JP4574821B2 - 半導体装置及び薄膜 - Google Patents

半導体装置及び薄膜 Download PDF

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Publication number
JP4574821B2
JP4574821B2 JP2000278617A JP2000278617A JP4574821B2 JP 4574821 B2 JP4574821 B2 JP 4574821B2 JP 2000278617 A JP2000278617 A JP 2000278617A JP 2000278617 A JP2000278617 A JP 2000278617A JP 4574821 B2 JP4574821 B2 JP 4574821B2
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Japan
Prior art keywords
film
interlayer insulating
thin film
semiconductor device
wiring
Prior art date
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Expired - Fee Related
Application number
JP2000278617A
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English (en)
Japanese (ja)
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JP2001313335A5 (enExample
JP2001313335A (ja
Inventor
隆 杉野
昌樹 楠原
優 梅田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Watanabe Shoko KK
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Watanabe Shoko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Watanabe Shoko KK filed Critical Watanabe Shoko KK
Priority to JP2000278617A priority Critical patent/JP4574821B2/ja
Publication of JP2001313335A publication Critical patent/JP2001313335A/ja
Publication of JP2001313335A5 publication Critical patent/JP2001313335A5/ja
Application granted granted Critical
Publication of JP4574821B2 publication Critical patent/JP4574821B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Formation Of Insulating Films (AREA)
JP2000278617A 2000-02-25 2000-09-13 半導体装置及び薄膜 Expired - Fee Related JP4574821B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000278617A JP4574821B2 (ja) 2000-02-25 2000-09-13 半導体装置及び薄膜

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000049291 2000-02-25
JP2000-49291 2000-02-25
JP2000278617A JP4574821B2 (ja) 2000-02-25 2000-09-13 半導体装置及び薄膜

Publications (3)

Publication Number Publication Date
JP2001313335A JP2001313335A (ja) 2001-11-09
JP2001313335A5 JP2001313335A5 (enExample) 2008-05-29
JP4574821B2 true JP4574821B2 (ja) 2010-11-04

Family

ID=26586100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000278617A Expired - Fee Related JP4574821B2 (ja) 2000-02-25 2000-09-13 半導体装置及び薄膜

Country Status (1)

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JP (1) JP4574821B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4497323B2 (ja) * 2006-03-29 2010-07-07 三菱電機株式会社 プラズマｃｖｄ装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6337637A (ja) * 1986-08-01 1988-02-18 Fujitsu Ltd 多層配線構造の半導体装置および製法
JPH0499049A (ja) * 1990-08-06 1992-03-31 Kawasaki Steel Corp 半導体装置
JP2001015595A (ja) * 1999-06-29 2001-01-19 Mitsubishi Electric Corp 半導体装置

Also Published As

Publication number Publication date
JP2001313335A (ja) 2001-11-09

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