JP4695014B2 - 接合方法及びこの方法により作成されるデバイス並びに接合装置 - Google Patents

接合方法及びこの方法により作成されるデバイス並びに接合装置 Download PDF

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JP4695014B2
JP4695014B2 JP2006129069A JP2006129069A JP4695014B2 JP 4695014 B2 JP4695014 B2 JP 4695014B2 JP 2006129069 A JP2006129069 A JP 2006129069A JP 2006129069 A JP2006129069 A JP 2006129069A JP 4695014 B2 JP4695014 B2 JP 4695014B2
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bonding
bonded
plasma
treatment
joining
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JP2006248895A5 (enrdf_load_stackoverflow
JP2006248895A (ja
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朗 山内
唯知 須賀
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Bondtech Inc
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Bondtech Inc
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JP2006129069A 2003-12-02 2006-05-08 接合方法及びこの方法により作成されるデバイス並びに接合装置 Expired - Lifetime JP4695014B2 (ja)

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JP2006129069A JP4695014B2 (ja) 2003-12-02 2006-05-08 接合方法及びこの方法により作成されるデバイス並びに接合装置

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JP2003402527 2003-12-02
JP2003402527 2003-12-02
JP2006129069A JP4695014B2 (ja) 2003-12-02 2006-05-08 接合方法及びこの方法により作成されるデバイス並びに接合装置

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JP2006248895A JP2006248895A (ja) 2006-09-21
JP2006248895A5 JP2006248895A5 (enrdf_load_stackoverflow) 2008-01-17
JP4695014B2 true JP4695014B2 (ja) 2011-06-08

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Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008235776A (ja) * 2007-03-23 2008-10-02 Sumco Corp 貼り合わせウェーハの製造方法
TWI533394B (zh) 2007-06-21 2016-05-11 尼康股份有限公司 Conveying method and conveying device
JP5433971B2 (ja) * 2008-04-16 2014-03-05 株式会社ニコン 基板重ね合わせ装置、基板保持装置および半導体装置の製造方法
JP5132534B2 (ja) 2008-12-01 2013-01-30 日本電波工業株式会社 光学部品の製造方法
CN102333738B (zh) 2009-02-25 2015-07-15 精工电子有限公司 阳极接合方法、阳极接合夹具以及阳极接合装置
JP5392105B2 (ja) * 2009-03-23 2014-01-22 ボンドテック株式会社 接合装置、接合方法および半導体装置
JP5613580B2 (ja) * 2011-02-09 2014-10-22 三菱電機株式会社 基板の製造方法
JP6487355B2 (ja) * 2016-03-08 2019-03-20 ボンドテック株式会社 アライメント装置
JP6307730B1 (ja) * 2016-09-29 2018-04-11 株式会社新川 半導体装置の製造方法、及び実装装置
JP6867686B2 (ja) * 2017-06-30 2021-05-12 株式会社 セルバック 接合装置
JP6986105B2 (ja) * 2018-07-05 2021-12-22 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウエハの永久接合方法
JP7258992B2 (ja) * 2018-07-05 2023-04-17 エーファウ・グループ・エー・タルナー・ゲーエムベーハー ウエハの永久接合方法
JP7482995B2 (ja) * 2019-10-21 2024-05-14 クオンタム ヴァリー アイデアズ ラボラトリーズ 誘電体本体に接合された１つまたは複数の光学窓を有する蒸気セルの製造

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59174549A (ja) * 1983-03-18 1984-10-03 Yokogawa Hokushin Electric Corp 金属とガラスの接合方法
JPH0391227A (ja) * 1989-09-01 1991-04-16 Nippon Soken Inc 半導体基板の接着方法
JPH07294862A (ja) * 1994-04-22 1995-11-10 Sumitomo Electric Ind Ltd 酸化物誘電体薄膜およびその製造方法
JPH08244155A (ja) * 1995-03-14 1996-09-24 Canon Inc 固相接合法
JPH10107295A (ja) * 1996-09-30 1998-04-24 Nissan Motor Co Ltd 半導体センサ
JP2002504977A (ja) * 1997-05-21 2002-02-12 レッドウッド マイクロシステムズ インコーポレイテッド 低電力の熱空気圧マイクロ弁
JP3858405B2 (ja) * 1998-01-05 2006-12-13 セイコーエプソン株式会社 基板の陽極接合方法及び基板の接合装置
JP2002086738A (ja) * 2000-09-13 2002-03-26 Ricoh Co Ltd 液滴吐出ヘッドの製造方法
JP2002160361A (ja) * 2000-11-22 2002-06-04 Ricoh Co Ltd 液滴吐出ヘッド
JP2001233640A (ja) * 2001-01-29 2001-08-28 Seiko Epson Corp マイクロメカニカルデバイスの製造方法

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