TWI424099B - A direct plating method and a palladium conductor layer to form a solution - Google Patents
A direct plating method and a palladium conductor layer to form a solution Download PDFInfo
- Publication number
- TWI424099B TWI424099B TW95124528A TW95124528A TWI424099B TW I424099 B TWI424099 B TW I424099B TW 95124528 A TW95124528 A TW 95124528A TW 95124528 A TW95124528 A TW 95124528A TW I424099 B TWI424099 B TW I424099B
- Authority
- TW
- Taiwan
- Prior art keywords
- palladium
- conductor layer
- copper
- solution
- plating
- Prior art date
Links
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 title claims description 312
- 229910052763 palladium Inorganic materials 0.000 title claims description 152
- 239000004020 conductor Substances 0.000 title claims description 110
- 238000007747 plating Methods 0.000 title claims description 82
- 238000000034 method Methods 0.000 title claims description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 115
- 229910052802 copper Inorganic materials 0.000 claims description 111
- 239000010949 copper Substances 0.000 claims description 111
- -1 amine compound Chemical class 0.000 claims description 35
- 239000003054 catalyst Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 19
- KAESVJOAVNADME-UHFFFAOYSA-N 1H-pyrrole Natural products C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 claims description 18
- 238000009713 electroplating Methods 0.000 claims description 17
- 239000003638 chemical reducing agent Substances 0.000 claims description 13
- 230000002378 acidificating effect Effects 0.000 claims description 9
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 9
- 150000002941 palladium compounds Chemical class 0.000 claims description 9
- 229920000620 organic polymer Polymers 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 118
- 239000000243 solution Substances 0.000 description 92
- 239000010408 film Substances 0.000 description 20
- 229920001721 polyimide Polymers 0.000 description 19
- 239000000758 substrate Substances 0.000 description 19
- 229910000365 copper sulfate Inorganic materials 0.000 description 16
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 13
- 239000004642 Polyimide Substances 0.000 description 10
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- 229910002677 Pd–Sn Inorganic materials 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000004090 dissolution Methods 0.000 description 7
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 230000000996 additive effect Effects 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 229910052708 sodium Inorganic materials 0.000 description 4
- 239000003381 stabilizer Substances 0.000 description 4
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- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 3
- 239000013543 active substance Substances 0.000 description 3
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- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
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- RGHNJXZEOKUKBD-SQOUGZDYSA-N D-gluconic acid Chemical compound OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 description 2
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- 239000012286 potassium permanganate Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 150000004060 quinone imines Chemical class 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- ODBLHEXUDAPZAU-UHFFFAOYSA-N threo-D-isocitric acid Natural products OC(=O)C(O)C(C(O)=O)CC(O)=O ODBLHEXUDAPZAU-UHFFFAOYSA-N 0.000 description 1
- 229940005605 valeric acid Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005199589A JP4662039B2 (ja) | 2005-07-08 | 2005-07-08 | ダイレクトプレーティング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200720491A TW200720491A (en) | 2007-06-01 |
| TWI424099B true TWI424099B (zh) | 2014-01-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW95124528A TWI424099B (zh) | 2005-07-08 | 2006-07-05 | A direct plating method and a palladium conductor layer to form a solution |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4662039B2 (enExample) |
| TW (1) | TWI424099B (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5458758B2 (ja) | 2009-09-11 | 2014-04-02 | 上村工業株式会社 | 触媒付与溶液並びにこれを用いた無電解めっき方法及びダイレクトプレーティング方法 |
| JP5663886B2 (ja) * | 2010-02-08 | 2015-02-04 | 三菱電機株式会社 | 半導体装置の製造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124280A (ja) * | 1985-08-21 | 1987-06-05 | Ishihara Yakuhin Kk | 無電解パラジウムメツキ液 |
| JPH03134178A (ja) * | 1989-10-11 | 1991-06-07 | Office Natl Etud Rech Aerospat <Onera> | 白金及び／又はパラジウムの化学析出のためのヒドラジン浴、及び該浴の製造方法 |
| JPH05214551A (ja) * | 1991-06-19 | 1993-08-24 | Ishihara Chem Co Ltd | パラジウム系無電解メツキ液 |
| JPH05218644A (ja) * | 1992-02-04 | 1993-08-27 | Fujitsu Ltd | 多層プリント配線板の製造方法 |
| WO1993017153A1 (de) * | 1992-02-28 | 1993-09-02 | Atotech Deutschland Gmbh | Verfahren zur metallisierung von nichtleiteroberflächen und die verwendung von hydroximethylsulfinsäure im verfahren |
| JPH05327187A (ja) * | 1992-05-18 | 1993-12-10 | Ishihara Chem Co Ltd | プリント配線板及びその製造法 |
-
2005
- 2005-07-08 JP JP2005199589A patent/JP4662039B2/ja not_active Expired - Lifetime
-
2006
- 2006-07-05 TW TW95124528A patent/TWI424099B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62124280A (ja) * | 1985-08-21 | 1987-06-05 | Ishihara Yakuhin Kk | 無電解パラジウムメツキ液 |
| JPH03134178A (ja) * | 1989-10-11 | 1991-06-07 | Office Natl Etud Rech Aerospat <Onera> | 白金及び／又はパラジウムの化学析出のためのヒドラジン浴、及び該浴の製造方法 |
| JPH05214551A (ja) * | 1991-06-19 | 1993-08-24 | Ishihara Chem Co Ltd | パラジウム系無電解メツキ液 |
| JPH05218644A (ja) * | 1992-02-04 | 1993-08-27 | Fujitsu Ltd | 多層プリント配線板の製造方法 |
| WO1993017153A1 (de) * | 1992-02-28 | 1993-09-02 | Atotech Deutschland Gmbh | Verfahren zur metallisierung von nichtleiteroberflächen und die verwendung von hydroximethylsulfinsäure im verfahren |
| JPH05327187A (ja) * | 1992-05-18 | 1993-12-10 | Ishihara Chem Co Ltd | プリント配線板及びその製造法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200720491A (en) | 2007-06-01 |
| JP4662039B2 (ja) | 2011-03-30 |
| JP2007016283A (ja) | 2007-01-25 |
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