JP4657740B2 - 荷電粒子線光学系用収差測定装置、該収差測定装置を具備する荷電粒子線露光装置及び該装置を用いたデバイス製造方法 - Google Patents
荷電粒子線光学系用収差測定装置、該収差測定装置を具備する荷電粒子線露光装置及び該装置を用いたデバイス製造方法 Download PDFInfo
- Publication number
- JP4657740B2 JP4657740B2 JP2005017698A JP2005017698A JP4657740B2 JP 4657740 B2 JP4657740 B2 JP 4657740B2 JP 2005017698 A JP2005017698 A JP 2005017698A JP 2005017698 A JP2005017698 A JP 2005017698A JP 4657740 B2 JP4657740 B2 JP 4657740B2
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- JP
- Japan
- Prior art keywords
- charged particle
- particle beam
- optical system
- aberration
- beam optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3174—Particle-beam lithography, e.g. electron beam lithography
- H01J37/3177—Multi-beam, e.g. fly's eye, comb probe
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30433—System calibration
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Electron Beam Exposure (AREA)
- Electron Sources, Ion Sources (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005017698A JP4657740B2 (ja) | 2005-01-26 | 2005-01-26 | 荷電粒子線光学系用収差測定装置、該収差測定装置を具備する荷電粒子線露光装置及び該装置を用いたデバイス製造方法 |
| US11/337,603 US7378671B2 (en) | 2005-01-26 | 2006-01-24 | Aberration measuring apparatus for charged particle beam optical system, charged particle beam lithography machine having the aberration measuring apparatus, and device fabrication method using the apparatus |
| DE602006020796T DE602006020796D1 (de) | 2005-01-26 | 2006-01-26 | Aberrationsmessvorrichtung zum Messen von Aberrationen eines für Ladungspartikelstrahlenbündel vorgesehenen optischen Systems, lithographischer Apparat mit einer solchen Vorrichtung, und Verfahren zur Herstellung von Erzeugnissen mit einem solchen Apparat |
| EP06001639A EP1686609B1 (en) | 2005-01-26 | 2006-01-26 | Aberration measuring apparatus for charged particle beam optical system, charged particle beam lithography machine having the aberration measuring apparatus, and device fabrication method using the apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005017698A JP4657740B2 (ja) | 2005-01-26 | 2005-01-26 | 荷電粒子線光学系用収差測定装置、該収差測定装置を具備する荷電粒子線露光装置及び該装置を用いたデバイス製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006210458A JP2006210458A (ja) | 2006-08-10 |
| JP2006210458A5 JP2006210458A5 (enExample) | 2008-03-06 |
| JP4657740B2 true JP4657740B2 (ja) | 2011-03-23 |
Family
ID=36587153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005017698A Expired - Lifetime JP4657740B2 (ja) | 2005-01-26 | 2005-01-26 | 荷電粒子線光学系用収差測定装置、該収差測定装置を具備する荷電粒子線露光装置及び該装置を用いたデバイス製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7378671B2 (enExample) |
| EP (1) | EP1686609B1 (enExample) |
| JP (1) | JP4657740B2 (enExample) |
| DE (1) | DE602006020796D1 (enExample) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4657740B2 (ja) | 2005-01-26 | 2011-03-23 | キヤノン株式会社 | 荷電粒子線光学系用収差測定装置、該収差測定装置を具備する荷電粒子線露光装置及び該装置を用いたデバイス製造方法 |
| TW201239943A (en) * | 2011-03-25 | 2012-10-01 | Canon Kk | Drawing apparatus and method of manufacturing article |
| EP2823361B1 (en) | 2012-03-08 | 2022-03-02 | ASML Netherlands B.V. | Lithography system and method for processing a target, such as a wafer |
