JP4558627B2 - 電子機器の筐体および電子機器 - Google Patents

電子機器の筐体および電子機器 Download PDF

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Publication number
JP4558627B2
JP4558627B2 JP2005315502A JP2005315502A JP4558627B2 JP 4558627 B2 JP4558627 B2 JP 4558627B2 JP 2005315502 A JP2005315502 A JP 2005315502A JP 2005315502 A JP2005315502 A JP 2005315502A JP 4558627 B2 JP4558627 B2 JP 4558627B2
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Japan
Prior art keywords
heat
electronic device
air
exhaust port
housing
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Expired - Lifetime
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JP2005315502A
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English (en)
Japanese (ja)
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JP2007123641A5 (enExample
JP2007123641A (ja
Inventor
健二 杉田
賢治 岩野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schneider Electric Japan Holdings Ltd
Original Assignee
Digital Electronics Corp
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Application filed by Digital Electronics Corp filed Critical Digital Electronics Corp
Priority to JP2005315502A priority Critical patent/JP4558627B2/ja
Publication of JP2007123641A publication Critical patent/JP2007123641A/ja
Publication of JP2007123641A5 publication Critical patent/JP2007123641A5/ja
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Publication of JP4558627B2 publication Critical patent/JP4558627B2/ja
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Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2005315502A 2005-10-28 2005-10-28 電子機器の筐体および電子機器 Expired - Lifetime JP4558627B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005315502A JP4558627B2 (ja) 2005-10-28 2005-10-28 電子機器の筐体および電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005315502A JP4558627B2 (ja) 2005-10-28 2005-10-28 電子機器の筐体および電子機器

Publications (3)

Publication Number Publication Date
JP2007123641A JP2007123641A (ja) 2007-05-17
JP2007123641A5 JP2007123641A5 (enExample) 2008-11-27
JP4558627B2 true JP4558627B2 (ja) 2010-10-06

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ID=38147136

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JP2005315502A Expired - Lifetime JP4558627B2 (ja) 2005-10-28 2005-10-28 電子機器の筐体および電子機器

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JP (1) JP4558627B2 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2521785C2 (ru) * 2008-07-25 2014-07-10 Конинклейке Филипс Электроникс Н.В. Охлаждающее устройство для охлаждения полупроводникового кристалла
JP5262473B2 (ja) * 2008-09-09 2013-08-14 富士通株式会社 電子機器及びそのコンポーネント
JP2010177309A (ja) 2009-01-28 2010-08-12 Funai Electric Co Ltd 電子機器の放熱機構
JP2013197405A (ja) 2012-03-21 2013-09-30 Hitachi Automotive Systems Ltd 電子制御装置
JP6012420B2 (ja) * 2012-11-14 2016-10-25 矢崎総業株式会社 電気接続箱
JP7349837B2 (ja) 2019-07-16 2023-09-25 株式会社デンソーテン 発熱部品の放熱構造
CN113766797A (zh) * 2020-06-02 2021-12-07 鸿富锦精密电子（重庆）有限公司 背板以及电子装置
WO2023203800A1 (ja) * 2022-11-11 2023-10-26 任天堂株式会社 電子機器及び電子機器の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60103845U (ja) * 1983-12-19 1985-07-15 三菱電機株式会社 半導体の冷却装置
JPS6210496U (enExample) * 1985-07-03 1987-01-22
JP2002009473A (ja) * 2000-06-23 2002-01-11 Showa Denko Kk 放熱器
JP2003174276A (ja) * 2001-12-07 2003-06-20 Matsushita Electric Ind Co Ltd 小型の電子機器
JP2004111655A (ja) * 2002-09-18 2004-04-08 Ryoichi Yasumi 電子部品の冷却装置用ケース、およびこの冷却装置用ケースを用いた冷却装置
JP2004119812A (ja) * 2002-09-27 2004-04-15 Matsushita Electric Ind Co Ltd 小型端末装置

Also Published As

Publication number Publication date
JP2007123641A (ja) 2007-05-17

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