JP4652087B2 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP4652087B2
JP4652087B2 JP2005063588A JP2005063588A JP4652087B2 JP 4652087 B2 JP4652087 B2 JP 4652087B2 JP 2005063588 A JP2005063588 A JP 2005063588A JP 2005063588 A JP2005063588 A JP 2005063588A JP 4652087 B2 JP4652087 B2 JP 4652087B2
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JP
Japan
Prior art keywords
circuit
chip
memory
electrically connected
film
Prior art date
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Expired - Fee Related
Application number
JP2005063588A
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English (en)
Japanese (ja)
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JP2005293563A (ja
JP2005293563A5 (enExample
Inventor
潤 小山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2005063588A priority Critical patent/JP4652087B2/ja
Publication of JP2005293563A publication Critical patent/JP2005293563A/ja
Publication of JP2005293563A5 publication Critical patent/JP2005293563A5/ja
Application granted granted Critical
Publication of JP4652087B2 publication Critical patent/JP4652087B2/ja
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
    • B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
    • B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
    • B42D25/30—Identification or security features, e.g. for preventing forgery
    • B42D25/305—Associated digital information
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Semiconductor Memories (AREA)
  • Credit Cards Or The Like (AREA)
JP2005063588A 2004-03-11 2005-03-08 半導体装置 Expired - Fee Related JP4652087B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005063588A JP4652087B2 (ja) 2004-03-11 2005-03-08 半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004068450 2004-03-11
JP2005063588A JP4652087B2 (ja) 2004-03-11 2005-03-08 半導体装置

Publications (3)

Publication Number Publication Date
JP2005293563A JP2005293563A (ja) 2005-10-20
JP2005293563A5 JP2005293563A5 (enExample) 2008-03-27
JP4652087B2 true JP4652087B2 (ja) 2011-03-16

Family

ID=34975788

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005063588A Expired - Fee Related JP4652087B2 (ja) 2004-03-11 2005-03-08 半導体装置

Country Status (5)

Country Link
US (1) US7675795B2 (enExample)
JP (1) JP4652087B2 (enExample)
KR (1) KR101098406B1 (enExample)
CN (1) CN1930580B (enExample)
WO (1) WO2005088532A1 (enExample)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7699232B2 (en) * 2004-02-06 2010-04-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7663473B2 (en) * 2004-02-12 2010-02-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, IC card, IC tag, RFID, transponder, bills, securities, passport, electronic apparatus, bag, and clothes
US20060255159A1 (en) * 2005-05-11 2006-11-16 Fec Co., Ltd.., And The Government Of Malaysia Power supply circuit in IC chip for non-contact IC card
US7675796B2 (en) 2005-12-27 2010-03-09 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR100764438B1 (ko) * 2006-07-18 2007-10-05 주식회사 하이닉스반도체 Ｒｆｉｄ 장치
US8463332B2 (en) * 2006-08-31 2013-06-11 Semiconductor Energy Laboratory Co., Ltd. Wireless communication device
KR100909801B1 (ko) * 2007-07-10 2009-07-29 주식회사 하이닉스반도체 Ｒｆｉｄ 태그 및 그의 동작 방법
KR100881823B1 (ko) * 2007-08-31 2009-02-03 주식회사 하이닉스반도체 불휘발성 강유전체 메모리를 포함하는 ｒｆｉｄ 장치
US20090088618A1 (en) 2007-10-01 2009-04-02 Arneson Michael R System and Method for Manufacturing a Swallowable Sensor Device
JP5106031B2 (ja) * 2007-10-12 2012-12-26 パナソニック株式会社 半導体記憶装置及びその製造方法並びに半導体スイッチング装置
JP2009163843A (ja) * 2008-01-09 2009-07-23 Panasonic Corp 半導体記憶装置及びその製造方法
KR100983700B1 (ko) * 2008-04-18 2010-09-24 주식회사 하이닉스반도체 Ｒｆｉｄ 장치
CN102160178B (zh) 2008-09-19 2013-06-19 株式会社半导体能源研究所 半导体器件
WO2010038601A1 (en) * 2008-09-30 2010-04-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US7933138B2 (en) * 2009-01-30 2011-04-26 Texas Instruments Incorporated F-RAM device with current mirror sense amp
US9024761B2 (en) * 2009-03-17 2015-05-05 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for persistent ID flag for RFID applications
JP2010231828A (ja) * 2009-03-26 2010-10-14 Elpida Memory Inc 半導体記憶装置
JP5524767B2 (ja) * 2009-09-02 2014-06-18 株式会社半導体エネルギー研究所 半導体装置及びその駆動方法
CN102751244B (zh) * 2011-04-20 2014-03-12 中芯国际集成电路制造(上海)有限公司 半导体器件及其形成方法、射频识别芯片及其形成方法
CN115867968A (zh) 2020-08-03 2023-03-28 株式会社半导体能源研究所 半导体装置的驱动方法
KR20230069128A (ko) 2020-09-22 2023-05-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치의 구동 방법
KR20230071154A (ko) 2020-09-25 2023-05-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 전자 기기

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0609453B1 (en) * 1992-06-25 2002-10-23 Denso Corporation Mobile object identification device
JP3607032B2 (ja) * 1996-06-03 2005-01-05 東芝マイクロエレクトロニクス株式会社 不揮発性強誘電体メモリ及びその駆動方法
JP4042182B2 (ja) * 1997-07-03 2008-02-06 セイコーエプソン株式会社 Ｉｃカードの製造方法及び薄膜集積回路装置の製造方法
JPH1173481A (ja) 1997-08-28 1999-03-16 Hitachi Ltd 非接触型ｉｃカード
JPH11120797A (ja) * 1997-10-15 1999-04-30 Toshiba Microelectronics Corp 強誘電体メモリ及びそのスクリーニング方法
JPH11297963A (ja) * 1998-04-10 1999-10-29 Toshiba Corp 電荷蓄積容量素子及びその製造方法、半導体記憶装置及びこれを用いたｉｄカード
JP2000035991A (ja) * 1998-05-11 2000-02-02 Sony Corp 履歴情報記録装置及びこれを備えた製品
JP2000020665A (ja) * 1998-06-30 2000-01-21 Toshiba Corp 半導体装置
JP4231148B2 (ja) * 1998-12-04 2009-02-25 大日本印刷株式会社 携帯可能記憶媒体及びその発行方法
JP3614747B2 (ja) * 2000-03-07 2005-01-26 Ｎｅｃエレクトロニクス株式会社 昇圧回路、それを搭載したｉｃカード及びそれを搭載した電子機器
JP2003163331A (ja) * 2001-11-28 2003-06-06 Ricoh Co Ltd 不揮発性有機半導体記憶素子及びそれを有する非接触情報管理表示装置
JP3940014B2 (ja) * 2002-03-29 2007-07-04 富士通株式会社 半導体集積回路、無線タグ、および非接触型ｉｃカード
JP2004056089A (ja) 2002-05-31 2004-02-19 Sharp Corp Ｉｃカード
US7699232B2 (en) * 2004-02-06 2010-04-20 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7663473B2 (en) * 2004-02-12 2010-02-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device, IC card, IC tag, RFID, transponder, bills, securities, passport, electronic apparatus, bag, and clothes

Also Published As

Publication number Publication date
KR101098406B1 (ko) 2011-12-23
US20070171693A1 (en) 2007-07-26
CN1930580A (zh) 2007-03-14
US7675795B2 (en) 2010-03-09
JP2005293563A (ja) 2005-10-20
WO2005088532A1 (en) 2005-09-22
KR20070008607A (ko) 2007-01-17
CN1930580B (zh) 2011-01-26

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