JP4576205B2 - X線検出器の温度を調整する熱電冷却装置及び方法 - Google Patents
X線検出器の温度を調整する熱電冷却装置及び方法 Download PDFInfo
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- JP4576205B2 JP4576205B2 JP2004313232A JP2004313232A JP4576205B2 JP 4576205 B2 JP4576205 B2 JP 4576205B2 JP 2004313232 A JP2004313232 A JP 2004313232A JP 2004313232 A JP2004313232 A JP 2004313232A JP 4576205 B2 JP4576205 B2 JP 4576205B2
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- Prior art keywords
- temperature
- ray detector
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- thermoelectric
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
- F25B21/04—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect reversible
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
- F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
- F25B2321/021—Control thereof
- F25B2321/0212—Control thereof of electric power, current or voltage
Description
200 熱電温度調整装置
402 コントローラ
404 温度センサ
408 電源
410 スイッチ
Claims (9)
- X線検出器の温度を調節する熱電温度調整装置(200)であって、
コントローラ(402)と、
前記コントローラに温度データを伝える温度センサ(404)と、
前記温度センサから温度データを受けている前記コントローラに応答する、正電圧接点(201)と負電圧接点(202)とを有する熱電デバイス(406)と、
前記X線検出器のX線パネル(208)と接触した放熱プレート(212)と、
ヒートパイプを介して前記放熱プレート(212)と熱接触し、前記熱電デバイス(406)と熱接触した冷却プレート(204)と、
前記X線検出器の電子機器(222)を前記冷却プレート(204)及び前記ヒートパイプから熱絶縁する熱絶縁体と、
を含み、
前記放熱プレート(212)と前記冷却プレート(204)のいずれかが前記熱電デバイス(406)に熱的に接続する、装置。 - 前記正電圧接点と負電圧接点とを切り換えるスイッチ(410)をさらに含む、請求項1記載の装置。
- 前記温度センサが熱電対であり、前記熱絶縁体がエポキシ樹脂系絶縁材料である、請求項1記載の装置。
- 前記正電圧接点及び負電圧接点に接続された電源(408)をさらに含む、請求項1記載の装置。
- 前記熱電デバイスが半導体熱電デバイスであり、前記ヒートパイプが、アルミニウム又は熱伝導セラミック材料で作成されている、請求項1乃至4のいずれかに記載の装置。
- 温度データの受信に応答して前記コントローラによって制御される、正電圧接点における電流方向を制御するスイッチ(410)をさらに含む、請求項1記載の装置。
- 前記コントローラが前記X線検出器内のX線パネル(208)を所定の温度範囲内に維持するように前記熱電デバイスを制御する、請求項1記載の装置。
- 前記所定の温度範囲が25℃〜35℃である、請求項7記載の装置。
- X線検出器の温度を調節する方法であって、
医用X線検出器の温度を測定する段階と、
前記医用X線検出器の温度が所定の範囲内にあるか否かを判定する段階と、
正電圧接点(201)と負電圧接点(202)とを有する熱電温度デバイス(100)に流れる電流を調整して前記医用X線検出器の温度を変更する段階と、
前記X線検出器のX線パネル(208)と接触し、ヒートパイプを介して冷却プレート(204)と熱接触した放熱プレート(212)を提供する段階と、
前記X線検出器の電子機器(222)を前記冷却プレート(204)及び前記ヒートパイプから熱絶縁する段階と、
を含み、
前記放熱プレート(212)の熱が前記ヒートパイプを介して前記熱電デバイス(406)と熱接触した前記冷却プレート(204)に伝達される、方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/695,318 US7313921B2 (en) | 2003-10-28 | 2003-10-28 | Apparatus and method for thermo-electric cooling |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005134396A JP2005134396A (ja) | 2005-05-26 |
JP2005134396A5 JP2005134396A5 (ja) | 2007-12-06 |
JP4576205B2 true JP4576205B2 (ja) | 2010-11-04 |
Family
ID=34522772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004313232A Expired - Fee Related JP4576205B2 (ja) | 2003-10-28 | 2004-10-28 | X線検出器の温度を調整する熱電冷却装置及び方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7313921B2 (ja) |
JP (1) | JP4576205B2 (ja) |
DE (1) | DE102004052088A1 (ja) |
Families Citing this family (27)
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US8028531B2 (en) * | 2004-03-01 | 2011-10-04 | GlobalFoundries, Inc. | Mitigating heat in an integrated circuit |
KR20090064685A (ko) * | 2007-12-17 | 2009-06-22 | 삼성전자주식회사 | 엑스레이 디텍팅 방법 및 이를 수행하기 위한 엑스레이디텍터 |
US8522570B2 (en) * | 2008-06-13 | 2013-09-03 | Oracle America, Inc. | Integrated circuit chip cooling using magnetohydrodynamics and recycled power |
US8039812B1 (en) * | 2010-04-13 | 2011-10-18 | Surescan Corporation | Test equipment for verification of crystal linearity at high-flux levels |
EP2583320A4 (en) | 2010-06-18 | 2014-01-22 | Empire Technology Dev Llc | ELECTROCALORIC EFFECT MATERIALS AND THERMAL DIODES |
WO2012030351A1 (en) | 2010-09-03 | 2012-03-08 | Empire Technology Development Llc | Electrocaloric heat transfer |
US9157669B2 (en) * | 2011-04-20 | 2015-10-13 | Empire Technology Development Llc | Heterogeneous electrocaloric effect heat transfer device |