| US9081287B2 (en) | 2012-12-20 | 2015-07-14 | Kla-Tencor Corporation | Methods of measuring overlay errors in area-imaging e-beam lithography |
| JP6080540B2 (ja) * | 2012-12-26 | 2017-02-15 | 株式会社ニューフレアテクノロジー | 荷電粒子ビーム描画装置 |
| JP6930431B2 (ja) * | 2018-01-10 | 2021-09-01 | 株式会社ニューフレアテクノロジー | アパーチャのアライメント方法及びマルチ荷電粒子ビーム描画装置 |
| DE102018115012A1 (de) * | 2018-06-21 | 2019-12-24 | Carl Zeiss Microscopy Gmbh | Teilchenstrahlsystem |
| US11145485B2 (en) * | 2018-12-26 | 2021-10-12 | Nuflare Technology, Inc. | Multiple electron beams irradiation apparatus |
| IL284444B1 (en) * | 2018-12-31 | 2025-10-01 | Asml Netherlands Bv | Multi-beam testing facility |
| CN115152000A (zh) * | 2020-02-21 | 2022-10-04 | Asml荷兰有限公司 | 带电粒子评估工具及检查方法 |
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| JPS5463681A (en) * | 1977-10-29 | 1979-05-22 | Nippon Aviotronics Kk | Electron beam exposure device |
| US4985634A (en) * | 1988-06-02 | 1991-01-15 | Oesterreichische Investitionskredit Aktiengesellschaft And Ionen Mikrofabrications | Ion beam lithography |
| DE69738276T2 (de) | 1996-03-04 | 2008-04-03 | Canon K.K. | Elektronenstrahl-Belichtungsgerät, Belichtungsverfahren und Verfahren zur Erzeugung eines Objekts |
| JP3647128B2 (ja) | 1996-03-04 | 2005-05-11 | キヤノン株式会社 | 電子ビーム露光装置とその露光方法 |
| JP3796317B2 (ja) | 1996-06-12 | 2006-07-12 | キヤノン株式会社 | 電子ビーム露光方法及びそれを用いたデバイス製造方法 |
| JP3728015B2 (ja) | 1996-06-12 | 2005-12-21 | キヤノン株式会社 | 電子ビーム露光システム及びそれを用いたデバイス製造方法 |
| JP3927620B2 (ja) | 1996-06-12 | 2007-06-13 | キヤノン株式会社 | 電子ビーム露光方法及びそれを用いたデバイス製造方法 |
| US5929454A (en) | 1996-06-12 | 1999-07-27 | Canon Kabushiki Kaisha | Position detection apparatus, electron beam exposure apparatus, and methods associated with them |
| US5747814A (en) * | 1996-12-06 | 1998-05-05 | International Business Machines Corporation | Method for centering a lens in a charged-particle system |
| US5981954A (en) | 1997-01-16 | 1999-11-09 | Canon Kabushiki Kaisha | Electron beam exposure apparatus |
| JP3689516B2 (ja) | 1997-01-29 | 2005-08-31 | キヤノン株式会社 | 電子ビーム露光装置 |
| JPH10214779A (ja) | 1997-01-31 | 1998-08-11 | Canon Inc | 電子ビーム露光方法及び該方法を用いたデバイス製造方法 |
| US6107636A (en) | 1997-02-07 | 2000-08-22 | Canon Kabushiki Kaisha | Electron beam exposure apparatus and its control method |
| JPH10294255A (ja) | 1997-04-17 | 1998-11-04 | Canon Inc | 電子ビーム照明装置、および該電子ビーム照明装置を備えた露光装置 |
| US6104035A (en) | 1997-06-02 | 2000-08-15 | Canon Kabushiki Kaisha | Electron-beam exposure apparatus and method |
| JP3787417B2 (ja) | 1997-06-11 | 2006-06-21 | キヤノン株式会社 | 電子ビーム露光方法及び電子ビーム露光装置 |
| US6552353B1 (en) | 1998-01-05 | 2003-04-22 | Canon Kabushiki Kaisha | Multi-electron beam exposure method and apparatus and device manufacturing method |
| US6455211B1 (en) | 1998-02-09 | 2002-09-24 | Canon Kabushiki Kaisha | Pattern transfer method and apparatus, and device manufacturing method |
| JP4077933B2 (ja) | 1998-06-24 | 2008-04-23 | キヤノン株式会社 | マルチ電子ビーム露光方法及び装置、ならびにデバイス製造方法 |
| JP4454706B2 (ja) | 1998-07-28 | 2010-04-21 | キヤノン株式会社 | 電子ビーム露光方法及び装置、ならびにデバイス製造方法 |
| JP2000049071A (ja) | 1998-07-28 | 2000-02-18 | Canon Inc | 電子ビーム露光装置及び方法、ならびにデバイス製造方法 |
