JP4680501B2 - 共焦点ウェハ検査系 - Google Patents

共焦点ウェハ検査系 Download PDF

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Publication number
JP4680501B2
JP4680501B2 JP2003538682A JP2003538682A JP4680501B2 JP 4680501 B2 JP4680501 B2 JP 4680501B2 JP 2003538682 A JP2003538682 A JP 2003538682A JP 2003538682 A JP2003538682 A JP 2003538682A JP 4680501 B2 JP4680501 B2 JP 4680501B2
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JP
Japan
Prior art keywords
confocal
wafer
chromaticity
height
bump
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2003538682A
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English (en)
Japanese (ja)
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JP2005506710A5 (enExample
JP2005506710A (ja
Inventor
ゲッフェン、ミヒャエル
レヴィ、ヤキ
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Camtek Ltd
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Camtek Ltd
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Publication date
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=11075841&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP4680501(B2) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Camtek Ltd filed Critical Camtek Ltd
Publication of JP2005506710A publication Critical patent/JP2005506710A/ja
Publication of JP2005506710A5 publication Critical patent/JP2005506710A5/ja
Application granted granted Critical
Publication of JP4680501B2 publication Critical patent/JP4680501B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G02B21/0052—Optical details of the image generation
    • G02B21/006—Optical details of the image generation focusing arrangements; selection of the plane to be imaged
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/026—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by measuring distance between sensor and object
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G02B21/0024—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders
    • G02B21/0028—Confocal scanning microscopes (CSOMs) or confocal "macroscopes"; Accessories which are not restricted to use with CSOMs, e.g. sample holders specially adapted for specific applications, e.g. for endoscopes, ophthalmoscopes, attachments to conventional microscopes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/50—Using chromatic effects to achieve wavelength-dependent depth resolution

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Optics & Photonics (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Ophthalmology & Optometry (AREA)
  • Radiology & Medical Imaging (AREA)
  • Surgery (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2003538682A 2001-10-25 2002-10-21 共焦点ウェハ検査系 Expired - Lifetime JP4680501B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL146174A IL146174A (en) 2001-10-25 2001-10-25 Confocal system for testing woofers
PCT/IL2002/000841 WO2003036227A1 (en) 2001-10-25 2002-10-21 Confocal wafer-inspection system and method

Publications (3)

Publication Number Publication Date
JP2005506710A JP2005506710A (ja) 2005-03-03
JP2005506710A5 JP2005506710A5 (enExample) 2005-12-22
JP4680501B2 true JP4680501B2 (ja) 2011-05-11

Family

ID=11075841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003538682A Expired - Lifetime JP4680501B2 (ja) 2001-10-25 2002-10-21 共焦点ウェハ検査系

Country Status (5)

