JP4641732B2 - 感光性樹脂組成物 - Google Patents

感光性樹脂組成物 Download PDF

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Publication number
JP4641732B2
JP4641732B2 JP2004085754A JP2004085754A JP4641732B2 JP 4641732 B2 JP4641732 B2 JP 4641732B2 JP 2004085754 A JP2004085754 A JP 2004085754A JP 2004085754 A JP2004085754 A JP 2004085754A JP 4641732 B2 JP4641732 B2 JP 4641732B2
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JP
Japan
Prior art keywords
photosensitive resin
resin composition
mass
resist
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004085754A
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English (en)
Japanese (ja)
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JP2005274792A (ja
JP2005274792A5 (enExample
Inventor
公博 阿部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
Original Assignee
Asahi Kasei E Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Priority to JP2004085754A priority Critical patent/JP4641732B2/ja
Publication of JP2005274792A publication Critical patent/JP2005274792A/ja
Publication of JP2005274792A5 publication Critical patent/JP2005274792A5/ja
Application granted granted Critical
Publication of JP4641732B2 publication Critical patent/JP4641732B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2004085754A 2004-03-23 2004-03-23 感光性樹脂組成物 Expired - Fee Related JP4641732B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004085754A JP4641732B2 (ja) 2004-03-23 2004-03-23 感光性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004085754A JP4641732B2 (ja) 2004-03-23 2004-03-23 感光性樹脂組成物

Publications (3)

Publication Number Publication Date
JP2005274792A JP2005274792A (ja) 2005-10-06
JP2005274792A5 JP2005274792A5 (enExample) 2007-05-17
JP4641732B2 true JP4641732B2 (ja) 2011-03-02

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ID=35174557

Family Applications (1)

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JP2004085754A Expired - Fee Related JP4641732B2 (ja) 2004-03-23 2004-03-23 感光性樹脂組成物

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JP (1) JP4641732B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4855667B2 (ja) 2004-10-15 2012-01-18 ハリマ化成株式会社 樹脂マスク層の除去方法およびはんだバンプ付き基板の製造方法
KR101132057B1 (ko) * 2006-12-19 2012-04-02 히다치 가세고교 가부시끼가이샤 감광성 엘리먼트
CN101600995B (zh) 2007-01-31 2012-05-09 日立化成工业株式会社 感光性元件
JP2014170041A (ja) * 2013-03-01 2014-09-18 Asahi Kasei E-Materials Corp 感光性樹脂組成物
JP6596957B2 (ja) * 2015-06-15 2019-10-30 日立化成株式会社 導体回路を有する構造体及びその製造方法並びに感光性樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3458000B2 (ja) * 1994-05-26 2003-10-20 旭化成株式会社 光重合性樹脂組成物
JPH08220776A (ja) * 1995-02-13 1996-08-30 Mitsubishi Rayon Co Ltd レジストパターン形成方法
JP3939402B2 (ja) * 1997-09-08 2007-07-04 日本合成化学工業株式会社 レジストパターン形成方法
JP3918647B2 (ja) * 2002-06-13 2007-05-23 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP4238631B2 (ja) * 2003-05-14 2009-03-18 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
JP2005128300A (ja) * 2003-10-24 2005-05-19 Hitachi Chem Co Ltd 感光性樹脂組成物及びこれを用いた感光性エレメント、レジストパターンの製造方法、プリント配線板、ディスプレイ板の製造方法

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Publication number Publication date
JP2005274792A (ja) 2005-10-06

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