JP4678654B2 - 電子デバイス。 - Google Patents

電子デバイス。 Download PDF

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Publication number
JP4678654B2
JP4678654B2 JP2007227516A JP2007227516A JP4678654B2 JP 4678654 B2 JP4678654 B2 JP 4678654B2 JP 2007227516 A JP2007227516 A JP 2007227516A JP 2007227516 A JP2007227516 A JP 2007227516A JP 4678654 B2 JP4678654 B2 JP 4678654B2
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metal particles
conductive
melting point
point metal
resin
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Japanese (ja)
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JP2009059648A (ja
JP2009059648A5 (enExample
Inventor
重信 関根
由莉奈 関根
竜司 木村
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有限会社ナプラ
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  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2007227516A 2007-09-03 2007-09-03 電子デバイス。 Active JP4678654B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007227516A JP4678654B2 (ja) 2007-09-03 2007-09-03 電子デバイス。

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007227516A JP4678654B2 (ja) 2007-09-03 2007-09-03 電子デバイス。

Related Child Applications (1)

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JP2011012071A Division JP4790089B2 (ja) 2011-01-24 2011-01-24 導電性組成物及び電子デバイスの製造方法

Publications (3)

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JP2009059648A JP2009059648A (ja) 2009-03-19
JP2009059648A5 JP2009059648A5 (enExample) 2009-07-16
JP4678654B2 true JP4678654B2 (ja) 2011-04-27

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ID=40555198

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JP2007227516A Active JP4678654B2 (ja) 2007-09-03 2007-09-03 電子デバイス。

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JP (1) JP4678654B2 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013153073A (ja) * 2012-01-25 2013-08-08 Toshiba Corp 電子デバイス及び配線形成方法
JP5124693B1 (ja) * 2012-04-24 2013-01-23 有限会社 ナプラ 電子機器
JP6396964B2 (ja) * 2015-09-29 2018-09-26 三ツ星ベルト株式会社 導電性ペースト並びに電子基板及びその製造方法
WO2017105011A1 (ko) * 2015-12-15 2017-06-22 주식회사 엘지화학 금속 페이스트 및 열전 모듈
KR102101474B1 (ko) 2015-12-15 2020-04-16 주식회사 엘지화학 금속 페이스트 및 열전 모듈
US10575412B2 (en) 2016-12-27 2020-02-25 Mitsuboshi Belting Ltd. Electroconductive paste, electronic substrate, and method for manufacturing said substrate

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10279903A (ja) * 1997-04-04 1998-10-20 Asahi Chem Ind Co Ltd 導電性接着剤
JP4576728B2 (ja) * 2001-03-06 2010-11-10 ソニー株式会社 導電性ぺースト、プリント配線基板とその製造方法および半導体装置とその製造方法
JP2003305588A (ja) * 2002-04-11 2003-10-28 Fujitsu Ltd 接合材料
JP4939072B2 (ja) * 2005-02-15 2012-05-23 パナソニック株式会社 導電性接着剤

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JP2009059648A (ja) 2009-03-19

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