CN100521264C - 表面安装型led - Google Patents

表面安装型led Download PDF

Info

Publication number
CN100521264C
CN100521264C CNB2005100935363A CN200510093536A CN100521264C CN 100521264 C CN100521264 C CN 100521264C CN B2005100935363 A CNB2005100935363 A CN B2005100935363A CN 200510093536 A CN200510093536 A CN 200510093536A CN 100521264 C CN100521264 C CN 100521264C
Authority
CN
China
Prior art keywords
led
silicon substrate
led chip
mentioned
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100935363A
Other languages
English (en)
Chinese (zh)
Other versions
CN1744335A (zh
Inventor
东海林巌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Publication of CN1744335A publication Critical patent/CN1744335A/zh
Application granted granted Critical
Publication of CN100521264C publication Critical patent/CN100521264C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Led Device Packages (AREA)
CNB2005100935363A 2004-08-31 2005-08-26 表面安装型led Expired - Fee Related CN100521264C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004251240 2004-08-31
JP2004251240A JP4547569B2 (ja) 2004-08-31 2004-08-31 表面実装型ｌｅｄ

Publications (2)

Publication Number Publication Date
CN1744335A CN1744335A (zh) 2006-03-08
CN100521264C true CN100521264C (zh) 2009-07-29

Family

ID=35995312

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100935363A Expired - Fee Related CN100521264C (zh) 2004-08-31 2005-08-26 表面安装型led

Country Status (3)

Country Link
US (1) US20060049422A1 (https=)
JP (1) JP4547569B2 (https=)
CN (1) CN100521264C (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101880899A (zh) * 2010-07-12 2010-11-10 中山市琪朗灯饰厂有限公司 一种灯饰配件及制造灯饰配件的电铸沉积方法

