JP4662039B2 - ダイレクトプレーティング方法 - Google Patents

ダイレクトプレーティング方法 Download PDF

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Publication number
JP4662039B2
JP4662039B2 JP2005199589A JP2005199589A JP4662039B2 JP 4662039 B2 JP4662039 B2 JP 4662039B2 JP 2005199589 A JP2005199589 A JP 2005199589A JP 2005199589 A JP2005199589 A JP 2005199589A JP 4662039 B2 JP4662039 B2 JP 4662039B2
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Japan
Prior art keywords
palladium
conductor layer
copper
plating
solution
Prior art date
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Expired - Lifetime
Application number
JP2005199589A
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English (en)
Japanese (ja)
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JP2007016283A5 (enExample
JP2007016283A (ja
Inventor
久光 山本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
C Uyemura and Co Ltd
Original Assignee
C Uyemura and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by C Uyemura and Co Ltd filed Critical C Uyemura and Co Ltd
Priority to JP2005199589A priority Critical patent/JP4662039B2/ja
Priority to TW95124528A priority patent/TWI424099B/zh
Publication of JP2007016283A publication Critical patent/JP2007016283A/ja
Publication of JP2007016283A5 publication Critical patent/JP2007016283A5/ja
Application granted granted Critical
Publication of JP4662039B2 publication Critical patent/JP4662039B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
JP2005199589A 2005-07-08 2005-07-08 ダイレクトプレーティング方法 Expired - Lifetime JP4662039B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2005199589A JP4662039B2 (ja) 2005-07-08 2005-07-08 ダイレクトプレーティング方法
TW95124528A TWI424099B (zh) 2005-07-08 2006-07-05 A direct plating method and a palladium conductor layer to form a solution

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005199589A JP4662039B2 (ja) 2005-07-08 2005-07-08 ダイレクトプレーティング方法

Publications (3)

Publication Number Publication Date
JP2007016283A JP2007016283A (ja) 2007-01-25
JP2007016283A5 JP2007016283A5 (enExample) 2008-07-31
JP4662039B2 true JP4662039B2 (ja) 2011-03-30

Family

ID=37753699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005199589A Expired - Lifetime JP4662039B2 (ja) 2005-07-08 2005-07-08 ダイレクトプレーティング方法

Country Status (2)

Country Link
JP (1) JP4662039B2 (enExample)
TW (1) TWI424099B (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5458758B2 (ja) 2009-09-11 2014-04-02 上村工業株式会社 触媒付与溶液並びにこれを用いた無電解めっき方法及びダイレクトプレーティング方法
JP5663886B2 (ja) * 2010-02-08 2015-02-04 三菱電機株式会社 半導体装置の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62124280A (ja) * 1985-08-21 1987-06-05 Ishihara Yakuhin Kk 無電解パラジウムメツキ液
FR2652822B1 (fr) * 1989-10-11 1993-06-11 Onera (Off Nat Aerospatiale) Bain a l'hydrazine pour le depot chimique de platine et/ou de palladium, et procede de fabrication d'un tel bain.
JPH05214551A (ja) * 1991-06-19 1993-08-24 Ishihara Chem Co Ltd パラジウム系無電解メツキ液
JPH05218644A (ja) * 1992-02-04 1993-08-27 Fujitsu Ltd 多層プリント配線板の製造方法
DE4206680C1 (de) * 1992-02-28 1994-01-27 Schering Ag Verfahren zur Metallisierung von Nichtleiteroberflächen und die Verwendung von Hydroxymethansulfinsäure im Verfahren
JPH05327187A (ja) * 1992-05-18 1993-12-10 Ishihara Chem Co Ltd プリント配線板及びその製造法

Also Published As

Publication number Publication date
TW200720491A (en) 2007-06-01
TWI424099B (zh) 2014-01-21
JP2007016283A (ja) 2007-01-25

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