JP4594488B2 - スパッタリングターゲット - Google Patents

スパッタリングターゲット Download PDF

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Publication number
JP4594488B2
JP4594488B2 JP2000112409A JP2000112409A JP4594488B2 JP 4594488 B2 JP4594488 B2 JP 4594488B2 JP 2000112409 A JP2000112409 A JP 2000112409A JP 2000112409 A JP2000112409 A JP 2000112409A JP 4594488 B2 JP4594488 B2 JP 4594488B2
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JP
Japan
Prior art keywords
target
bonding
metal layer
backing plate
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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JP2000112409A
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English (en)
Japanese (ja)
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JP2001295040A (ja
JP2001295040A5 (enExample
Inventor
泰郎 高阪
隆 石上
直美 藤岡
高志 渡辺
幸伸 鈴木
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Toshiba Corp
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Toshiba Corp
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Publication date
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Priority to JP2000112409A priority Critical patent/JP4594488B2/ja
Publication of JP2001295040A publication Critical patent/JP2001295040A/ja
Publication of JP2001295040A5 publication Critical patent/JP2001295040A5/ja
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Publication of JP4594488B2 publication Critical patent/JP4594488B2/ja
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  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP2000112409A 2000-04-13 2000-04-13 スパッタリングターゲット Expired - Lifetime JP4594488B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000112409A JP4594488B2 (ja) 2000-04-13 2000-04-13 スパッタリングターゲット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000112409A JP4594488B2 (ja) 2000-04-13 2000-04-13 スパッタリングターゲット

Publications (3)

Publication Number Publication Date
JP2001295040A JP2001295040A (ja) 2001-10-26
JP2001295040A5 JP2001295040A5 (enExample) 2007-05-10
JP4594488B2 true JP4594488B2 (ja) 2010-12-08

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ID=18624587

Family Applications (1)

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JP2000112409A Expired - Lifetime JP4594488B2 (ja) 2000-04-13 2000-04-13 スパッタリングターゲット

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JP (1) JP4594488B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111185659A (zh) * 2020-02-18 2020-05-22 宁波江丰电子材料股份有限公司 一种钛靶材和背板的扩散焊接方法及制得的钛靶材组件

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4706926B2 (ja) * 2006-03-17 2011-06-22 三菱マテリアル株式会社 バッキングプレート付きターゲットの製造方法
EP2119808B1 (en) * 2007-02-09 2014-09-17 JX Nippon Mining & Metals Corporation Target formed of sintering-resistant material of high-melting point metal alloy, high-melting point metal silicide, high-melting point metal carbide, high-melting point metal nitride, or high-melting point metal boride, process for producing the target, assembly of the sputtering target-backing plate, and process for producing the same
US10006117B2 (en) 2010-10-27 2018-06-26 Jx Nippon Mining & Metals Corporation Sputtering target-backing plate assembly and method for producing same
CN102554455B (zh) * 2011-12-31 2015-07-08 宁波江丰电子材料股份有限公司 钨钛合金靶材与铜合金背板扩散焊接方法
US20150197848A1 (en) 2012-07-04 2015-07-16 Jx Nippon Mining & Metals Corporation Sputtering Target
CN103521916A (zh) * 2012-07-05 2014-01-22 宁波江丰电子材料有限公司 靶材组件的焊接方法
KR101466039B1 (ko) * 2013-06-11 2014-11-27 한국생산기술연구원 비정질 형성능을 가지는 금속원소를 포함하는 결정질 합금들의 접합 방법, 스퍼터링 타겟 구조체 및 그 제조방법
CN103952676B (zh) * 2014-05-07 2016-01-06 武汉理工大学 一种b轴取向的BaTi2O5薄膜的制备方法
AT14346U1 (de) 2014-07-08 2015-09-15 Plansee Se Target und Verfahren zur Herstellung eines Targets
KR102622052B1 (ko) 2015-08-03 2024-01-08 허니웰 인터내셔널 인코포레이티드 개선된 특성을 갖는 무마찰 단조 알루미늄 합금 스퍼터링 타겟
JP6277309B2 (ja) 2016-07-13 2018-02-07 住友化学株式会社 スパッタリングターゲットの製造方法およびスパッタリングターゲット
US10900102B2 (en) 2016-09-30 2021-01-26 Honeywell International Inc. High strength aluminum alloy backing plate and methods of making
CN112846651B (zh) * 2020-12-25 2022-10-28 宁波江丰电子材料股份有限公司 一种钛靶材与铝背板的装配方法
CN117328025A (zh) * 2023-09-28 2024-01-02 河南东微电子材料有限公司 一种小尺寸靶材与背板的绑定方法
US20250122608A1 (en) * 2023-10-13 2025-04-17 Honeywell International Inc. Diffusion bonded tungsten containing target to titanium or titanium alloy backing plate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3525348B2 (ja) * 1992-09-29 2004-05-10 株式会社日鉱マテリアルズ 拡散接合されたスパッタリングターゲット組立体の製造方法
JPH08246144A (ja) * 1995-03-10 1996-09-24 Japan Energy Corp スパッタリングターゲット用バッキングプレート組立部品
JPH0959770A (ja) * 1995-08-23 1997-03-04 Hitachi Metals Ltd スパッタリング用ターゲットおよびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111185659A (zh) * 2020-02-18 2020-05-22 宁波江丰电子材料股份有限公司 一种钛靶材和背板的扩散焊接方法及制得的钛靶材组件

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JP2001295040A (ja) 2001-10-26

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