JP4602181B2 - 半導体検査用ソケット - Google Patents

半導体検査用ソケット Download PDF

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Publication number
JP4602181B2
JP4602181B2 JP2005208047A JP2005208047A JP4602181B2 JP 4602181 B2 JP4602181 B2 JP 4602181B2 JP 2005208047 A JP2005208047 A JP 2005208047A JP 2005208047 A JP2005208047 A JP 2005208047A JP 4602181 B2 JP4602181 B2 JP 4602181B2
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JP
Japan
Prior art keywords
plate
socket
semiconductor device
heat conduction
heater
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Expired - Fee Related
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JP2005208047A
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English (en)
Japanese (ja)
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JP2007024702A (ja
JP2007024702A5 (enExample
Inventor
彰文 金子
公幸 井出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SYSWAVE CORP.
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SYSWAVE CORP.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by SYSWAVE CORP. filed Critical SYSWAVE CORP.
Priority to JP2005208047A priority Critical patent/JP4602181B2/ja
Publication of JP2007024702A publication Critical patent/JP2007024702A/ja
Publication of JP2007024702A5 publication Critical patent/JP2007024702A5/ja
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Publication of JP4602181B2 publication Critical patent/JP4602181B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
JP2005208047A 2005-07-19 2005-07-19 半導体検査用ソケット Expired - Fee Related JP4602181B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005208047A JP4602181B2 (ja) 2005-07-19 2005-07-19 半導体検査用ソケット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005208047A JP4602181B2 (ja) 2005-07-19 2005-07-19 半導体検査用ソケット

Publications (3)

Publication Number Publication Date
JP2007024702A JP2007024702A (ja) 2007-02-01
JP2007024702A5 JP2007024702A5 (enExample) 2007-04-12
JP4602181B2 true JP4602181B2 (ja) 2010-12-22

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ID=37785660

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JP2005208047A Expired - Fee Related JP4602181B2 (ja) 2005-07-19 2005-07-19 半導体検査用ソケット

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JP (1) JP4602181B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7800382B2 (en) 2007-12-19 2010-09-21 AEHR Test Ststems System for testing an integrated circuit of a device and its method of use
US20110014398A1 (en) * 2008-04-09 2011-01-20 Ulvac, Inc. Film deposition apparatus and film deposition method
US8030957B2 (en) 2009-03-25 2011-10-04 Aehr Test Systems System for testing an integrated circuit of a device and its method of use
US20170059635A1 (en) * 2015-08-31 2017-03-02 Teradyne Inc. Conductive temperature control
KR102842851B1 (ko) 2016-01-08 2025-08-05 에어 테스트 시스템즈 일렉트로닉스 테스터 내의 디바이스들의 열 제어를 위한 방법 및 시스템
EP4653878A2 (en) * 2017-03-03 2025-11-26 AEHR Test Systems Electronics tester
CN110261158B (zh) * 2019-07-09 2024-03-01 应急管理部沈阳消防研究所 一种用于防火监控报警插座与开关的温度试验装置
JP7425305B2 (ja) * 2020-06-15 2024-01-31 ダイトロン株式会社 検査治具及び検査装置
CN120254561A (zh) 2020-10-07 2025-07-04 雅赫测试系统公司 电子测试器
CN112763092B (zh) * 2021-01-08 2025-02-07 维尔斯电子(昆山)有限公司 热敏电阻测试系统
CN117250468B (zh) * 2023-11-17 2024-01-26 福建福碳新材料科技有限公司 一种三代半导体用等静压石墨衬底检验台

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6126276A (ja) * 1984-07-14 1986-02-05 Canon Inc レ−ザユニツト
JPH1144727A (ja) * 1997-07-24 1999-02-16 Hioki Ee Corp 回路基板検査装置

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JP2007024702A (ja) 2007-02-01

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