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9793247B2 (en) 2005-01-10 2017-10-17 Cree, Inc. Solid state lighting component
US7821023B2 (en) 2005-01-10 2010-10-26 Cree, Inc. Solid state lighting component
US9070850B2 (en) 2007-10-31 2015-06-30 Cree, Inc. Light emitting diode package and method for fabricating same
US8669572B2 (en) 2005-06-10 2014-03-11 Cree, Inc. Power lamp package
USD584246S1 (en) * 2006-03-10 2009-01-06 Tek Beng Low High power light emitting diode
US7675145B2 (en) 2006-03-28 2010-03-09 Cree Hong Kong Limited Apparatus, system and method for use in mounting electronic elements
JP2007281062A (ja) * 2006-04-04 2007-10-25 Hitachi Ltd 電子部品接合体、それを用いた電子回路モジュールおよびその製造方法
JP4981342B2 (ja) 2006-04-04 2012-07-18 日立協和エンジニアリング株式会社 サブマウントおよびその製造方法
US11210971B2 (en) 2009-07-06 2021-12-28 Cree Huizhou Solid State Lighting Company Limited Light emitting diode display with tilted peak emission pattern
US8748915B2 (en) 2006-04-24 2014-06-10 Cree Hong Kong Limited Emitter package with angled or vertical LED
US7635915B2 (en) * 2006-04-26 2009-12-22 Cree Hong Kong Limited Apparatus and method for use in mounting electronic elements
CN101079461B (zh) * 2006-05-23 2010-05-12 台达电子工业股份有限公司 发光装置
US8735920B2 (en) 2006-07-31 2014-05-27 Cree, Inc. Light emitting diode package with optical element
KR100680654B1 (ko) * 2006-08-07 2007-02-08 해성쏠라(주) 발광소자가 일체형으로 구비된 태양전지모듈
US8367945B2 (en) 2006-08-16 2013-02-05 Cree Huizhou Opto Limited Apparatus, system and method for use in mounting electronic elements
USD566056S1 (en) * 2006-12-20 2008-04-08 Cree, Inc. LED chip
USD566057S1 (en) * 2006-12-21 2008-04-08 Cree, Inc. LED chip
USD566665S1 (en) * 2007-04-18 2008-04-15 Edison Opto Corporation Matrix type light emitting diode assembly
USD575245S1 (en) * 2007-04-24 2008-08-19 Edison Opto Corporation Matrix type light emitting diode assembly
USD582865S1 (en) 2007-06-11 2008-12-16 Cree, Inc. LED chip
US7843060B2 (en) * 2007-06-11 2010-11-30 Cree, Inc. Droop-free high output light emitting devices and methods of fabricating and operating same
USD582866S1 (en) 2007-09-07 2008-12-16 Cree, Inc. LED chip
USD583338S1 (en) 2007-09-07 2008-12-23 Cree, Inc. LED chip
US8866169B2 (en) 2007-10-31 2014-10-21 Cree, Inc. LED package with increased feature sizes
US10256385B2 (en) 2007-10-31 2019-04-09 Cree, Inc. Light emitting die (LED) packages and related methods
USD615504S1 (en) 2007-10-31 2010-05-11 Cree, Inc. Emitter package
TW200926440A (en) 2007-12-12 2009-06-16 Advanced Optoelectronic Tech Light emitting diode and manufacturing method thereof
USD633631S1 (en) 2007-12-14 2011-03-01 Cree Hong Kong Limited Light source of light emitting diode
CN101465397B (zh) * 2007-12-20 2013-07-03 展晶科技(深圳)有限公司 发光二极管及其制造方法
USD634863S1 (en) 2008-01-10 2011-03-22 Cree Hong Kong Limited Light source of light emitting diode
US8049230B2 (en) 2008-05-16 2011-11-01 Cree Huizhou Opto Limited Apparatus and system for miniature surface mount devices
TWD133319S (zh) * 2008-06-20 2010-02-11 三星電機股份有限公司 發光二極體
US8791471B2 (en) 2008-11-07 2014-07-29 Cree Hong Kong Limited Multi-chip light emitting diode modules
US8368112B2 (en) 2009-01-14 2013-02-05 Cree Huizhou Opto Limited Aligned multiple emitter package
USD635525S1 (en) 2009-04-22 2011-04-05 Cree, Inc. LED chip
US8415692B2 (en) 2009-07-06 2013-04-09 Cree, Inc. LED packages with scattering particle regions
US8598809B2 (en) 2009-08-19 2013-12-03 Cree, Inc. White light color changing solid state lighting and methods
JP2011165833A (ja) * 2010-02-08 2011-08-25 Toshiba Corp Ｌｅｄモジュール
US9012938B2 (en) 2010-04-09 2015-04-21 Cree, Inc. High reflective substrate of light emitting devices with improved light output
TWI422073B (zh) * 2010-05-26 2014-01-01 英特明光能股份有限公司 發光二極體封裝結構
WO2012014853A1 (ja) * 2010-07-26 2012-02-02 旭硝子株式会社 発光素子用基板、発光装置及び発光素子用基板の製造方法
US8455882B2 (en) 2010-10-15 2013-06-04 Cree, Inc. High efficiency LEDs
US20120188738A1 (en) * 2011-01-25 2012-07-26 Conexant Systems, Inc. Integrated led in system-in-package module
CN102646783A (zh) * 2011-02-22 2012-08-22 盈胜科技股份有限公司 可防止湿气侵入的包设有荧光层的光学透镜组
USD691569S1 (en) 2011-03-25 2013-10-15 Cree, Inc. LED chip
US8564004B2 (en) 2011-11-29 2013-10-22 Cree, Inc. Complex primary optics with intermediate elements
WO2013111542A1 (ja) 2012-01-23 2013-08-01 パナソニック株式会社 窒化物半導体発光装置
US9601670B2 (en) 2014-07-11 2017-03-21 Cree, Inc. Method to form primary optic with variable shapes and/or geometries without a substrate
US10622522B2 (en) 2014-09-05 2020-04-14 Theodore Lowes LED packages with chips having insulated surfaces
USD761213S1 (en) * 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode module
USD761214S1 (en) * 2015-04-02 2016-07-12 Genesis Photonics Inc. Light emitting diode package
KR102554231B1 (ko) * 2016-06-16 2023-07-12 서울바이오시스 주식회사 전극 구조를 갖는 수직형 발광 다이오드 및 그것을 갖는 발광 다이오드 패키지
TWD188042S (zh) 2016-09-29 2018-01-21 新世紀光電股份有限公司 發光二極體封裝體之部分
TWD186014S (zh) 2016-09-29 2017-10-11 新世紀光電股份有限公司 發光二極體模組之部分

