JP4668408B2 - 固体撮像素子をパッケージに取り付ける方法及びその装置 - Google Patents

固体撮像素子をパッケージに取り付ける方法及びその装置 Download PDF

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Publication number
JP4668408B2
JP4668408B2 JP2000376236A JP2000376236A JP4668408B2 JP 4668408 B2 JP4668408 B2 JP 4668408B2 JP 2000376236 A JP2000376236 A JP 2000376236A JP 2000376236 A JP2000376236 A JP 2000376236A JP 4668408 B2 JP4668408 B2 JP 4668408B2
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package
solid
imaging device
window
state imaging
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Japanese (ja)
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JP2002184963A5 (enExample
JP2002184963A (ja
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浩平 圓地
義雄 丸山
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Priority to JP2000376236A priority Critical patent/JP4668408B2/ja
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Publication of JP2002184963A5 publication Critical patent/JP2002184963A5/ja
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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Studio Devices (AREA)
JP2000376236A 2000-12-11 2000-12-11 固体撮像素子をパッケージに取り付ける方法及びその装置 Expired - Fee Related JP4668408B2 (ja)

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JP2000376236A JP4668408B2 (ja) 2000-12-11 2000-12-11 固体撮像素子をパッケージに取り付ける方法及びその装置

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JP2000376236A JP4668408B2 (ja) 2000-12-11 2000-12-11 固体撮像素子をパッケージに取り付ける方法及びその装置

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JP2002184963A JP2002184963A (ja) 2002-06-28
JP2002184963A5 JP2002184963A5 (enExample) 2007-08-09
JP4668408B2 true JP4668408B2 (ja) 2011-04-13

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005020464A (ja) * 2003-06-26 2005-01-20 Kyocera Corp 光半導体装置およびその製造方法
WO2007046175A1 (ja) * 2005-10-20 2007-04-26 Nabtesco Corporation ケース、ケースの組立方法及び光ファイバ固定装置
JP2010087833A (ja) * 2008-09-30 2010-04-15 Fujinon Corp カメラモジュール
KR102874489B1 (ko) * 2023-06-09 2025-10-22 주식회사 어드밴스메탈 이미지 센서 칩 패키지 제조 시스템 및 이미지 센서 칩 패키지 제조 방법

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3930087B2 (ja) * 1996-01-12 2007-06-13 株式会社東芝 リッド装着装置及び固体撮像装置の製造方法
JP3721714B2 (ja) * 1997-05-15 2005-11-30 ソニー株式会社 固体撮像装置用パッケージのシール方法
JP3648721B2 (ja) * 1998-01-30 2005-05-18 松下電器産業株式会社 固体撮像装置の製造方法
JP4351750B2 (ja) * 1998-08-24 2009-10-28 Ｏｋｉセミコンダクタ株式会社 レーザ捺印方法、及び装置
JP2000266938A (ja) * 1999-03-18 2000-09-29 Alps Electric Co Ltd 光照射装置

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