JP4565001B2 - 電力変換装置及びそれを備えた移動体 - Google Patents
電力変換装置及びそれを備えた移動体 Download PDFInfo
- Publication number
- JP4565001B2 JP4565001B2 JP2007335510A JP2007335510A JP4565001B2 JP 4565001 B2 JP4565001 B2 JP 4565001B2 JP 2007335510 A JP2007335510 A JP 2007335510A JP 2007335510 A JP2007335510 A JP 2007335510A JP 4565001 B2 JP4565001 B2 JP 4565001B2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor switch
- terminal
- circuit
- phase
- power module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Electric Propulsion And Braking For Vehicles (AREA)
- Inverter Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007335510A JP4565001B2 (ja) | 2007-12-27 | 2007-12-27 | 電力変換装置及びそれを備えた移動体 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007335510A JP4565001B2 (ja) | 2007-12-27 | 2007-12-27 | 電力変換装置及びそれを備えた移動体 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007153468A Division JP4564989B2 (ja) | 2007-06-11 | 2007-06-11 | 電力変換装置及びそれを備えた移動体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008099553A JP2008099553A (ja) | 2008-04-24 |
| JP2008099553A5 JP2008099553A5 (https=) | 2009-03-12 |
| JP4565001B2 true JP4565001B2 (ja) | 2010-10-20 |
Family
ID=39381778
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007335510A Expired - Fee Related JP4565001B2 (ja) | 2007-12-27 | 2007-12-27 | 電力変換装置及びそれを備えた移動体 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4565001B2 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5686677B2 (ja) * | 2011-06-13 | 2015-03-18 | 住友重機械工業株式会社 | 電力変換装置 |
| JP2019126190A (ja) * | 2018-01-17 | 2019-07-25 | 株式会社豊田自動織機 | インバータ |
| WO2018193995A1 (ja) * | 2017-04-20 | 2018-10-25 | 株式会社豊田自動織機 | モータユニット、コンデンサ実装構造、インバータの封止構造、インバータの組立方法、及びインバータ |
| CN109923667B (zh) * | 2017-10-10 | 2022-11-25 | 新电元工业株式会社 | 半导体装置、以及电力转换装置 |
| JP2020013895A (ja) * | 2018-07-18 | 2020-01-23 | 株式会社オートネットワーク技術研究所 | 回路基板 |
| JP6901639B1 (ja) * | 2019-11-22 | 2021-07-14 | 東芝三菱電機産業システム株式会社 | 電力変換ユニット |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3220366B2 (ja) * | 1995-10-09 | 2001-10-22 | 株式会社日立製作所 | 半導体装置 |
| JPH09215344A (ja) * | 1996-02-09 | 1997-08-15 | Denso Corp | 電力制御装置 |
| WO1998010508A1 (en) * | 1996-09-06 | 1998-03-12 | Hitachi, Ltd. | Semiconductor device |
| JP4051825B2 (ja) * | 1999-06-24 | 2008-02-27 | 日産自動車株式会社 | パワーモジュール及びモータモジュール |
-
2007
- 2007-12-27 JP JP2007335510A patent/JP4565001B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008099553A (ja) | 2008-04-24 |
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| LAPS | Cancellation because of no payment of annual fees |