JP4634918B2 - 真空処理装置 - Google Patents

真空処理装置 Download PDF

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Publication number
JP4634918B2
JP4634918B2 JP2005342082A JP2005342082A JP4634918B2 JP 4634918 B2 JP4634918 B2 JP 4634918B2 JP 2005342082 A JP2005342082 A JP 2005342082A JP 2005342082 A JP2005342082 A JP 2005342082A JP 4634918 B2 JP4634918 B2 JP 4634918B2
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Japan
Prior art keywords
exhaust
chamber
vacuum
load lock
valve
Prior art date
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Expired - Lifetime
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JP2005342082A
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English (en)
Japanese (ja)
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JP2007149948A5 (https=
JP2007149948A (ja
Inventor
研吾 芦沢
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005342082A priority Critical patent/JP4634918B2/ja
Priority to US11/563,588 priority patent/US20070119393A1/en
Publication of JP2007149948A publication Critical patent/JP2007149948A/ja
Publication of JP2007149948A5 publication Critical patent/JP2007149948A5/ja
Priority to US12/816,750 priority patent/US8623457B2/en
Application granted granted Critical
Publication of JP4634918B2 publication Critical patent/JP4634918B2/ja
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Expired - Lifetime legal-status Critical Current

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  • Chemical Vapour Deposition (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2005342082A 2005-11-28 2005-11-28 真空処理装置 Expired - Lifetime JP4634918B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2005342082A JP4634918B2 (ja) 2005-11-28 2005-11-28 真空処理装置
US11/563,588 US20070119393A1 (en) 2005-11-28 2006-11-27 Vacuum processing system
US12/816,750 US8623457B2 (en) 2005-11-28 2010-06-16 Vacuum processing system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005342082A JP4634918B2 (ja) 2005-11-28 2005-11-28 真空処理装置

Publications (3)

Publication Number Publication Date
JP2007149948A JP2007149948A (ja) 2007-06-14
JP2007149948A5 JP2007149948A5 (https=) 2008-12-04
JP4634918B2 true JP4634918B2 (ja) 2011-02-16

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ID=38210989

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005342082A Expired - Lifetime JP4634918B2 (ja) 2005-11-28 2005-11-28 真空処理装置

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JP (1) JP4634918B2 (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20130016359A (ko) * 2010-07-13 2013-02-14 에스피피 테크놀로지스 컴퍼니 리미티드 기판 처리 방법 및 기판 처리 시스템
JP5654807B2 (ja) * 2010-09-07 2015-01-14 東京エレクトロン株式会社 基板搬送方法及び記憶媒体
JP6045946B2 (ja) * 2012-07-13 2016-12-14 株式会社Screenホールディングス 基板処理装置、プログラムおよび記録媒体
JP6957576B2 (ja) * 2015-05-15 2021-11-02 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated ロードロックチャンバ、ロードロックチャンバを有する真空処理システム及びロードロックチャンバを排気する方法
KR102625511B1 (ko) * 2016-10-05 2024-01-16 주성엔지니어링(주) 로드락챔버 및 로드락챔버의 이물질 배출방법
KR101895407B1 (ko) * 2016-10-31 2018-10-05 세메스 주식회사 기판 처리 장치 및 방법
DE102018107547A1 (de) * 2017-11-15 2019-05-16 Taiwan Semiconductor Manufacturing Co., Ltd. Vorrichtung zur behandlung von substraten oder waferen
CN109962002B (zh) * 2017-12-14 2024-05-03 长鑫存储技术有限公司 半导体干式蚀刻机台及其工艺流程
CN108418584B (zh) * 2018-06-01 2024-02-09 苏州大学 一种用于原子钟蒸汽泡键合封装装置
CN114256048B (zh) * 2020-09-25 2024-04-05 中微半导体设备(上海)股份有限公司 一种等离子体反应装置、方法及机械臂
CN112614799B (zh) * 2020-12-18 2022-12-20 上海广川科技有限公司 一种晶圆传输装置及传输方法
JP7771651B2 (ja) * 2021-11-12 2025-11-18 東京エレクトロン株式会社 基板搬送装置及び基板搬送方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06104178A (ja) * 1992-09-18 1994-04-15 Hitachi Ltd 真空処理方法及び真空処理装置
JP3173681B2 (ja) * 1993-01-18 2001-06-04 東京エレクトロン株式会社 真空排気装置及びその方法
JP3671983B2 (ja) * 1993-10-22 2005-07-13 東京エレクトロン株式会社 真空処理装置
JPH0729962A (ja) * 1993-07-14 1995-01-31 Tokyo Electron Ltd 真空排気方法及び装置
JP3486821B2 (ja) * 1994-01-21 2004-01-13 東京エレクトロン株式会社 処理装置及び処理装置内の被処理体の搬送方法
JPH08148539A (ja) * 1994-11-25 1996-06-07 Sharp Corp 半導体製造装置
JPH08195426A (ja) * 1995-01-18 1996-07-30 Hitachi Ltd 真空搬送用インターフェイス装置
JP3545569B2 (ja) * 1997-03-04 2004-07-21 大日本スクリーン製造株式会社 基板処理装置
JPH11288992A (ja) * 1998-04-06 1999-10-19 Nissin Electric Co Ltd 被処理物体搬送チャンバ
JP2003224173A (ja) * 2002-01-29 2003-08-08 Komatsu Electronic Metals Co Ltd 半導体製造装置
JP3862263B2 (ja) * 2002-08-05 2006-12-27 東京エレクトロン株式会社 真空処理装置およびその運用方法
JP2005116854A (ja) * 2003-10-09 2005-04-28 Canon Inc ロードロックチャンバー、露光装置、デバイスの製造方法

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JP2007149948A (ja) 2007-06-14

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