JP4547569B2 - 表面実装型ｌｅｄ - Google Patents

表面実装型ｌｅｄ Download PDF

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Publication number
JP4547569B2
JP4547569B2 JP2004251240A JP2004251240A JP4547569B2 JP 4547569 B2 JP4547569 B2 JP 4547569B2 JP 2004251240 A JP2004251240 A JP 2004251240A JP 2004251240 A JP2004251240 A JP 2004251240A JP 4547569 B2 JP4547569 B2 JP 4547569B2
Authority
JP
Japan
Prior art keywords
led
led chip
light
substrate
silicon substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004251240A
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English (en)
Japanese (ja)
Other versions
JP2006073547A5 (https=
JP2006073547A (ja
Inventor
巌 東海林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP2004251240A priority Critical patent/JP4547569B2/ja
Priority to CNB2005100935363A priority patent/CN100521264C/zh
Priority to US11/214,805 priority patent/US20060049422A1/en
Publication of JP2006073547A publication Critical patent/JP2006073547A/ja
Publication of JP2006073547A5 publication Critical patent/JP2006073547A5/ja
Application granted granted Critical
Publication of JP4547569B2 publication Critical patent/JP4547569B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
JP2004251240A 2004-08-31 2004-08-31 表面実装型ｌｅｄ Expired - Fee Related JP4547569B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2004251240A JP4547569B2 (ja) 2004-08-31 2004-08-31 表面実装型ｌｅｄ
CNB2005100935363A CN100521264C (zh) 2004-08-31 2005-08-26 表面安装型led
US11/214,805 US20060049422A1 (en) 2004-08-31 2005-08-31 Surface mount LED

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004251240A JP4547569B2 (ja) 2004-08-31 2004-08-31 表面実装型ｌｅｄ

Publications (3)

Publication Number Publication Date
JP2006073547A JP2006073547A (ja) 2006-03-16
JP2006073547A5 JP2006073547A5 (https=) 2007-09-20
JP4547569B2 true JP4547569B2 (ja) 2010-09-22

Family

ID=35995312

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004251240A Expired - Fee Related JP4547569B2 (ja) 2004-08-31 2004-08-31 表面実装型ｌｅｄ

Country Status (3)

Country Link
US (1) US20060049422A1 (https=)
JP (1) JP4547569B2 (https=)
CN (1) CN100521264C (https=)

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US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
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US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
CN101079461B (zh) * 2006-05-23 2010-05-12 台达电子工业股份有限公司 发光装置
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
KR100680654B1 (ko) * 2006-08-07 2007-02-08 해성쏠라(주) 발광소자가 일체형으로 구비된 태양전지모듈
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
USD566056S1 (en) * 2006-12-20 2008-04-08 Cree, Inc. LED chip
USD566057S1 (en) * 2006-12-21 2008-04-08 Cree, Inc. LED chip
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US7843060B2 (en) * 2007-06-11 2010-11-30 Cree, Inc. Droop-free high output light emitting devices and methods of fabricating and operating same
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US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
TW200926440A (en) 2007-12-12 2009-06-16 Advanced Optoelectronic Tech Light emitting diode and manufacturing method thereof
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
CN101465397B (zh) * 2007-12-20 2013-07-03 展晶科技(深圳)有限公司 发光二极管及其制造方法
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
TWD133319S (zh) * 2008-06-20 2010-02-11 三星電機股份有限公司 發光二極體
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
USD635525S1 (en) 2009-04-22 2011-04-05 Cree, Inc. LED chip
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
JP2011165833A (ja) * 2010-02-08 2011-08-25 Toshiba Corp Ｌｅｄモジュール
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
TWI422073B (zh) * 2010-05-26 2014-01-01 英特明光能股份有限公司 發光二極體封裝結構
CN101880899B (zh) * 2010-07-12 2012-09-26 中山市琪朗灯饰厂有限公司 一种灯饰配件及制造灯饰配件的电铸沉积方法
WO2012014853A1 (ja) * 2010-07-26 2012-02-02 旭硝子株式会社 発光素子用基板、発光装置及び発光素子用基板の製造方法
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
US20120188738A1 (en) * 2011-01-25 2012-07-26 Conexant Systems, Inc. Integrated led in system-in-package module
CN102646783A (zh) * 2011-02-22 2012-08-22 盈胜科技股份有限公司 可防止湿气侵入的包设有荧光层的光学透镜组
USD691569S1 (en) 2011-03-25 2013-10-15 Cree, Inc. LED chip
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WO2013111542A1 (ja) 2012-01-23 2013-08-01 パナソニック株式会社 窒化物半導体発光装置
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
USD761213S1 (en) * 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode module
USD761214S1 (en) * 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode package
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TWD186014S (zh) 2016-09-29 2017-10-11 新世紀光電股份有限公司 發光二極體模組之部分

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Also Published As

Publication number Publication date
US20060049422A1 (en) 2006-03-09
JP2006073547A (ja) 2006-03-16
CN100521264C (zh) 2009-07-29
CN1744335A (zh) 2006-03-08

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