JP4578269B2 - 光重合性樹脂組成物 - Google Patents

光重合性樹脂組成物 Download PDF

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Publication number
JP4578269B2
JP4578269B2 JP2005046493A JP2005046493A JP4578269B2 JP 4578269 B2 JP4578269 B2 JP 4578269B2 JP 2005046493 A JP2005046493 A JP 2005046493A JP 2005046493 A JP2005046493 A JP 2005046493A JP 4578269 B2 JP4578269 B2 JP 4578269B2
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JP
Japan
Prior art keywords
mass
photopolymerizable resin
plating
resin composition
group
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Expired - Lifetime
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JP2005046493A
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English (en)
Japanese (ja)
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JP2006234995A (ja
JP2006234995A5 (enrdf_load_stackoverflow
Inventor
祐二 岡田
慎司 有久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Kasei Corp
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Asahi Kasei E Materials Corp
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Priority to JP2005046493A priority Critical patent/JP4578269B2/ja
Publication of JP2006234995A publication Critical patent/JP2006234995A/ja
Publication of JP2006234995A5 publication Critical patent/JP2006234995A5/ja
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Publication of JP4578269B2 publication Critical patent/JP4578269B2/ja
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Expired - Lifetime legal-status Critical Current

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  • Materials For Photolithography (AREA)
JP2005046493A 2005-02-23 2005-02-23 光重合性樹脂組成物 Expired - Lifetime JP4578269B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005046493A JP4578269B2 (ja) 2005-02-23 2005-02-23 光重合性樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005046493A JP4578269B2 (ja) 2005-02-23 2005-02-23 光重合性樹脂組成物

Publications (3)

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JP2006234995A JP2006234995A (ja) 2006-09-07
JP2006234995A5 JP2006234995A5 (enrdf_load_stackoverflow) 2008-04-03
JP4578269B2 true JP4578269B2 (ja) 2010-11-10

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ID=37042744

Family Applications (1)

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JP2005046493A Expired - Lifetime JP4578269B2 (ja) 2005-02-23 2005-02-23 光重合性樹脂組成物

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JP (1) JP4578269B2 (enrdf_load_stackoverflow)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20090084941A (ko) * 2006-12-19 2009-08-05 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
KR101141909B1 (ko) * 2006-12-27 2012-05-03 히다치 가세고교 가부시끼가이샤 감광성수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 프린트 배선판의 제조방법
TW200919085A (en) 2007-09-18 2009-05-01 Asahi Kasei Emd Corp Photosensitive resin composition and laminate thereof
US8586284B2 (en) 2008-03-21 2013-11-19 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method of forming resist pattern, and process for producing printed wiring board
CN101981502A (zh) 2008-05-30 2011-02-23 日立化成工业株式会社 感光性树脂组合物、感光性元件、抗蚀图形的形成方法及印刷电路板的制造方法
JP5935462B2 (ja) * 2011-05-10 2016-06-15 日立化成株式会社 感光性エレメント、レジストパターンの形成方法、プリント配線板の製造方法
JP6318484B2 (ja) * 2013-07-09 2018-05-09 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
US10564543B2 (en) 2014-09-18 2020-02-18 Hitachi Chemical Company, Ltd. Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board
US20240392048A1 (en) 2021-09-28 2024-11-28 Resonac Corporation Polymer, photosensitive resin composition, photosensitive element, method for forming resist pattern, and method for forming wiring pattern

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH095991A (ja) * 1995-06-23 1997-01-10 Japan Synthetic Rubber Co Ltd ドライフィルム製造用放射線硬化性組成物
JP3870536B2 (ja) * 1998-02-17 2007-01-17 Ｊｓｒ株式会社 プラズマディスプレイパネルの製造方法
JP2000095992A (ja) * 1998-09-22 2000-04-04 Dainippon Printing Co Ltd 顔料分散剤及び感光性着色組成物
JP3693035B2 (ja) * 2002-04-09 2005-09-07 Ｊｓｒ株式会社 放射線性組成物、カラーフィルタ、ブラックマトリクスおよび液晶表示素子
JP4257106B2 (ja) * 2002-12-05 2009-04-22 旭化成エレクトロニクス株式会社 感光性樹脂組成物及びその使用
JP2004287230A (ja) * 2003-03-24 2004-10-14 Dainippon Printing Co Ltd 着色パターン用硬化性樹脂組成物、カラーフィルター、及び、液晶パネル
JP2004303976A (ja) * 2003-03-31 2004-10-28 Tdk Corp 積層部品の製造方法及び電極付きグリーンシート

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Publication number Publication date
JP2006234995A (ja) 2006-09-07

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