JP4565791B2 - マイクロプレート把持用装置 - Google Patents

マイクロプレート把持用装置 Download PDF

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Publication number
JP4565791B2
JP4565791B2 JP2001532931A JP2001532931A JP4565791B2 JP 4565791 B2 JP4565791 B2 JP 4565791B2 JP 2001532931 A JP2001532931 A JP 2001532931A JP 2001532931 A JP2001532931 A JP 2001532931A JP 4565791 B2 JP4565791 B2 JP 4565791B2
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JP
Japan
Prior art keywords
base
microplate
plate gasket
vertical
raised edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2001532931A
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English (en)
Japanese (ja)
Other versions
JP2003512191A5 (enExample
JP2003512191A (ja
Inventor
クラーク，グレン・エイ
フエイリン，マーク・エヌ
キヤス，ゲーリー・エス
キング，グレゴリイ・ダブリユ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Merck and Co Inc
Original Assignee
Merck and Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Merck and Co Inc filed Critical Merck and Co Inc
Publication of JP2003512191A publication Critical patent/JP2003512191A/ja
Publication of JP2003512191A5 publication Critical patent/JP2003512191A5/ja
Application granted granted Critical
Publication of JP4565791B2 publication Critical patent/JP4565791B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/0099—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor comprising robots or similar manipulators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
    • G01N35/04—Details of the conveyor system
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/02—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor using a plurality of sample containers moved by a conveyor system past one or more treatment or analysis stations
    • G01N35/04—Details of the conveyor system
    • G01N2035/0401—Sample carriers, cuvettes or reaction vessels
    • G01N2035/0418—Plate elements with several rows of samples
    • G01N2035/042—Plate elements with several rows of samples moved independently, e.g. by fork manipulator
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49998—Work holding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53991—Work gripper, anvil, or element

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Robotics (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Automatic Analysis And Handling Materials Therefor (AREA)
  • Manipulator (AREA)
  • Sampling And Sample Adjustment (AREA)
JP2001532931A 1999-10-22 2000-10-18 マイクロプレート把持用装置 Expired - Fee Related JP4565791B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16121699P 1999-10-22 1999-10-22
US60/161,216 1999-10-22
PCT/US2000/028781 WO2001030541A1 (en) 1999-10-22 2000-10-18 Apparatus for gripping microplates

Publications (3)

Publication Number Publication Date
JP2003512191A JP2003512191A (ja) 2003-04-02
JP2003512191A5 JP2003512191A5 (enExample) 2010-08-19
JP4565791B2 true JP4565791B2 (ja) 2010-10-20

Family

ID=22580324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001532931A Expired - Fee Related JP4565791B2 (ja) 1999-10-22 2000-10-18 マイクロプレート把持用装置

Country Status (6)

Country Link
US (1) US6449827B1 (enExample)
EP (1) EP1226004A4 (enExample)
JP (1) JP4565791B2 (enExample)
AU (1) AU774002B2 (enExample)
CA (1) CA2386760C (enExample)
WO (1) WO2001030541A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6825042B1 (en) * 1998-02-24 2004-11-30 Vertex Pharmaceuticals (San Diego) Llc Microplate lid
FI981717L (fi) 1998-08-07 2000-02-08 Borealis As Katalysaattorikomponentti, joka käsittää magnesiumia, titaania, halogeenia ja elektronidonorin, sen valmistus ja käyttö
US6843962B2 (en) * 2001-09-06 2005-01-18 Genetix Limited Apparatus for and methods of handling biological sample containers
US6998094B2 (en) * 2001-09-06 2006-02-14 Genetix Limited Apparatus for and methods of handling biological sample containers
US20060032037A1 (en) * 2004-08-13 2006-02-16 Dar-Wen Lo [assembling method and device thereof]
US8221697B2 (en) * 2007-01-12 2012-07-17 Nichols Michael J Apparatus for lidding or delidding microplate
US8703492B2 (en) * 2007-04-06 2014-04-22 Qiagen Gaithersburg, Inc. Open platform hybrid manual-automated sample processing system
EP2263802A1 (en) * 2009-05-25 2010-12-22 F. Hoffmann-La Roche AG System and method for dispensing fluids
US9953141B2 (en) 2009-11-18 2018-04-24 Becton, Dickinson And Company Laboratory central control unit method and system
CN103183201B (zh) * 2011-12-29 2016-01-13 富泰华工业（深圳）有限公司 吸附装置
CH706811A1 (de) 2012-08-09 2014-02-14 Tecan Trading Ag Mikroplatten-Reader mit Deckelabheber für Mikroplatten.
US9568414B2 (en) 2012-08-09 2017-02-14 Tecan Trading Ag Microplate reader with lid lifter for microplates
US9993824B2 (en) 2012-08-09 2018-06-12 Tecan Trading Ag Microplate reader with lid lifter for microplates
CA2791003C (en) * 2012-09-27 2013-08-06 Cinrg Systems Inc. Liquid sample testing apparatus
CN103264362A (zh) * 2013-05-06 2013-08-28 苏州金牛精密机械有限公司 一种真空吸盘定位治具
EP3330697A1 (de) * 2016-11-30 2018-06-06 Bayer Aktiengesellschaft Vorrichtung zur ermittlung der wirkung von wirkstoffen an nematoden und anderen organismen in wässrigen tests
EP3687693B1 (en) * 2017-09-29 2023-06-28 Siemens Healthcare Diagnostics Inc. Test tube vacuum retainer
JP7002326B2 (ja) * 2017-12-26 2022-01-20 川崎重工業株式会社 蓋閉じ装置及び蓋閉じ方法
CN109434703A (zh) * 2018-10-12 2019-03-08 中航华东光电有限公司 柔性可调式吸附平台
CN113583849A (zh) * 2021-09-13 2021-11-02 英诺维尔智能科技（苏州）有限公司 一种相互独立的多振荡单元多孔板全自动化摇床培养箱
CN115405823A (zh) * 2022-09-09 2022-11-29 深圳鸣基医疗科技有限公司 微板支架及微板组件

