JP2004523864A5 - - Google Patents

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Publication number
JP2004523864A5
JP2004523864A5 JP2002566547A JP2002566547A JP2004523864A5 JP 2004523864 A5 JP2004523864 A5 JP 2004523864A5 JP 2002566547 A JP2002566547 A JP 2002566547A JP 2002566547 A JP2002566547 A JP 2002566547A JP 2004523864 A5 JP2004523864 A5 JP 2004523864A5
Authority
JP
Japan
Prior art keywords
contact
circuit assembly
casing
semiconductor device
base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002566547A
Other languages
English (en)
Japanese (ja)
Other versions
JP4698928B2 (ja
JP2004523864A (ja
Filing date
Publication date
Priority claimed from US09/789,141 external-priority patent/US6551114B2/en
Application filed filed Critical
Publication of JP2004523864A publication Critical patent/JP2004523864A/ja
Publication of JP2004523864A5 publication Critical patent/JP2004523864A5/ja
Application granted granted Critical
Publication of JP4698928B2 publication Critical patent/JP4698928B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2002566547A 2001-02-20 2002-02-06 Ｚｉｆソケット対応半導体デバイス及びｚｉｆソケットを用いた回路アセンブリ Expired - Fee Related JP4698928B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/789,141 2001-02-20
US09/789,141 US6551114B2 (en) 2001-02-20 2001-02-20 Semiconductor device having signal contacts and high current power contacts
PCT/US2002/003557 WO2002067322A2 (en) 2001-02-20 2002-02-06 Semiconductor device having signal contacts and high current power contacts

Publications (3)

Publication Number Publication Date
JP2004523864A JP2004523864A (ja) 2004-08-05
JP2004523864A5 true JP2004523864A5 (enExample) 2005-12-22
JP4698928B2 JP4698928B2 (ja) 2011-06-08

Family

ID=25146704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002566547A Expired - Fee Related JP4698928B2 (ja) 2001-02-20 2002-02-06 Ｚｉｆソケット対応半導体デバイス及びｚｉｆソケットを用いた回路アセンブリ

Country Status (8)

Country Link
US (1) US6551114B2 (enExample)
EP (1) EP1368861B1 (enExample)
JP (1) JP4698928B2 (enExample)
KR (1) KR100819192B1 (enExample)
CN (1) CN1251358C (enExample)
AU (1) AU2002240290A1 (enExample)
TW (1) TW546810B (enExample)
WO (1) WO2002067322A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2402886C (en) 2000-03-14 2012-02-14 James Hardie Research Pty Limited Fiber cement building materials with low density additives
MXPA03007890A (es) 2001-03-02 2003-12-04 James Hardie Res Pty Ltd Aparato para rociadura.
US20030164119A1 (en) 2002-03-04 2003-09-04 Basil Naji Additive for dewaterable slurry and slurry incorporating same
US6964584B2 (en) * 2001-12-21 2005-11-15 Intel Corporation Low impedance, high-power socket and method of using
US6752635B1 (en) * 2003-03-31 2004-06-22 Intel Corporation Comb-shaped land grid array (LGA) socket contact for improved power delivery
US8209927B2 (en) 2007-12-20 2012-07-03 James Hardie Technology Limited Structural fiber cement building materials
US9583125B1 (en) 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
US8079849B2 (en) * 2010-05-11 2011-12-20 Tyco Electronics Corporation Socket connector assembly with compressive contacts
CN113410748A (zh) * 2021-06-29 2021-09-17 弘凯光电(江苏)有限公司 镭射光源封装结构

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330163A (en) * 1979-12-05 1982-05-18 E. I. Du Pont De Nemours And Company Zero insertion force connector for LSI circuit package
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
JP3302720B2 (ja) * 1992-06-09 2002-07-15 ミネソタ マイニング アンド マニュファクチャリング カンパニー Ｉｃソケット
US5489218A (en) * 1994-03-24 1996-02-06 Hon Hai Precision Industry Co., Ltd. ZIF PGA socket and contact therein
US5483099A (en) 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
US5721673A (en) 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages
US5703402A (en) * 1995-11-13 1997-12-30 Acc Microelectronics Corporation Output mapping of die pad bonds in a ball grid array
US6084777A (en) * 1997-04-23 2000-07-04 Texas Instruments Incorporated Ball grid array package
US6020637A (en) * 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
US6160705A (en) * 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
AU1536599A (en) * 1997-11-28 1999-06-16 Pcd, Inc. Manually operated top loading socket for ball grid arrays
US6140581A (en) * 1997-12-03 2000-10-31 Mitsubishi Electronics America, Inc. Grounded packaged semiconductor structure and manufacturing method therefor
US6064113A (en) * 1998-01-13 2000-05-16 Lsi Logic Corporation Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances
US6075710A (en) * 1998-02-11 2000-06-13 Express Packaging Systems, Inc. Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips
US6297550B1 (en) * 1998-04-01 2001-10-02 Lsi Logic Corporation Bondable anodized aluminum heatspreader for semiconductor packages
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
TW421333U (en) * 1999-02-24 2001-02-01 Hung Rung Fang IC socket

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