CN1251358C - 具有信号接点与高电流功率接点的半导体装置 - Google Patents

具有信号接点与高电流功率接点的半导体装置 Download PDF

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Publication number
CN1251358C
CN1251358C CNB028049942A CN02804994A CN1251358C CN 1251358 C CN1251358 C CN 1251358C CN B028049942 A CNB028049942 A CN B028049942A CN 02804994 A CN02804994 A CN 02804994A CN 1251358 C CN1251358 C CN 1251358C
Authority
CN
China
Prior art keywords
contact
semiconductor chip
contact pad
base portion
housing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB028049942A
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English (en)
Chinese (zh)
Other versions
CN1491464A (zh
Inventor
A·安德里奇
R·希尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GlobalFoundries US Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of CN1491464A publication Critical patent/CN1491464A/zh
Application granted granted Critical
Publication of CN1251358C publication Critical patent/CN1251358C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CNB028049942A 2001-02-20 2002-02-06 具有信号接点与高电流功率接点的半导体装置 Expired - Lifetime CN1251358C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/789,141 2001-02-20
US09/789,141 US6551114B2 (en) 2001-02-20 2001-02-20 Semiconductor device having signal contacts and high current power contacts

Publications (2)

Publication Number Publication Date
CN1491464A CN1491464A (zh) 2004-04-21
CN1251358C true CN1251358C (zh) 2006-04-12

Family

ID=25146704

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB028049942A Expired - Lifetime CN1251358C (zh) 2001-02-20 2002-02-06 具有信号接点与高电流功率接点的半导体装置

Country Status (8)

Country Link
US (1) US6551114B2 (enExample)
EP (1) EP1368861B1 (enExample)
JP (1) JP4698928B2 (enExample)
KR (1) KR100819192B1 (enExample)
CN (1) CN1251358C (enExample)
AU (1) AU2002240290A1 (enExample)
TW (1) TW546810B (enExample)
WO (1) WO2002067322A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7396402B2 (en) 2001-03-02 2008-07-08 James Hardie International Finance B.V. Coatings for building products and dewatering aid for use with same
US7419544B2 (en) 2001-03-02 2008-09-02 James Hardie International Finance B.V. Additive for dewaterable slurry and slurry incorporating same
US7658794B2 (en) 2000-03-14 2010-02-09 James Hardie Technology Limited Fiber cement building materials with low density additives
US8209927B2 (en) 2007-12-20 2012-07-03 James Hardie Technology Limited Structural fiber cement building materials

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6964584B2 (en) * 2001-12-21 2005-11-15 Intel Corporation Low impedance, high-power socket and method of using
US6752635B1 (en) * 2003-03-31 2004-06-22 Intel Corporation Comb-shaped land grid array (LGA) socket contact for improved power delivery
US9583125B1 (en) 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
US8079849B2 (en) * 2010-05-11 2011-12-20 Tyco Electronics Corporation Socket connector assembly with compressive contacts
CN113410748A (zh) * 2021-06-29 2021-09-17 弘凯光电(江苏)有限公司 镭射光源封装结构

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330163A (en) * 1979-12-05 1982-05-18 E. I. Du Pont De Nemours And Company Zero insertion force connector for LSI circuit package
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
JP3302720B2 (ja) * 1992-06-09 2002-07-15 ミネソタ マイニング アンド マニュファクチャリング カンパニー Ｉｃソケット
US5489218A (en) * 1994-03-24 1996-02-06 Hon Hai Precision Industry Co., Ltd. ZIF PGA socket and contact therein
US5483099A (en) 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
US5721673A (en) 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages
US5703402A (en) * 1995-11-13 1997-12-30 Acc Microelectronics Corporation Output mapping of die pad bonds in a ball grid array
US6084777A (en) * 1997-04-23 2000-07-04 Texas Instruments Incorporated Ball grid array package
US6020637A (en) * 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
US6160705A (en) * 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
AU1536599A (en) * 1997-11-28 1999-06-16 Pcd, Inc. Manually operated top loading socket for ball grid arrays
US6140581A (en) * 1997-12-03 2000-10-31 Mitsubishi Electronics America, Inc. Grounded packaged semiconductor structure and manufacturing method therefor
US6064113A (en) * 1998-01-13 2000-05-16 Lsi Logic Corporation Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances
US6075710A (en) * 1998-02-11 2000-06-13 Express Packaging Systems, Inc. Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips
US6297550B1 (en) * 1998-04-01 2001-10-02 Lsi Logic Corporation Bondable anodized aluminum heatspreader for semiconductor packages
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same
TW421333U (en) * 1999-02-24 2001-02-01 Hung Rung Fang IC socket

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7658794B2 (en) 2000-03-14 2010-02-09 James Hardie Technology Limited Fiber cement building materials with low density additives
US7727329B2 (en) 2000-03-14 2010-06-01 James Hardie Technology Limited Fiber cement building materials with low density additives
US8182606B2 (en) 2000-03-14 2012-05-22 James Hardie Technology Limited Fiber cement building materials with low density additives
US8603239B2 (en) 2000-03-14 2013-12-10 James Hardie Technology Limited Fiber cement building materials with low density additives
US7396402B2 (en) 2001-03-02 2008-07-08 James Hardie International Finance B.V. Coatings for building products and dewatering aid for use with same
US7419544B2 (en) 2001-03-02 2008-09-02 James Hardie International Finance B.V. Additive for dewaterable slurry and slurry incorporating same
US7704316B2 (en) 2001-03-02 2010-04-27 James Hardie Technology Limited Coatings for building products and methods of making same
US8209927B2 (en) 2007-12-20 2012-07-03 James Hardie Technology Limited Structural fiber cement building materials

Also Published As

Publication number Publication date
TW546810B (en) 2003-08-11
EP1368861A2 (en) 2003-12-10
KR100819192B1 (ko) 2008-04-04
AU2002240290A1 (en) 2002-09-04
WO2002067322A2 (en) 2002-08-29
JP4698928B2 (ja) 2011-06-08
US20020115325A1 (en) 2002-08-22
KR20040014457A (ko) 2004-02-14
JP2004523864A (ja) 2004-08-05
US6551114B2 (en) 2003-04-22
CN1491464A (zh) 2004-04-21
EP1368861B1 (en) 2011-09-28
WO2002067322A3 (en) 2002-12-19

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
ASS Succession or assignment of patent right

Owner name: GLOBALFOUNDRIES

Free format text: FORMER OWNER: ADVANCED MICRO DEVICES INC.

Effective date: 20100702

C41 Transfer of patent application or patent right or utility model
COR Change of bibliographic data

Free format text: CORRECT: ADDRESS; FROM: CALIFORNIA, THE UNITED STATES TO: CAYMAN ISLANDS, BRITISH

TR01 Transfer of patent right

Effective date of registration: 20100702

Address after: Grand Cayman, Cayman Islands

Patentee after: Globalfoundries Semiconductor Inc.

Address before: American California

Patentee before: Advanced Micro Devices Inc.

TR01 Transfer of patent right

Effective date of registration: 20210310

Address after: California, USA

Patentee after: Lattice chip (USA) integrated circuit technology Co.,Ltd.

Address before: Greater Cayman Islands, British Cayman Islands

Patentee before: GLOBALFOUNDRIES Inc.

TR01 Transfer of patent right
CX01 Expiry of patent term

Granted publication date: 20060412

CX01 Expiry of patent term