KR100819192B1 - 신호 접촉들 및 고전류 전원 접촉들을 갖는 반도체 디바이스 - Google Patents

신호 접촉들 및 고전류 전원 접촉들을 갖는 반도체 디바이스 Download PDF

Info

Publication number
KR100819192B1
KR100819192B1 KR1020037010631A KR20037010631A KR100819192B1 KR 100819192 B1 KR100819192 B1 KR 100819192B1 KR 1020037010631 A KR1020037010631 A KR 1020037010631A KR 20037010631 A KR20037010631 A KR 20037010631A KR 100819192 B1 KR100819192 B1 KR 100819192B1
Authority
KR
South Korea
Prior art keywords
contact
contacts
case
base
semiconductor die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020037010631A
Other languages
English (en)
Korean (ko)
Other versions
KR20040014457A (ko
Inventor
앤소니 앤드릭
루엘 힐
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20040014457A publication Critical patent/KR20040014457A/ko
Application granted granted Critical
Publication of KR100819192B1 publication Critical patent/KR100819192B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1092—Plug-in assemblages of components, e.g. IC sockets with built-in components, e.g. intelligent sockets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1007—Plug-in assemblages of components, e.g. IC sockets with means for increasing contact pressure at the end of engagement of coupling parts

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Connecting Device With Holders (AREA)
  • Lead Frames For Integrated Circuits (AREA)
KR1020037010631A 2001-02-20 2002-02-06 신호 접촉들 및 고전류 전원 접촉들을 갖는 반도체 디바이스 Expired - Fee Related KR100819192B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/789,141 2001-02-20
US09/789,141 US6551114B2 (en) 2001-02-20 2001-02-20 Semiconductor device having signal contacts and high current power contacts
PCT/US2002/003557 WO2002067322A2 (en) 2001-02-20 2002-02-06 Semiconductor device having signal contacts and high current power contacts

Publications (2)

Publication Number Publication Date
KR20040014457A KR20040014457A (ko) 2004-02-14
KR100819192B1 true KR100819192B1 (ko) 2008-04-04

Family

ID=25146704

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037010631A Expired - Fee Related KR100819192B1 (ko) 2001-02-20 2002-02-06 신호 접촉들 및 고전류 전원 접촉들을 갖는 반도체 디바이스

Country Status (8)

Country Link
US (1) US6551114B2 (enExample)
EP (1) EP1368861B1 (enExample)
JP (1) JP4698928B2 (enExample)
KR (1) KR100819192B1 (enExample)
CN (1) CN1251358C (enExample)
AU (1) AU2002240290A1 (enExample)
TW (1) TW546810B (enExample)
WO (1) WO2002067322A2 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2402886C (en) 2000-03-14 2012-02-14 James Hardie Research Pty Limited Fiber cement building materials with low density additives
MXPA03007890A (es) 2001-03-02 2003-12-04 James Hardie Res Pty Ltd Aparato para rociadura.
US20030164119A1 (en) 2002-03-04 2003-09-04 Basil Naji Additive for dewaterable slurry and slurry incorporating same
US6964584B2 (en) * 2001-12-21 2005-11-15 Intel Corporation Low impedance, high-power socket and method of using
US6752635B1 (en) * 2003-03-31 2004-06-22 Intel Corporation Comb-shaped land grid array (LGA) socket contact for improved power delivery
US8209927B2 (en) 2007-12-20 2012-07-03 James Hardie Technology Limited Structural fiber cement building materials
US9583125B1 (en) 2009-12-16 2017-02-28 Magnecomp Corporation Low resistance interface metal for disk drive suspension component grounding
US8079849B2 (en) * 2010-05-11 2011-12-20 Tyco Electronics Corporation Socket connector assembly with compressive contacts
CN113410748A (zh) * 2021-06-29 2021-09-17 弘凯光电(江苏)有限公司 镭射光源封装结构

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6140581A (en) 1997-12-03 2000-10-31 Mitsubishi Electronics America, Inc. Grounded packaged semiconductor structure and manufacturing method therefor
US6160705A (en) 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
US6168449B1 (en) 1999-02-24 2001-01-02 Industrial Technology Research Institute Test sockets for integrated circuits