JP5161346B2 (ja) * | 2011-07-28 | 2013-03-13 | 富士フイルム株式会社 | 画像検出器及び画像撮影システム |
GB201114151D0 (en) * | 2011-08-17 | 2011-10-05 | Johnson Matthey Plc | Density and level measurement apparatus |
US9310109B2 (en) | 2011-09-21 | 2016-04-12 | Empire Technology Development Llc | Electrocaloric effect heat transfer device dimensional stress control |
CN103827601B (zh) | 2011-09-21 | 2016-08-17 | 英派尔科技开发有限公司 | 异质电热效应热传递 |
WO2013043167A1 (en) | 2011-09-21 | 2013-03-28 | Empire Technology Development Llc | Electrocaloric effect heat transfer device dimensional stress control |
US9500392B2 (en) | 2012-07-17 | 2016-11-22 | Empire Technology Development Llc | Multistage thermal flow device and thermal energy transfer |
WO2014046640A1 (en) | 2012-09-18 | 2014-03-27 | Empire Technology Development Llc | Phase change memory thermal management with the electrocaloric effect materials |
CN103713669B (zh) * | 2013-12-27 | 2015-09-16 | 赛诺威盛科技(北京)有限公司 | 闭环实施的精确控制ct探测器温度的装置及方法 |
DE102015101207A1 (de) * | 2015-01-27 | 2016-07-28 | Aesculap Ag | Steriles Schutzvorrichtungssystem |
TWI572272B (zh) | 2015-10-30 | 2017-02-21 | 財團法人工業技術研究院 | 功率散熱裝置 |
US11493551B2 (en) | 2020-06-22 | 2022-11-08 | Advantest Test Solutions, Inc. | Integrated test cell using active thermal interposer (ATI) with parallel socket actuation |
US11549981B2 (en) | 2020-10-01 | 2023-01-10 | Advantest Test Solutions, Inc. | Thermal solution for massively parallel testing |
US11808812B2 (en) | 2020-11-02 | 2023-11-07 | Advantest Test Solutions, Inc. | Passive carrier-based device delivery for slot-based high-volume semiconductor test system |
US11821913B2 (en) | 2020-11-02 | 2023-11-21 | Advantest Test Solutions, Inc. | Shielded socket and carrier for high-volume test of semiconductor devices |
US20220155364A1 (en) | 2020-11-19 | 2022-05-19 | Advantest Test Solutions, Inc. | Wafer scale active thermal interposer for device testing |
US11567119B2 (en) | 2020-12-04 | 2023-01-31 | Advantest Test Solutions, Inc. | Testing system including active thermal interposer device |
US11573262B2 (en) | 2020-12-31 | 2023-02-07 | Advantest Test Solutions, Inc. | Multi-input multi-zone thermal control for device testing |
US11587640B2 (en) | 2021-03-08 | 2023-02-21 | Advantest Test Solutions, Inc. | Carrier based high volume system level testing of devices with pop structures |
US11656273B1 (en) | 2021-11-05 | 2023-05-23 | Advantest Test Solutions, Inc. | High current device testing apparatus and systems |
US11835549B2 (en) | 2022-01-26 | 2023-12-05 | Advantest Test Solutions, Inc. | Thermal array with gimbal features and enhanced thermal performance |
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US20040025516A1 (en) * | 2002-08-09 | 2004-02-12 | John Van Winkle | Double closed loop thermoelectric heat exchanger |
-
2003
- 2003-10-28 US US10/695,318 patent/US7313921B2/en not_active Expired - Lifetime
-
2004
- 2004-10-26 DE DE102004052088A patent/DE102004052088A1/de not_active Withdrawn
- 2004-10-28 JP JP2004313232A patent/JP4576205B2/ja not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5940784A (en) * | 1996-03-08 | 1999-08-17 | Metrisa, Inc. | Heat flow meter instruments |
JPH11345956A (ja) * | 1998-03-16 | 1999-12-14 | Canon Inc | 撮像装置 |
US6098408A (en) * | 1998-11-11 | 2000-08-08 | Advanced Micro Devices | System for controlling reflection reticle temperature in microlithography |
JP2002341044A (ja) * | 2001-05-15 | 2002-11-27 | Toshiba Medical System Co Ltd | 放射線検査装置 |
JP2003014860A (ja) * | 2001-06-29 | 2003-01-15 | Toshiba Corp | 放射線検出器および放射線検査装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2005134396A (ja) | 2005-05-26 |
US20050086948A1 (en) | 2005-04-28 |
US7313921B2 (en) | 2008-01-01 |
DE102004052088A1 (de) | 2005-05-25 |
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