JP4698928B2 - Ｚｉｆソケット対応半導体デバイス及びｚｉｆソケットを用いた回路アセンブリ - Google Patents

Ｚｉｆソケット対応半導体デバイス及びｚｉｆソケットを用いた回路アセンブリ Download PDF

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Publication number
JP4698928B2
JP4698928B2 JP2002566547A JP2002566547A JP4698928B2 JP 4698928 B2 JP4698928 B2 JP 4698928B2 JP 2002566547 A JP2002566547 A JP 2002566547A JP 2002566547 A JP2002566547 A JP 2002566547A JP 4698928 B2 JP4698928 B2 JP 4698928B2
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JP
Japan
Prior art keywords
contact
circuit assembly
semiconductor device
socket
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2002566547A
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English (en)
Japanese (ja)
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JP2004523864A5 (enExample
JP2004523864A (ja
Inventor
アンドリック アンソニー
ヒル ルエル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2004523864A publication Critical patent/JP2004523864A/ja
Publication of JP2004523864A5 publication Critical patent/JP2004523864A5/ja
Application granted granted Critical
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2002566547A 2001-02-20 2002-02-06 Ｚｉｆソケット対応半導体デバイス及びｚｉｆソケットを用いた回路アセンブリ Expired - Fee Related JP4698928B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/789,141 2001-02-20
US09/789,141 US6551114B2 (en) 2001-02-20 2001-02-20 Semiconductor device having signal contacts and high current power contacts
PCT/US2002/003557 WO2002067322A2 (en) 2001-02-20 2002-02-06 Semiconductor device having signal contacts and high current power contacts

Publications (3)

Publication Number Publication Date
JP2004523864A JP2004523864A (ja) 2004-08-05
JP2004523864A5 JP2004523864A5 (enExample) 2005-12-22
JP4698928B2 true JP4698928B2 (ja) 2011-06-08

Family

ID=25146704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002566547A Expired - Fee Related JP4698928B2 (ja) 2001-02-20 2002-02-06 Ｚｉｆソケット対応半導体デバイス及びｚｉｆソケットを用いた回路アセンブリ

Country Status (8)

Country Link
US (1) US6551114B2 (enExample)
EP (1) EP1368861B1 (enExample)
JP (1) JP4698928B2 (enExample)
KR (1) KR100819192B1 (enExample)
CN (1) CN1251358C (enExample)
AU (1) AU2002240290A1 (enExample)
TW (1) TW546810B (enExample)
WO (1) WO2002067322A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2402886C (en) 2000-03-14 2012-02-14 James Hardie Research Pty Limited Fiber cement building materials with low density additives
MXPA03007890A (es) 2001-03-02 2003-12-04 James Hardie Res Pty Ltd Aparato para rociadura.
US20030164119A1 (en) 2002-03-04 2003-09-04 Basil Naji Additive for dewaterable slurry and slurry incorporating same
US6964584B2 (en) * 2001-12-21 2005-11-15 Intel Corporation Low impedance, high-power socket and method of using
US6752635B1 (en) * 2003-03-31 2004-06-22 Intel Corporation Comb-shaped land grid array (LGA) socket contact for improved power delivery
US8209927B2 (en) 2007-12-20 2012-07-03 James Hardie Technology Limited Structural fiber cement building materials
US9583125B1 (en) 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
US8079849B2 (en) * 2010-05-11 2011-12-20 Tyco Electronics Corporation Socket connector assembly with compressive contacts
CN113410748A (zh) * 2021-06-29 2021-09-17 弘凯光电(江苏)有限公司 镭射光源封装结构

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330163A (en) * 1979-12-05 1982-05-18 E. I. Du Pont De Nemours And Company Zero insertion force connector for LSI circuit package
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
JP3302720B2 (ja) * 1992-06-09 2002-07-15 ミネソタ マイニング アンド マニュファクチャリング カンパニー Ｉｃソケット
US5489218A (en) * 1994-03-24 1996-02-06 Hon Hai Precision Industry Co., Ltd. ZIF PGA socket and contact therein
US5483099A (en) 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
US5721673A (en) 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages
US5703402A (en) * 1995-11-13 1997-12-30 Acc Microelectronics Corporation Output mapping of die pad bonds in a ball grid array
US6084777A (en) * 1997-04-23 2000-07-04 Texas Instruments Incorporated Ball grid array package
US6020637A (en) * 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
US6160705A (en) * 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
AU1536599A (en) * 1997-11-28 1999-06-16 Pcd, Inc. Manually operated top loading socket for ball grid arrays
US6140581A (en) * 1997-12-03 2000-10-31 Mitsubishi Electronics America, Inc. Grounded packaged semiconductor structure and manufacturing method therefor
US6064113A (en) * 1998-01-13 2000-05-16 Lsi Logic Corporation Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances
US6075710A (en) * 1998-02-11 2000-06-13 Express Packaging Systems, Inc. Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips
US6297550B1 (en) * 1998-04-01 2001-10-02 Lsi Logic Corporation Bondable anodized aluminum heatspreader for semiconductor packages
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
TW421333U (en) * 1999-02-24 2001-02-01 Hung Rung Fang IC socket

Also Published As

Publication number Publication date
TW546810B (en) 2003-08-11
EP1368861A2 (en) 2003-12-10
KR100819192B1 (ko) 2008-04-04
AU2002240290A1 (en) 2002-09-04
WO2002067322A2 (en) 2002-08-29
US20020115325A1 (en) 2002-08-22
KR20040014457A (ko) 2004-02-14
JP2004523864A (ja) 2004-08-05
US6551114B2 (en) 2003-04-22
CN1251358C (zh) 2006-04-12
CN1491464A (zh) 2004-04-21
EP1368861B1 (en) 2011-09-28
WO2002067322A3 (en) 2002-12-19

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