 31 and the spacer tape 33 are mounted, and the take-up reel shaft 62 on which the tape take-up reel 61 is mounted, which wind the tape 31 and the spacer tape 33, are respectively driven by motors 43 and 63 that can rotate in forward and reverse directions. A take-up reel shaft 45 on which a spacer tape take-up reel 44 for winding the spacer tape 32 is mounted and a supply reel shaft 65 on which a spacer tape supply reel 64 on which the spacer tape 33 is wound are mounted are driven by variable torque motors 46 and 66, respectively. Driven. Further, the tape 31 is placed inside the tape supply section 40 and the tape storage section 60 by the bonding device 3.
Guide members 47 and 67 are provided to guide the inlet and outlet sides of the bonding section 0.

Below the tape supply reel 41 and the tape take-up reel 61 are light reflective upper limit sensors 4, respectively.
Light reflection type lower limit sensors 49 and 69 similar to those shown in FIGS. 8 and 68 are provided. Further, between the tape supply reel 41 and the spacer tape take-up reel 44 and between the tape take-up reel 61 and the spacer tape supply reel 64, the spacer tapes 32 and 33 are connected to upper limit sensors 48 and 68, lower limit sensors 49,
Guide rollers 50 and 70 are arranged so as not to contact 69.

Furthermore, since this embodiment shows an example in which the bonding device 30 is applied, a tape back tension mechanism 75 and a tape feeding mechanism are provided between the guide member 47 and the bonding device 30 and between the bonding device 30 and the guide member 67, respectively. A mechanism 80 is provided. The tape back tension mechanism 75 includes a tension roller 76 that has a clutch mechanism and constantly applies back tension to the tape, and a rotatably disposed free roller 77 that presses the tape 31 against the tension roller 76. The tape feeding mechanism 80 includes a sprocket foil 81 that feeds the tape 31 by engaging with a sprocket hole formed on the side end side of the tape 31, and a sprocket foil 81 that feeds the tape 31.
A free roller 82 rotatably arranged to press against the
It consists of

Next, the operation will be explained. When bonding is completed by the bonding apparatus 30 for one device portion formed on the tape 31, the tape feeding mechanism 80 is driven to feed the next device portion of the tape 31 to the bonding portion, and bonding is applied to that device portion. Ru. This operation is repeated to sequentially bond the tape 31.

In this embodiment, the tape 31 forms slack portions 31a and 31b between the tape supply reel 41 and the guide member 47 and between the tape take-up reel 61 and the guide member 67. . That is, in the tape supply unit 40, the slack portion 31a of the tape 31 is in the state shown by the solid line, and as the tape 31 is fed intermittently as described above, the slack portion 31a is reduced as shown by the dotted line, and the upper limit sensor 48 is When the absence of the tape 31 is detected, the motor 43 is driven by the detection signal to rotate the tape supply reel 41 and supply the tape 31. Then, as the tape 31 is supplied, the slack portion 31a becomes larger as shown by the solid line, and the lower limit sensor 49 detects the tape 3.
1 is detected, the detection signal causes the motor 43 to stop and stop supplying the tape 31. In this way, the slack portion 3 corresponds to the range of the interval between the upper limit sensor 48 and the lower limit sensor 49.
1a is always formed. Therefore, the total length of the tape 31 of the slack portion 31a needs to be equal to or longer than the pitch of the device portions formed on the tape 31.

In the tape storage section 60, on the contrary, the tape 31 is fed from the tape feeding mechanism 80, and the slack portion 31b becomes large as shown by the solid line, and the lower limit sensor 69
When detects the tape 31, the motor 63 is driven by the detection signal to rotate the tape take-up reel 61,
Wind up the tape 31. Then, when the slack portion 31b of the tape 31 decreases as indicated by the dotted line and the upper limit sensor 68 no longer detects the tape 31, the motor 63 is stopped by the detection signal to stop winding the tape 31.

In this manner, the tape supply section 40 and the tape storage section 60 do not apply force to the tape 31 and only form the natural slack portions 31a and 31b, so that the tape 31 and the like are not damaged. Further, since the tape supply section 40 and the tape storage section 60 do not have a tape tension mechanism, the unit of the tape supply section 40 and the tape storage section 60 can be made smaller.

