JP4546066B2 - 基板の位置決め方法及びこの方法を用いた検査装置 - Google Patents

基板の位置決め方法及びこの方法を用いた検査装置 Download PDF

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Publication number
JP4546066B2
JP4546066B2 JP2003386369A JP2003386369A JP4546066B2 JP 4546066 B2 JP4546066 B2 JP 4546066B2 JP 2003386369 A JP2003386369 A JP 2003386369A JP 2003386369 A JP2003386369 A JP 2003386369A JP 4546066 B2 JP4546066 B2 JP 4546066B2
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substrate
pressure
suction
mounting table
receiving pin
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Expired - Fee Related
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JP2003386369A
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Japanese (ja)
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JP2004186681A5 (enExample
JP2004186681A (ja
Inventor
正吾 小菅
潔 伊従
美智男 久木原
重信 大塚
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Kokusai Denki Electric Inc
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Hitachi Kokusai Electric Inc
Kokusai Denki Electric Inc
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Priority to JP2003386369A priority Critical patent/JP4546066B2/ja
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Publication of JP2004186681A5 publication Critical patent/JP2004186681A5/ja
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2003386369A 2002-11-21 2003-11-17 基板の位置決め方法及びこの方法を用いた検査装置 Expired - Fee Related JP4546066B2 (ja)

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JP2003386369A JP4546066B2 (ja) 2002-11-21 2003-11-17 基板の位置決め方法及びこの方法を用いた検査装置

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JP2002337504 2002-11-21
JP2003386369A JP4546066B2 (ja) 2002-11-21 2003-11-17 基板の位置決め方法及びこの方法を用いた検査装置

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JP2004186681A JP2004186681A (ja) 2004-07-02
JP2004186681A5 JP2004186681A5 (enExample) 2006-11-16
JP4546066B2 true JP4546066B2 (ja) 2010-09-15

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Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4691375B2 (ja) * 2005-03-24 2011-06-01 株式会社日立国際電気 測定装置
CN100401014C (zh) * 2005-04-08 2008-07-09 株式会社日立国际电气 线宽测量装置
JP2007207807A (ja) * 2006-01-31 2007-08-16 Hitachi Kokusai Electric Inc 試料位置決め装置
JP2008145762A (ja) * 2006-12-11 2008-06-26 Sharp Corp 基板処理装置および基板処理方法
JP2008187156A (ja) * 2007-01-31 2008-08-14 Hitachi Kokusai Electric Inc 基板検出装置
JP2015132497A (ja) * 2014-01-10 2015-07-23 セイコーエプソン株式会社 検査装置および検査方法
US11921151B2 (en) 2019-01-24 2024-03-05 Koh Young Technology Inc. Jig for inspection apparatus, inspection apparatus, and inspection set

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2807905B2 (ja) * 1989-09-14 1998-10-08 日立電子エンジニアリング株式会社 基板チャック機構
JP2941505B2 (ja) * 1991-08-08 1999-08-25 株式会社東芝 基板位置決め方法
JPH0846017A (ja) * 1994-07-29 1996-02-16 Sony Corp 基板の位置決め装置および位置決め方法
JPH08313815A (ja) * 1995-05-23 1996-11-29 Olympus Optical Co Ltd 基板部材の位置決め保持装置
JPH09278179A (ja) * 1996-04-16 1997-10-28 Hitachi Ltd 搬送機
JPH11214486A (ja) * 1998-01-27 1999-08-06 Komatsu Ltd 基板処理装置
JP2002270678A (ja) * 2001-03-08 2002-09-20 Nikon Corp 基板処理装置、基板処理方法、基板ホルダ及び基板搬送装置

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