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3584859A (en) * 1969-01-03 1971-06-15 Robert E Siron Vacuum-operated specimen-holding device
US3617045A (en) * 1970-01-14 1971-11-02 Motorola Inc Vacuum-actuated chuck
JPS527223B2 (enExample) * 1973-05-28 1977-03-01
JPS5831916B2 (ja) * 1976-04-30 1983-07-09 オリンパス光学工業株式会社 自動培養装置におけるシヤ−レの蓋開閉装置
JPS56158200U (enExample) * 1980-04-28 1981-11-25
US4403567A (en) * 1980-08-21 1983-09-13 Commonwealth Scientific Corporation Workpiece holder
JPS5894383A (ja) * 1981-11-30 1983-06-04 Terumo Corp 培養器具
DE3208864A1 (de) * 1982-03-11 1983-09-22 Herbert 8000 München Gulden An einer werkzeugmaschine fuer spanende bearbeitung angeordnete werkstueckspannvorrichtung
JPS6052281A (ja) * 1983-08-31 1985-03-25 株式会社東芝 搬送箱操作方法
JPS6067100U (ja) * 1983-10-17 1985-05-13 テルモ株式会社 多穴容器
US4657867A (en) * 1984-11-01 1987-04-14 Becton, Dickinson And Company Multiwell tissue culture assembly with features for reduced media evaporation
JPS63207377A (ja) * 1987-02-23 1988-08-26 Erumetsukusu:Kk 自動培地分画分注装置
JP2714827B2 (ja) * 1988-10-24 1998-02-16 株式会社イシダ 種菌充填装置
JP2577995Y2 (ja) * 1991-03-28 1998-08-06 株式会社カントー技研 容器の充填装置
JPH068085A (ja) * 1992-04-02 1994-01-18 Kenji Matsuda 吸引式固定装置
US5201696A (en) * 1992-05-05 1993-04-13 Universal Instruments Corp. Apparatus for replacement of vacuum nozzles
JPH0775551A (ja) * 1993-09-10 1995-03-20 Mitsui Toatsu Chem Inc シャーレ蓋自動開閉方法及びそれに用いる装置
DE4412286A1 (de) * 1994-04-09 1995-10-12 Boehringer Mannheim Gmbh System zur kontaminationsfreien Bearbeitung von Reaktionsabläufen
JPH08114596A (ja) * 1994-10-14 1996-05-07 Mitsubishi Materials Corp マイクロプレート
KR0176434B1 (ko) * 1995-10-27 1999-04-15 이대원 진공 척 장치
WO1997042304A1 (de) * 1996-05-07 1997-11-13 Ovidio Pitzurra Gerät zur bestimmung der zahl von mikroorganismen in luft sowie ein verfahren zum betrieb dieses gerätes
US6164633A (en) * 1999-05-18 2000-12-26 International Business Machines Corporation Multiple size wafer vacuum chuck

Also Published As

Publication number Publication date
AU774002B2 (en) 2004-06-10
EP1226004A4 (en) 2009-03-25
WO2001030541A1 (en) 2001-05-03
CA2386760C (en) 2006-07-18
CA2386760A1 (en) 2001-05-03
JP2003512191A (ja) 2003-04-02
US6449827B1 (en) 2002-09-17
EP1226004A1 (en) 2002-07-31
AU1212101A (en) 2001-05-08

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