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH054529U (ja) * 1991-06-27 1993-01-22 ローム株式会社 チツプ型発光ダイオードの構造
DE19508222C1 (de) * 1995-03-08 1996-06-05 Siemens Ag Optoelektronischer Wandler und Herstellverfahren
DE19638667C2 (de) * 1996-09-20 2001-05-17 Osram Opto Semiconductors Gmbh Mischfarbiges Licht abstrahlendes Halbleiterbauelement mit Lumineszenzkonversionselement
DE59713024D1 (de) * 1996-06-26 2010-01-28 Osram Opto Semiconductors Gmbh Lichtabstrahlender Halbleiterchip und Lichtabstrahlendes Halbleiterbauelement und Verfahren zu dessen Herstellung
US6613247B1 (en) * 1996-09-20 2003-09-02 Osram Opto Semiconductors Gmbh Wavelength-converting casting composition and white light-emitting semiconductor component
CN1190997C (zh) * 1999-07-23 2005-02-23 电灯专利信托有限公司 光源的发光物质及其相关的光源
US6351027B1 (en) * 2000-02-29 2002-02-26 Agilent Technologies, Inc. Chip-mounted enclosure
US20020123163A1 (en) * 2000-04-24 2002-09-05 Takehiro Fujii Edge-emitting light-emitting semiconductor device and method of manufacture thereof
DE10033502A1 (de) * 2000-07-10 2002-01-31 Osram Opto Semiconductors Gmbh Optoelektronisches Modul, Verfahren zu dessen Herstellung und dessen Verwendung
JP4101468B2 (ja) * 2001-04-09 2008-06-18 豊田合成株式会社 発光装置の製造方法
JP2002314143A (ja) * 2001-04-09 2002-10-25 Toshiba Corp 発光装置
DE10118630A1 (de) * 2001-04-12 2002-10-17 Patent Treuhand Ges Fuer Elektrische Gluehlampen Mbh Verfahren zur Herstellung eines optoelektronischen Halbleiter-Bauelements
JP4789350B2 (ja) * 2001-06-11 2011-10-12 シチズン電子株式会社 発光ダイオードの製造方法
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
JP2004047748A (ja) * 2002-07-12 2004-02-12 Stanley Electric Co Ltd 発光ダイオード
JP3910517B2 (ja) * 2002-10-07 2007-04-25 シャープ株式会社 Ｌｅｄデバイス

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101880899A (zh) * 2010-07-12 2010-11-10 中山市琪朗灯饰厂有限公司 一种灯饰配件及制造灯饰配件的电铸沉积方法

Also Published As

Publication number Publication date
JP4547569B2 (ja) 2010-09-22
US20060049422A1 (en) 2006-03-09
JP2006073547A (ja) 2006-03-16
CN1744335A (zh) 2006-03-08

Similar Documents

Publication Publication Date Title
CN100521264C (zh) 表面安装型led
JP5013905B2 (ja) 半導体発光装置
TWI446568B (zh) 半導體發光裝置
KR101813495B1 (ko) 발광소자 패키지
KR20080027195A (ko) 광 반도체 장치 및 광 반도체 장치의 제조 방법
CN102479910A (zh) Led模块
JP2012114284A (ja) Ｌｅｄモジュール及び照明装置
JP4452464B2 (ja) 発光ダイオード
KR100851183B1 (ko) 반도체 발광소자 패키지
JP5391468B2 (ja) Ｌｅｄパッケージ
JP4948841B2 (ja) 発光装置および照明装置
KR101766720B1 (ko) 발광소자 패키지
JP5406691B2 (ja) 半導体発光装置
CN116979009A (zh) 一种led发光装置
JP2004214478A (ja) 半導体発光装置
KR102075522B1 (ko) 발광소자패키지
KR20130014718A (ko) 발광소자 패키지
JP2007324451A (ja) 半導体発光装置
KR20120034484A (ko) 발광소자 패키지
KR101778151B1 (ko) 발광소자 패키지
KR101883344B1 (ko) 발광소자 어레이
KR101831276B1 (ko) 발광소자 패키지
KR20170052207A (ko) 광학 플레이트, 발광 소자 및 광원 모듈
KR20120109732A (ko) 발광소자 패키지 및 조명시스템
KR20120073929A (ko) 발광소자 패키지

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090729

Termination date: 20150826

EXPY Termination of patent right or utility model