Country Link
US (1) US6934019B2 (enExample)
EP (1) EP1440285A1 (enExample)
JP (1) JP4680501B2 (enExample)
IL (1) IL146174A (enExample)
WO (1) WO2003036227A1 (enExample)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6324298B1 (en) * 1998-07-15 2001-11-27 August Technology Corp. Automated wafer defect inspection system and a process of performing such inspection
DE102004049541A1 (de) * 2004-10-12 2006-04-20 Precitec Optronik Gmbh Meßsystem zur Vermessung von Oberflächen sowie Kalibrierverfahren hierfür
US7477401B2 (en) 2004-11-24 2009-01-13 Tamar Technology, Inc. Trench measurement system employing a chromatic confocal height sensor and a microscope
CN1300563C (zh) * 2005-03-24 2007-02-14 华中科技大学 一种微型三维自扫描共焦显微镜
US7551272B2 (en) * 2005-11-09 2009-06-23 Aceris 3D Inspection Inc. Method and an apparatus for simultaneous 2D and 3D optical inspection and acquisition of optical inspection data of an object
JP2007225481A (ja) * 2006-02-24 2007-09-06 Hitachi High-Technologies Corp ボールバンプウエハ検査装置
DE102006036504A1 (de) * 2006-08-04 2008-02-07 Vistec Semiconductor Systems Gmbh Vorrichtung und Verfahren zur Messung des Höhenprofils eines strukturierten Substrats
JP2008170366A (ja) 2007-01-15 2008-07-24 Disco Abrasive Syst Ltd チャックテーブルに保持された被加工物の計測装置およびレーザー加工機
US7535560B2 (en) * 2007-02-26 2009-05-19 Aceris 3D Inspection Inc. Method and system for the inspection of integrated circuit devices having leads
DE202007014435U1 (de) * 2007-10-16 2009-03-05 Gurny, Eric Optischer Sensor für eine Messvorrichtung
US7990522B2 (en) 2007-11-14 2011-08-02 Mitutoyo Corporation Dynamic compensation of chromatic point sensor intensity profile data selection
US7873488B2 (en) * 2008-12-08 2011-01-18 Mitutoyo Corporation On-site calibration method and object for chromatic point sensors
US8144968B2 (en) * 2009-01-12 2012-03-27 Aceris 3D Inspection Inc. Method and apparatus for scanning substrates
TWI490444B (zh) * 2009-01-23 2015-07-01 Univ Nat Taipei Technology 線型多波長共焦顯微方法與系統
FR2942533B1 (fr) * 2009-02-25 2011-06-24 Altatech Semiconductor Dispositif et procede d'inspection de plaquettes semi-conductrices
US7876456B2 (en) * 2009-05-11 2011-01-25 Mitutoyo Corporation Intensity compensation for interchangeable chromatic point sensor components
US8860931B2 (en) 2012-02-24 2014-10-14 Mitutoyo Corporation Chromatic range sensor including measurement reliability characterization
US8928874B2 (en) 2012-02-24 2015-01-06 Mitutoyo Corporation Method for identifying abnormal spectral profiles measured by a chromatic confocal range sensor
EP3208585B1 (en) * 2013-05-27 2019-11-27 GasPorOx AB System and method for determining a concentration of a gas in a container
US9772297B2 (en) 2014-02-12 2017-09-26 Kla-Tencor Corporation Apparatus and methods for combined brightfield, darkfield, and photothermal inspection
US9885671B2 (en) 2014-06-09 2018-02-06 Kla-Tencor Corporation Miniaturized imaging apparatus for wafer edge
US9645097B2 (en) 2014-06-20 2017-05-09 Kla-Tencor Corporation In-line wafer edge inspection, wafer pre-alignment, and wafer cleaning
US9261351B1 (en) * 2015-03-04 2016-02-16 Mitutoyo Corporation Chromatic range sensor including high sensitivity measurement mode
EP3222965B1 (en) 2016-03-25 2020-01-15 Fogale Nanotech Chromatic confocal device and method for 2d/3d inspection of an object such as a wafer with variable spatial resolution
EP3222964B1 (en) 2016-03-25 2020-01-15 Fogale Nanotech Chromatic confocal device and method for 2d/3d inspection of an object such as a wafer
US10317344B2 (en) 2016-09-07 2019-06-11 Kla-Tencor Corporation Speed enhancement of chromatic confocal metrology
JP6919458B2 (ja) * 2017-09-26 2021-08-18 オムロン株式会社 変位計測装置、計測システム、および変位計測方法
CN112147622B (zh) * 2020-09-02 2024-02-06 Oppo广东移动通信有限公司 测距装置、测距方法、摄像头及电子设备
EP4291854A1 (en) * 2021-02-15 2023-12-20 Amgen, Inc Systems and methods for automated in-line plunger depth measurement
CN120426883A (zh) * 2025-06-05 2025-08-05 中国计量科学研究院 一种晶圆几何特征的光谱共焦测量设备及方法

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0540821A (ja) * 1991-08-03 1993-02-19 Omron Corp 三次元計測装置
US5479252A (en) 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
JPH07190753A (ja) * 1993-12-27 1995-07-28 Olympus Optical Co Ltd 走査型プローブ顕微鏡
FR2716727B1 (fr) 1994-02-25 1996-04-19 Cohen Sabban Joseph Dispositif de tomographie optique en champ coloré.
US5991040A (en) 1995-06-30 1999-11-23 Siemens Aktiengesellschaft Optical distance sensor
FR2738343B1 (fr) 1995-08-30 1997-10-24 Cohen Sabban Joseph Dispositif de microstratigraphie optique
JPH09306977A (ja) * 1996-05-14 1997-11-28 Komatsu Ltd ウエハ検査装置等におけるウエハの位置決め方法
EP0916981B1 (en) * 1997-11-17 2004-07-28 Max-Planck-Gesellschaft zur Förderung der Wissenschaften e.V. Confocal spectroscopy system and method
JP3767161B2 (ja) * 1998-04-02 2006-04-19 オムロン株式会社 高さ測定装置および高さ測定方法および観測装置
US6167148A (en) 1998-06-30 2000-12-26 Ultrapointe Corporation Method and system for inspecting the surface of a wafer
JP3501672B2 (ja) * 1999-04-02 2004-03-02 株式会社東京精密 表面画像投影装置及び方法
JP3544892B2 (ja) * 1999-05-12 2004-07-21 株式会社東京精密 外観検査方法及び装置
JP3706504B2 (ja) * 1999-06-14 2005-10-12 博明 土屋 高さ計測装置
JP4909480B2 (ja) * 1999-09-16 2012-04-04 エムケーエス インストゥルメンツ インコーポレーテッド 層および表面特性の光学測定方法およびその装置
IL134008A0 (en) * 2000-01-12 2001-04-30 Inspectech Ltd A method and system for measuring bump height
JP2001194321A (ja) * 2000-01-12 2001-07-19 Tokyo Seimitsu Co Ltd 半導体ウエハの検査装置

Also Published As

Publication number Publication date
IL146174A0 (en) 2002-07-25
US20050030528A1 (en) 2005-02-10
EP1440285A1 (en) 2004-07-28
IL146174A (en) 2007-08-19
US6934019B2 (en) 2005-08-23
WO2003036227A1 (en) 2003-05-01
JP2005506710A (ja) 2005-03-03

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