By the way, in the above embodiment, the case where this device is applied to a tape bonding device is explained.
A tape back tension mechanism 75 is provided to remove warps, twists, etc. of the tape 31 in the bonding section of the bonding device 30 for mounting a semiconductor chip. However, since the tape 31 is fed in a straight line between the guide members 47 and 67, the tape 31 is not damaged by the tension of the tape back tension mechanism 75. When this embodiment is applied to, for example, an inspection device, the tape back tension mechanism 75 may not be provided depending on the purpose of the inspection. Although the tape 31 is fed by the sprocket wheel 81, the tape 31 may be fed by holding the side ends of the tape 31 from above and below with a chuck means that opens and closes, or the tape 31 may be fed by engaging a feeding pin with a hole in the tape 31. Alternatively, the material may be simply held and fed by rollers from above and below. Furthermore, although a case has been described in which light reflection type upper limit sensors 48, 68 and lower limit sensors 49, 69 are used as the slack detection means, for example, a proximity sensor may be used.

2, 3, and 4 respectively show a bond checker 85, a potting device 86, and a marker device 87 to which the present invention is applied. The bond checker 85 is a device that inspects the bonded portion of the tape 31 to which the semiconductor chip is bonded by the bonding device 30 described above. The potting device 86 includes a potting section 86a for dripping an element protection resin so as to cover the semiconductor chip bonded by the bonding device 30 or the semiconductor chip in the bonded portion of a non-defective product inspected by the potting device 86, and a potting portion 86a for dripping the element protection resin so as to cover the semiconductor chip bonded by the bonding device 30 or the semiconductor chip in the bonded portion of a non-defective product inspected by the potting device 86. It has a baking oven 86b for drying the element protection resin. The marker device 87 marks the element protection resin dropped and dried by the potting device 86 and then applies UV
It is cured using an ultraviolet lamp).

Each of the above embodiments shows an example in which the present invention is applied to a single device. The present invention can also be applied to a case where the above-described devices are arranged in series and the tape 31 is subjected to continuous processing, as shown in FIG. In FIG. 5, 90
indicates a buffer device, with a constant tape 3 between the front and rear devices.
A slack of 1 is formed to prevent interference between devices.

[0019]

According to the present invention, the tape supply section and the tape storage section only form a natural slack portion without applying force to the tape, so that no damage is caused to the tape or the like. Further, since the tape supply section and tape storage section do not have a tape tension mechanism, the unit of the tape supply section and tape storage section can be made smaller.

[Brief explanation of drawings]

FIG. 1 is a schematic configuration diagram showing an embodiment of a bonding apparatus to which the present invention is applied.

FIG. 2 is a schematic configuration diagram showing an embodiment of a bond checker to which the present invention is applied.

FIG. 3 is a schematic configuration diagram showing an embodiment of a potting device to which the present invention is applied.

FIG. 4 is a schematic configuration diagram showing an embodiment of a marker device to which the present invention is applied.

FIG. 5 is a schematic configuration diagram showing an embodiment of an integrated continuous production apparatus to which the present invention is applied.

FIG. 6 is a schematic configuration diagram of a conventional example.

[Explanation of symbols]

30 Bonding equipment 31 Tape 40 Tape supply section 41 Tape supply reel 43 Motor 47 Guide member 48 Upper limit sensor 49 Lower limit sensor 60 Tape storage section 61 Tape take-up reel 63 Motor 67 Guide member 68 Upper limit sensor 69 Lower limit sensor

Claims (2)

[Claims] 1. Guide members for guiding the tape to the inlet and outlet sides of the processing section of the processing device are disposed on both sides of the processing device, and guide members are provided on both sides of the processing device to guide the tape to the inlet side from the tape supply reel around which the tape is wound. In a tape conveying device that sends a tape to a processing device through a guide member and winds the tape processed by the processing device onto a tape take-up reel through the guide member on the exit side, the A slack detection means is provided between the guide member on the exit side and the tape take-up reel so as to form a slack in the tape within a certain range, and a signal from the slack detection means rotates the tape supply reel and the tape take-up reel. A tape transport device characterized by controlling. 2. In claim 1, the slack detection means is provided below the corresponding tape supply reel and tape take-up reel, and includes an upper limit sensor for detecting the upper limit of the slack portion and a lower limit sensor for detecting the lower limit of the slack portion. 1. A tape conveyance device comprising: a lower limit sensor;