JP4658635B2 - 電波遮蔽体 - Google Patents
電波遮蔽体 Download PDFInfo
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- JP4658635B2 JP4658635B2 JP2005042184A JP2005042184A JP4658635B2 JP 4658635 B2 JP4658635 B2 JP 4658635B2 JP 2005042184 A JP2005042184 A JP 2005042184A JP 2005042184 A JP2005042184 A JP 2005042184A JP 4658635 B2 JP4658635 B2 JP 4658635B2
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- radio wave
- wave shield
- antenna
- antennas
- shield
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- 239000004020 conductor Substances 0.000 claims description 16
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 11
- 239000004332 silver Substances 0.000 claims description 11
- 230000000712 assembly Effects 0.000 claims description 3
- 238000000429 assembly Methods 0.000 claims description 3
- NMFHJNAPXOMSRX-PUPDPRJKSA-N [(1r)-3-(3,4-dimethoxyphenyl)-1-[3-(2-morpholin-4-ylethoxy)phenyl]propyl] (2s)-1-[(2s)-2-(3,4,5-trimethoxyphenyl)butanoyl]piperidine-2-carboxylate Chemical compound C([C@@H](OC(=O)[C@@H]1CCCCN1C(=O)[C@@H](CC)C=1C=C(OC)C(OC)=C(OC)C=1)C=1C=C(OCCN2CCOCC2)C=CC=1)CC1=CC=C(OC)C(OC)=C1 NMFHJNAPXOMSRX-PUPDPRJKSA-N 0.000 description 60
- 239000010410 layer Substances 0.000 description 34
- 239000000463 material Substances 0.000 description 27
- 239000011521 glass Substances 0.000 description 19
- 239000000853 adhesive Substances 0.000 description 15
- 230000001070 adhesive effect Effects 0.000 description 15
- 239000000758 substrate Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 11
- 239000010408 film Substances 0.000 description 10
- 229920006254 polymer film Polymers 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- -1 tile Substances 0.000 description 6
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000005357 flat glass Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 229920001577 copolymer Polymers 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 229920002845 Poly(methacrylic acid) Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- SMEGJBVQLJJKKX-HOTMZDKISA-N [(2R,3S,4S,5R,6R)-5-acetyloxy-3,4,6-trihydroxyoxan-2-yl]methyl acetate Chemical compound CC(=O)OC[C@@H]1[C@H]([C@@H]([C@H]([C@@H](O1)O)OC(=O)C)O)O SMEGJBVQLJJKKX-HOTMZDKISA-N 0.000 description 1
- 229940081735 acetylcellulose Drugs 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000002573 ethenylidene group Chemical group [*]=C=C([H])[H] 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000123 paper Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Images
Landscapes
- Aerials With Secondary Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Building Environments (AREA)
Description
図1は参考形態1に係る電波遮蔽体1の断面図である。詳細には、図1(b)に示す図は、図1(a)に示す電波遮蔽体1の平面図中切り出し線Ia−Iaで切り出した部分の断面図である。
図10は参考形態2に係る電波遮蔽体10の平面図である。
図12は実施形態1に係る電波遮蔽体20の平面図である。
上記参考形態1、2及び実施形態1では、本発明の参考例及び適用例として電波遮蔽体について説明してきた。しかし、本発明に係る電波遮蔽体は何ら上記参考形態1、2及び実施形態1に限定されるものではなく、例えば、複数のアンテナ4を含む反射層3が電波遮蔽体内部に設けられたものであってもよい。本実施形態2では、複数のアンテナ4を含む反射層3が内部に設けられた電波遮蔽体について図面を参照しながら説明する。
2 基材
3 反射層
4 アンテナ
4a 第1エレメント部
4b 第2エレメント部
5 アンテナ集合体
5a アンテナユニット
6 板状体
7 ガラス
8 粘着剤
9 保護膜
30 電波遮蔽板
Claims (3)
- 各々、特定周波数の電波を反射させる複数のアンテナが模様を構成するように設けられた電波遮蔽体であって、
上記複数のアンテナのそれぞれは、
相互に120°の角度をなしてアンテナ中心から外方に延びた略同一の長さの線分状の3本の第1エレメント部と、
上記3本の第1エレメント部のそれぞれの外側端に、該第1エレメント部と直交するように中心が結合された、該第1エレメント部と略同一の長さの線分状の第2エレメント部とを有し、
上記複数のアンテナは、第2エレメント部同士が対向するように配設された一対によりアンテナユニットを構成するとともに、第2エレメント部同士が対向するように配設された3つのアンテナユニットにより二次元に連続展開した略正六角形状模様のアンテナ集合体を構成し、さらに、第2エレメント部同士が対向するように配設された複数のアンテナ集合体により略ハニカム状模様を構成している電波遮蔽体。 - 請求項1に記載された電波遮蔽体において、
上記複数のアンテナは、導電材料を含有してなる電波遮蔽体。 - 請求項2に記載された電波遮蔽体において、
上記導電材料は、アルミニウム及び銀のうち少なくともいずれか一方を含む電波遮蔽体。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005042184A JP4658635B2 (ja) | 2005-02-18 | 2005-02-18 | 電波遮蔽体 |
EP06713801.6A EP1853103B1 (en) | 2005-02-18 | 2006-02-15 | Radio wave shielding body |
CN200680005137XA CN101120628B (zh) | 2005-02-18 | 2006-02-15 | 电波屏蔽体 |
US11/816,393 US7898499B2 (en) | 2005-02-18 | 2006-02-15 | Electromagnetic wave shielding body |
PCT/JP2006/302660 WO2006088063A1 (ja) | 2005-02-18 | 2006-02-15 | 電波遮蔽体 |
KR1020077021386A KR20070114289A (ko) | 2005-02-18 | 2006-02-15 | 전파차폐체 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005042184A JP4658635B2 (ja) | 2005-02-18 | 2005-02-18 | 電波遮蔽体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006229035A JP2006229035A (ja) | 2006-08-31 |
JP4658635B2 true JP4658635B2 (ja) | 2011-03-23 |
Family
ID=36990114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005042184A Active JP4658635B2 (ja) | 2005-02-18 | 2005-02-18 | 電波遮蔽体 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4658635B2 (ja) |
CN (1) | CN101120628B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9307631B2 (en) * | 2013-01-25 | 2016-04-05 | Laird Technologies, Inc. | Cavity resonance reduction and/or shielding structures including frequency selective surfaces |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1372369A4 (en) * | 2001-03-02 | 2007-08-15 | Hitachi Chemical Co Ltd | ELECTROMAGNETIC SHIELDING SHEET, ELECTROMAGNETIC SHIELDING UNIT AND DISPLAY |
-
2005
- 2005-02-18 JP JP2005042184A patent/JP4658635B2/ja active Active
-
2006
- 2006-02-15 CN CN200680005137XA patent/CN101120628B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN101120628A (zh) | 2008-02-06 |
JP2006229035A (ja) | 2006-08-31 |
CN101120628B (zh) | 2010-10-06 |
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