JP4644954B2 - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP4644954B2
JP4644954B2 JP2001056039A JP2001056039A JP4644954B2 JP 4644954 B2 JP4644954 B2 JP 4644954B2 JP 2001056039 A JP2001056039 A JP 2001056039A JP 2001056039 A JP2001056039 A JP 2001056039A JP 4644954 B2 JP4644954 B2 JP 4644954B2
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JP
Japan
Prior art keywords
polished
polishing
film
polishing apparatus
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001056039A
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English (en)
Japanese (ja)
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JP2001322036A5 (https=
JP2001322036A (ja
Inventor
修三 佐藤
雄司 瀬川
啓 由尾
英 大鳥居
善哉 安田
成郎 石原
毅 野上
尚紀 駒井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2001056039A priority Critical patent/JP4644954B2/ja
Priority to US09/800,580 priority patent/US6797623B2/en
Priority to KR1020010012287A priority patent/KR100741148B1/ko
Publication of JP2001322036A publication Critical patent/JP2001322036A/ja
Priority to US10/327,860 priority patent/US7186322B2/en
Publication of JP2001322036A5 publication Critical patent/JP2001322036A5/ja
Application granted granted Critical
Publication of JP4644954B2 publication Critical patent/JP4644954B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2001056039A 2000-03-09 2001-02-28 研磨装置 Expired - Fee Related JP4644954B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2001056039A JP4644954B2 (ja) 2000-03-09 2001-02-28 研磨装置
US09/800,580 US6797623B2 (en) 2000-03-09 2001-03-08 Methods of producing and polishing semiconductor device and polishing apparatus
KR1020010012287A KR100741148B1 (ko) 2000-03-09 2001-03-09 반도체 소자의 제조 및 연마 방법, 및 연마 장치
US10/327,860 US7186322B2 (en) 2000-03-09 2002-12-26 Methods of producing and polishing semiconductor device and polishing apparatus

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000071083 2000-03-09
JP2000-71083 2000-03-09
JP2001056039A JP4644954B2 (ja) 2000-03-09 2001-02-28 研磨装置

Publications (3)

Publication Number Publication Date
JP2001322036A JP2001322036A (ja) 2001-11-20
JP2001322036A5 JP2001322036A5 (https=) 2008-03-06
JP4644954B2 true JP4644954B2 (ja) 2011-03-09

Family

ID=26587477

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001056039A Expired - Fee Related JP4644954B2 (ja) 2000-03-09 2001-02-28 研磨装置

Country Status (1)

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JP (1) JP4644954B2 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4409807B2 (ja) * 2002-01-23 2010-02-03 株式会社荏原製作所 基板処理方法
JP2003311537A (ja) * 2002-04-30 2003-11-05 Sony Corp 研磨方法、研磨装置及び半導体装置の製造方法
US20070108066A1 (en) * 2005-10-28 2007-05-17 Applied Materials, Inc. Voltage mode current control
JP5252271B2 (ja) * 2008-05-02 2013-07-31 株式会社ニコン 研磨装置
WO2010052917A1 (ja) * 2008-11-07 2010-05-14 株式会社ロキテクノ 研磨ヘッド、研磨装置及び基板研磨体
JP5590477B2 (ja) * 2013-04-19 2014-09-17 株式会社ニコン 研磨装置
US10665487B2 (en) 2014-04-18 2020-05-26 Ebara Corporation Substrate processing apparatus, substrate processing system, and substrate processing method
JP6749569B2 (ja) * 2017-02-17 2020-09-02 東邦エンジニアリング株式会社 研磨装置のヘッド進退装置
KR102254027B1 (ko) * 2019-11-28 2021-05-20 (주)천우테크 고정식 대형 스테인리스스틸 저장탱크 내부의 표면처리를 할 수 있는 이동식 전해연마 시스템
KR102214115B1 (ko) * 2020-10-12 2021-02-09 임재균 현장 실시용 스텐리스 스틸 전해 부식 장치
CN113894373B (zh) * 2021-08-31 2022-07-29 安徽工程大学 一种恒力电解磨削加工装置
JP2024172188A (ja) * 2023-05-31 2024-12-12 株式会社ジェイテクトマシンシステム 陽極酸化援用研削装置及び陽極酸化援用研削方法
CN117754451A (zh) * 2024-01-30 2024-03-26 河北工业大学 一种研究抛光液中磨粒浓度对接触程度影响的方法和系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144568A (ja) * 1974-10-16 1976-04-16 Nippon Telegraph & Telephone Denkaikaseiso
JP4204649B2 (ja) * 1996-02-05 2009-01-07 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP3824345B2 (ja) * 1996-04-26 2006-09-20 東京エレクトロン株式会社 研磨方法および研磨装置
JP3125049B2 (ja) * 1996-12-05 2001-01-15 工業技術院長 タングステンの電解鏡面研磨方法
US5911619A (en) * 1997-03-26 1999-06-15 International Business Machines Corporation Apparatus for electrochemical mechanical planarization
JPH11345789A (ja) * 1998-06-01 1999-12-14 Toshiba Corp 研磨方法
JP4513145B2 (ja) * 1999-09-07 2010-07-28 ソニー株式会社 半導体装置の製造方法および研磨方法
US6355153B1 (en) * 1999-09-17 2002-03-12 Nutool, Inc. Chip interconnect and packaging deposition methods and structures
US6299741B1 (en) * 1999-11-29 2001-10-09 Applied Materials, Inc. Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus
JP2001326204A (ja) * 2000-03-09 2001-11-22 Sony Corp 半導体装置の製造方法および研磨方法

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Publication number Publication date
JP2001322036A (ja) 2001-11-20

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