JP4565634B2 - 半導体装置およびその製造方法 - Google Patents
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Description
図1(a)は、本発明の実施の形態1に係る半導体装置の断面図である。図1(a)は、クランク状に段差を設けてフォーミングされた第一リード端子1の上段第一主面に半導体チップ3がロー付けにて電気的に導通され、該半導体チップ3の第一主面には電極部4を有し、クランク状に段差を設けてフォーミングされた第二リード端子2が第一リード端子1と対向して、且つ、第一リード端子1の下段第二主面と該第二リード端子2の下段第二主面とが同一面に設けられ、電極部4と第二リード端子2の上段第一主面とにロー材である第一のはんだ5とロー材である第二のはんだ6とを有し、電極部4と第二リード端子2の上段第一主面とを第一のはんだ5と第二のはんだ6とではんだ接続された金属片であるフレーム7を介して電気的に導通され、半導体チップ3と電極部4と第一のはんだ5と第二のはんだ6とフレーム7と、第一リード端子1と第二リード端子2との一部を含んで覆ったモールド部8を備えてなる半導体装置である。
図1(b)は、本発明の実施の形態2に係る半導体装置の断面図である。図1(b)は、実施の形態1で示した図1(a)の第二リード端子2の上段第一主面と電極部4表面とを同一高さの面とし、フレーム7をフレームII10に置き換えたもので、他は図1(a)と同様である。
2 第二リード端子
3 半導体チップ
4 電極部
5 第一のはんだ
6 第二のはんだ
7 フレーム
7a 第一先端部
7b 第二先端部
8 モールド部
10 フレームII
10a 第一の溝
10b 第二の溝
Claims (7)
- クランク状に段差を設けてフォーミングされた第一リード端子の上段第一主面に半導体チップがロー付けにて電気的に導通され、該半導体チップの第一主面には電極部を有し、クランク状に段差を設けてフォーミングされた第二リード端子が前記第一リード端子と対向して且つ前記第一リード端子の下段第二主面と前記第二リード端子の下段第二主面とが同一面に設けられ、前記電極部と前記第二リード端子の上段第一主面とにロー材を有し、前記電極部と前記第二リード端子の上段第一主面とを前記ロー材で接続されたフレームを介して電気的に導通され、前記半導体チップと前記電極部と前記ロー材と前記フレームと、前記第一リード端子と前記第二リード端子との一部を含んで覆ったモールド部を備えてなる半導体装置に於いて、
前記フレームの前記電極部に固定される部分の第二主面には、前記電極部の外周縁のうち前記フレームの幅方向に延びる一対の辺の間に対応するように位置し、かつ、各々が前記フレームの幅方向に横断する一対の溝である第一の溝が形成され、
前記フレームと前記電極部とがロー付けされた際における、前記第一の溝への前記ロー材の毛管現象によって、前記ロー材が前記第一の溝に吸い上げられている、半導体装置。 - 前記フレームは、前記電極部側の端部である第一先端部が、当該第一先端部を除く中央部分より下段となるように、クランク状に段差を設けてフォーミングされ、
前記電極部の表面より小さく形成された前記第一先端部の第二主面が、前記電極部の表面に収まるように、前記電極部に固定されており、
前記第一先端部の第二主面と前記電極部とがロー付けされた際における、前記第一先端部の第二主面を取り囲む前記第一先端部の側面への前記ロー材の毛管現象によって、前記ロー材が前記第一先端部の側面に濡れ上がっており、
前記第一の溝は、前記第一先端部の第二主面に形成されている、請求項1に記載の半導体装置。 - 前記電極部表面と前記第二リード端子の上段第一主面とが同一高さに位置する事を特徴とする請求項1または2に記載の半導体装置。
- 前記フレームは、前記フレームの中心を通り、かつ、前記フレームの幅方向に延びる軸に対称の形態を有する、請求項1〜3に記載の半導体装置。
- 前記フレームは、第二リード端子側の端部である第二先端部が、前記中央部分より下段となるように、クランク状に段差を設けてフォーミングされ、
前記第一先端部と、前記第二先端部とは、前記第一先端部の中心と前記第二先端部の中心とを結ぶ線に直交する線分を軸に対称の形態を有する、請求項2〜4に記載の半導体装置。 - 前記フレームにおける、前記第二リード端子の上段第一主面に固定される部分の第二主面に、当該フレームの幅方向に横断する第二の溝が形成され、
前記第一の溝と、前記第二の溝とは、前記フレームの幅方向に延びる軸に対称な形態を有する、請求項1〜5に記載の半導体装置。 - 前記フレームは、一方面に前記第一の溝が形成され、他方面に第三の溝が形成され、
前記第一の溝と、前記第三の溝とは、前記一方面と前記他方面との間に位置し、かつ、前記一方面及び前記他方面に平行な面に対称な形態を有する、請求項1〜6に記載の半導体装置。
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5542627B2 (ja) * | 2010-11-11 | 2014-07-09 | 新電元工業株式会社 | 接続板、接合構造及び半導体装置 |
CN103503132B (zh) * | 2011-06-09 | 2016-06-01 | 三菱电机株式会社 | 半导体装置 |
JP2013143552A (ja) * | 2012-01-12 | 2013-07-22 | Mitsubishi Electric Corp | 半導体装置 |
JP2013232566A (ja) * | 2012-04-28 | 2013-11-14 | Shindengen Electric Mfg Co Ltd | 電子回路パッケージ |
JP6239840B2 (ja) * | 2013-03-27 | 2017-11-29 | ローム株式会社 | 半導体装置および半導体装置の製造方法 |
JP7043225B2 (ja) * | 2017-11-08 | 2022-03-29 | 株式会社東芝 | 半導体装置 |
JP7014298B2 (ja) | 2018-06-18 | 2022-02-01 | 富士電機株式会社 | 半導体装置 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001237358A (ja) * | 2000-02-21 | 2001-08-31 | Rohm Co Ltd | パッケージ型二端子半導体装置の構造 |
JP2003133495A (ja) * | 2001-10-25 | 2003-05-09 | Toshiba Components Co Ltd | コネクター型半導体素子 |
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JP2001237358A (ja) * | 2000-02-21 | 2001-08-31 | Rohm Co Ltd | パッケージ型二端子半導体装置の構造 |
JP2003133495A (ja) * | 2001-10-25 | 2003-05-09 | Toshiba Components Co Ltd | コネクター型半導体素子 |
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