| US6559456B1 (en) | 1998-10-23 | 2003-05-06 | Canon Kabushiki Kaisha | Charged particle beam exposure method and apparatus |
| JP2001168018A (ja) | 1999-12-13 | 2001-06-22 | Canon Inc | 荷電粒子線露光装置、荷電粒子線露光方法及び露光補正データの決定方法、該方法を適用したデバイスの製造方法。 |
| JP2001332473A (ja) * | 2000-05-23 | 2001-11-30 | Canon Inc | 荷電粒子線露光装置及び該装置を用いたデバイス製造方法 |
| JP2001267221A (ja) * | 2000-03-17 | 2001-09-28 | Canon Inc | 荷電粒子線露光装置及びデバイス製造方法 |
| US6566664B2 (en) | 2000-03-17 | 2003-05-20 | Canon Kabushiki Kaisha | Charged-particle beam exposure apparatus and device manufacturing method |
| JP4585661B2 (ja) | 2000-03-31 | 2010-11-24 | キヤノン株式会社 | 電子光学系アレイ、荷電粒子線露光装置およびデバイス製造方法 |
| JP2002195913A (ja) * | 2000-12-27 | 2002-07-10 | Nikon Corp | 収差測定装置及び方法、露光装置、並びにマイクロデバイスの製造方法 |
| TWI220998B (en) * | 2001-02-13 | 2004-09-11 | Nikon Corp | Exposure method, exposure apparatus and manufacture method of the same |
| JP4436029B2 (ja) * | 2001-02-13 | 2010-03-24 | 株式会社ニコン | 投影光学系の製造方法及び調整方法、露光装置及びその製造方法、デバイス製造方法、並びにコンピュータシステム |
| JP4647820B2 (ja) | 2001-04-23 | 2011-03-09 | キヤノン株式会社 | 荷電粒子線描画装置、および、デバイスの製造方法 |
| JP4756776B2 (ja) | 2001-05-25 | 2011-08-24 | キヤノン株式会社 | 荷電粒子線露光装置、荷電粒子線露光方法およびデバイス製造方法 |
| JP3968334B2 (ja) * | 2002-09-11 | 2007-08-29 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置及び荷電粒子線照射方法 |
| US6953938B2 (en) | 2002-10-03 | 2005-10-11 | Canon Kabushiki Kaisha | Deflector, method of manufacturing deflector, and charged particle beam exposure apparatus |
| JP2004153245A (ja) | 2002-10-07 | 2004-05-27 | Nikon Corp | 荷電粒子線露光装置における非点収差ボケの補正感度又は発生感度の決定方法、及び露光方法 |
| JP3870153B2 (ja) * | 2002-10-22 | 2007-01-17 | キヤノン株式会社 | 光学特性の測定方法 |
| JP4421836B2 (ja) | 2003-03-28 | 2010-02-24 | キヤノン株式会社 | 露光装置及びデバイス製造方法 |
| JP4275441B2 (ja) | 2003-03-31 | 2009-06-10 | 株式会社日立ハイテクノロジーズ | 収差補正器付電子線装置 |
| JP4113032B2 (ja) | 2003-04-21 | 2008-07-02 | キヤノン株式会社 | 電子銃及び電子ビーム露光装置 |
| JP4738723B2 (ja) | 2003-08-06 | 2011-08-03 | キヤノン株式会社 | マルチ荷電粒子線描画装置、荷電粒子線の電流の測定方法及びデバイス製造方法 |
| GB2408383B (en) * | 2003-10-28 | 2006-05-10 | Ims Nanofabrication Gmbh | Pattern-definition device for maskless particle-beam exposure apparatus |
| US7261985B2 (en) * | 2004-03-12 | 2007-08-28 | Litel Instruments | Process for determination of optimized exposure conditions for transverse distortion mapping |
| JP4477436B2 (ja) | 2004-06-30 | 2010-06-09 | キヤノン株式会社 | 荷電粒子線露光装置 |
| JP4657740B2 (ja) | 2005-01-26 | 2011-03-23 | キヤノン株式会社 | 荷電粒子線光学系用収差測定装置、該収差測定装置を具備する荷電粒子線露光装置及び該装置を用いたデバイス製造方法 |
| JP4652830B2 (ja) | 2005-01-26 | 2011-03-16 | キヤノン株式会社 | 収差調整方法、デバイス製造方法及び荷電粒子線露光装置 |
-
2005
- 2005-01-26 JP JP2005017698A patent/JP4657740B2/ja not_active Expired - Lifetime
-
2006
- 2006-01-24 US US11/337,603 patent/US7378671B2/en active Active
- 2006-01-26 DE DE602006020796T patent/DE602006020796D1/de active Active
- 2006-01-26 EP EP06001639A patent/EP1686609B1/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US20060169898A1 (en) | 2006-08-03 |
| EP1686609A2 (en) | 2006-08-02 |
| US7378671B2 (en) | 2008-05-27 |
| EP1686609B1 (en) | 2011-03-23 |
| JP2006210458A (ja) | 2006-08-10 |
| EP1686609A3 (en) | 2009-01-14 |
| DE602006020796D1 (de) | 2011-05-05 |
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