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4330163A (en) * 1979-12-05 1982-05-18 E. I. Du Pont De Nemours And Company Zero insertion force connector for LSI circuit package
US5258648A (en) * 1991-06-27 1993-11-02 Motorola, Inc. Composite flip chip semiconductor device with an interposer having test contacts formed along its periphery
JP3302720B2 (ja) * 1992-06-09 2002-07-15 ミネソタ マイニング アンド マニュファクチャリング カンパニー Ｉｃソケット
US5489218A (en) * 1994-03-24 1996-02-06 Hon Hai Precision Industry Co., Ltd. ZIF PGA socket and contact therein
US5483099A (en) 1994-08-31 1996-01-09 Intel Corporation Standardized power and ground design for pin grid array packages
US5528083A (en) * 1994-10-04 1996-06-18 Sun Microsystems, Inc. Thin film chip capacitor for electrical noise reduction in integrated circuits
US5721673A (en) 1995-10-05 1998-02-24 Micron Electronics, Inc. Socket for retaining multiple electronic packages
US5703402A (en) * 1995-11-13 1997-12-30 Acc Microelectronics Corporation Output mapping of die pad bonds in a ball grid array
US6084777A (en) * 1997-04-23 2000-07-04 Texas Instruments Incorporated Ball grid array package
US6020637A (en) * 1997-05-07 2000-02-01 Signetics Kp Co., Ltd. Ball grid array semiconductor package
AU1536599A (en) * 1997-11-28 1999-06-16 Pcd, Inc. Manually operated top loading socket for ball grid arrays
US6064113A (en) * 1998-01-13 2000-05-16 Lsi Logic Corporation Semiconductor device package including a substrate having bonding fingers within an electrically conductive ring surrounding a die area and a combined power and ground plane to stabilize signal path impedances
US6075710A (en) * 1998-02-11 2000-06-13 Express Packaging Systems, Inc. Low-cost surface-mount compatible land-grid array (LGA) chip scale package (CSP) for packaging solder-bumped flip chips
US6297550B1 (en) * 1998-04-01 2001-10-02 Lsi Logic Corporation Bondable anodized aluminum heatspreader for semiconductor packages
US5903050A (en) * 1998-04-30 1999-05-11 Lsi Logic Corporation Semiconductor package having capacitive extension spokes and method for making the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6160705A (en) 1997-05-09 2000-12-12 Texas Instruments Incorporated Ball grid array package and method using enhanced power and ground distribution circuitry
US6140581A (en) 1997-12-03 2000-10-31 Mitsubishi Electronics America, Inc. Grounded packaged semiconductor structure and manufacturing method therefor
US6168449B1 (en) 1999-02-24 2001-01-02 Industrial Technology Research Institute Test sockets for integrated circuits

Also Published As

Publication number Publication date
TW546810B (en) 2003-08-11
EP1368861A2 (en) 2003-12-10
AU2002240290A1 (en) 2002-09-04
WO2002067322A2 (en) 2002-08-29
JP4698928B2 (ja) 2011-06-08
US20020115325A1 (en) 2002-08-22
KR20040014457A (ko) 2004-02-14
JP2004523864A (ja) 2004-08-05
US6551114B2 (en) 2003-04-22
CN1251358C (zh) 2006-04-12
CN1491464A (zh) 2004-04-21
EP1368861B1 (en) 2011-09-28
WO2002067322A3 (en) 2002-12-19

Similar Documents

Publication Publication Date Title
US5913687A (en) Replacement chip module
KR100509967B1 (ko) 멀티모드 유연접속기 및 그것을 사용하는 교체가능한 칩모듈
EP0742682B1 (en) Low-profile socketed integrated circuit packaging system
US6409521B1 (en) Multi-mode compliant connector and replaceable chip module utilizing the same
US7658617B1 (en) Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposer
KR101257143B1 (ko) Ｌｇａ 소켓들을 위한 적재 메카니즘에 대항하는 수평력을 위한 장치, 방법 및 시스템
JPH11233216A (ja) テスト用ｉｃソケット
US20060125501A1 (en) Modularized probe head
US5671121A (en) Kangaroo multi-package interconnection concept
KR100819192B1 (ko) 신호 접촉들 및 고전류 전원 접촉들을 갖는 반도체 디바이스
US5947751A (en) Production and test socket for ball grid array semiconductor package
US6890186B2 (en) Socket structure for grid array (GA) packages
JP2004517450A (ja) 電流搬送能力を向上させ、より高いｉｃ電力送付が得られるソケット／パッケージ・パワー／グランド・バー装置
US6364669B1 (en) Spring contact for providing high current power to an integrated circuit
US7241147B2 (en) Making electrical connections between a circuit board and an integrated circuit
US6367763B1 (en) Test mounting for grid array packages
KR100522753B1 (ko) 모듈형 ｉｃ 소켓
CN111342251B (zh) 插座组件的电力供给
CN201130744Y (zh) 电连接器端子
KR200422929Y1 (ko) 집적회로 소자용 소켓.
JPH11233217A (ja) グリッド配列パッケージの取付器具
US20060022327A1 (en) Enhanced PGA interconnection
Rathburn Replaceable chip module (RCM/sup TM/)
JP2000174178A (ja) 変換モジュール
JP2000138330A (ja) 変換モジュール

Legal Events

Date Code Title Description
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

R15-X000 Change to inventor requested

St.27 status event code: A-3-3-R10-R15-oth-X000

R16-X000 Change to inventor recorded

St.27 status event code: A-3-3-R10-R16-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20130305

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20140228

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20150302

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

FPAY Annual fee payment

Payment date: 20160303

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20170302

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20180328

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20180328