JP4536584B2 - 回転可能なマグネトロンの大面積アセンブリを有するコーター - Google Patents
回転可能なマグネトロンの大面積アセンブリを有するコーター Download PDFInfo
- Publication number
- JP4536584B2 JP4536584B2 JP2005135222A JP2005135222A JP4536584B2 JP 4536584 B2 JP4536584 B2 JP 4536584B2 JP 2005135222 A JP2005135222 A JP 2005135222A JP 2005135222 A JP2005135222 A JP 2005135222A JP 4536584 B2 JP4536584 B2 JP 4536584B2
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- cathode
- coating
- magnet
- assembly
- coater
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- 238000000576 coating method Methods 0.000 claims abstract description 76
- 239000011248 coating agent Substances 0.000 claims abstract description 69
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 36
- 238000000429 assembly Methods 0.000 claims description 9
- 230000000712 assembly Effects 0.000 claims description 9
- 238000004544 sputter deposition Methods 0.000 claims description 3
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000005328 architectural glass Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62M—RIDER PROPULSION OF WHEELED VEHICLES OR SLEDGES; POWERED PROPULSION OF SLEDGES OR SINGLE-TRACK CYCLES; TRANSMISSIONS SPECIALLY ADAPTED FOR SUCH VEHICLES
- B62M1/00—Rider propulsion of wheeled vehicles
- B62M1/24—Rider propulsion of wheeled vehicles with reciprocating levers, e.g. foot levers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62K—CYCLES; CYCLE FRAMES; CYCLE STEERING DEVICES; RIDER-OPERATED TERMINAL CONTROLS SPECIALLY ADAPTED FOR CYCLES; CYCLE AXLE SUSPENSIONS; CYCLE SIDE-CARS, FORECARS, OR THE LIKE
- B62K3/00—Bicycles
- B62K3/002—Bicycles without a seat, i.e. the rider operating the vehicle in a standing position, e.g. non-motorized scooters; non-motorized scooters with skis or runners
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3325—Problems associated with coating large area
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Transportation (AREA)
- Combustion & Propulsion (AREA)
- Physical Vapour Deposition (AREA)
Description
Claims (7)
- 大面積の基板を陰極スパッタによってコーティングするためのコーターであって、コーティングチャンバと前記コーティングチャンバ内に配置された陰極アセンブリ(2)とを有し、前記陰極アセンブリ(2)では、スパッタされる材料が、コーティングプロセス中に回転する、円筒面を有するターゲット(4)上に配置され、前記ターゲット(4)の内部には、磁石(3)または磁石アセンブリが配置され、回転可能な円筒のターゲット(4)を持つ少なくとも3つの陰極アセンブリ(2)が、整合的なコーティング領域のための単一のコーティングチャンバ内に並んで位置決めされているコーターにおいて、
前記少なくとも3つの陰極アセンブリが、前記コーティング領域内に位置決めされるべき前記基板から異なる距離に配置されており、且つ、前記コーティング領域の周りに湾曲する表面に沿って配置されており、
前記基板を均一なコーティング厚さを得るように静止状態でコーティングすることを可能にすることを特徴とする、コーター。 - 前記回転可能な円筒のターゲット(4)を持つ前記陰極アセンブリ(2)が、一方の終端で端面領域において支持されることを特徴とする、請求項1に記載のコーター。
- 前記回転可能な円筒のターゲット(4)を持つ陰極アセンブリ(2)が、陰極の長手軸を中心として回転可能または旋回可能である前記磁石(3)または前記磁石アセンブリを有することを特徴とする、請求項1又は2に記載のコーター。
- 前記磁石アセンブリの端部領域にある前記磁石(3)が、磁界領域(6)を拡張するために、旋回または変位可能であることを特徴とする、請求項1又は2に記載のコーター。
- 前記陰極アセンブリが4つ以上であり、該4つ以上の陰極アセンブリが、互いに間隔を空け、それらの長手軸が互いに平行であるように位置決めされ、前記陰極アセンブリが、等距離にあるように位置決めされ、外側陰極アセンブリだけがそれらの隣接する陰極へより接近して間隔を空けていることを特徴とする、請求項1〜4のいずれか1項に記載のコーター。
- 前記陰極アセンブリが、前記陰極アセンブリの長手軸に対して直角の断面から見て、円形の経路上に配置され、該円形の経路の円の中心が前記コーティング領域内またはその背後にあり、
2つの外側陰極アセンブリだけが前記横方向表面から前記コーティング領域に向けて変位されることを特徴とする、請求項1〜4のいずれか1項に記載のコーター。 - 前記陰極アセンブリの前記磁石または磁石アセンブリは、半径方向に前記コーティング領域に向けて配向され、前記磁石または磁石アセンブリは、この位置を中心として、規定の速度で旋回可能であることを特徴とする、請求項3〜6のいずれか1項に記載のコーター。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04010696A EP1594153B1 (de) | 2004-05-05 | 2004-05-05 | Beschichtungsvorrichtung mit grossflächiger Anordnung von drehbaren Magnetronkathoden |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010087024A Division JP4729122B2 (ja) | 2004-05-05 | 2010-04-05 | 回転可能なマグネトロンの大面積アセンブリを有するコーター |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005350768A JP2005350768A (ja) | 2005-12-22 |
JP4536584B2 true JP4536584B2 (ja) | 2010-09-01 |
Family
ID=34924873
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005135222A Active JP4536584B2 (ja) | 2004-05-05 | 2005-05-06 | 回転可能なマグネトロンの大面積アセンブリを有するコーター |
JP2010087024A Active JP4729122B2 (ja) | 2004-05-05 | 2010-04-05 | 回転可能なマグネトロンの大面積アセンブリを有するコーター |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010087024A Active JP4729122B2 (ja) | 2004-05-05 | 2010-04-05 | 回転可能なマグネトロンの大面積アセンブリを有するコーター |
Country Status (8)
Country | Link |
---|---|
US (1) | US8137510B2 (ja) |
EP (1) | EP1594153B1 (ja) |
JP (2) | JP4536584B2 (ja) |
KR (1) | KR100692584B1 (ja) |
CN (1) | CN100513633C (ja) |
AT (1) | ATE459092T1 (ja) |
DE (1) | DE502004010804D1 (ja) |
TW (1) | TWI287815B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130100325A (ko) * | 2010-09-30 | 2013-09-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 스퍼터링된 재료의 층을 형성하기 위한 시스템들 및 방법들 |
Families Citing this family (24)
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KR101275924B1 (ko) | 2006-05-22 | 2013-06-14 | 엘지디스플레이 주식회사 | 스퍼터링 장치, 그 구동 방법 및 이를 이용한 패널 제조방법 |
US20080127887A1 (en) * | 2006-12-01 | 2008-06-05 | Applied Materials, Inc. | Vertically mounted rotary cathodes in sputtering system on elevated rails |
US20090178919A1 (en) * | 2008-01-16 | 2009-07-16 | Applied Materials, Inc. | Sputter coating device |
EP2081212B1 (en) | 2008-01-16 | 2016-03-23 | Applied Materials, Inc. | Double-Coating Device with one Process Chamber |
US9175383B2 (en) | 2008-01-16 | 2015-11-03 | Applied Materials, Inc. | Double-coating device with one process chamber |
EP2091067A1 (en) | 2008-02-14 | 2009-08-19 | Applied Materials, Inc. | Apparatus for treating a substrate |
US8083911B2 (en) | 2008-02-14 | 2011-12-27 | Applied Materials, Inc. | Apparatus for treating a substrate |
CN101805889B (zh) * | 2009-02-13 | 2012-01-11 | 北京京东方光电科技有限公司 | 磁靶及具有该磁靶的磁控溅射设备 |
CN101877300B (zh) * | 2009-04-30 | 2012-01-04 | 深圳市豪威薄膜技术有限公司 | 溅射磁控管装置 |
EP2306489A1 (en) * | 2009-10-02 | 2011-04-06 | Applied Materials, Inc. | Method for coating a substrate and coater |
US20130032476A1 (en) * | 2011-08-04 | 2013-02-07 | Sputtering Components, Inc. | Rotary cathodes for magnetron sputtering system |
US20150214018A1 (en) * | 2012-05-29 | 2015-07-30 | Applied Materials, Inc. | Method for coating a substrate and coater |
WO2015072046A1 (ja) * | 2013-11-14 | 2015-05-21 | 株式会社Joled | スパッタリング装置 |
CN106165058B (zh) * | 2014-04-17 | 2019-01-18 | 应用材料公司 | Pvd阵列涂覆器中的边缘均匀性改善 |
BE1021296B1 (nl) * | 2014-04-18 | 2015-10-23 | Soleras Advanced Coatings Bvba | Sputter systeem voor uniform sputteren |
CN106878547A (zh) * | 2017-01-06 | 2017-06-20 | 宇龙计算机通信科技(深圳)有限公司 | 屏幕切换方法和屏幕切换装置 |
CN108570648A (zh) * | 2017-03-08 | 2018-09-25 | 中国南玻集团股份有限公司 | 可调平面阴极机构及真空镀膜装置 |
DE102018115516A1 (de) * | 2017-06-28 | 2019-01-03 | Solayer Gmbh | Sputtervorrichtung und Sputterverfahren zur Beschichtung von dreidimensional geformten Substratoberflächen |
JP7171270B2 (ja) * | 2018-07-02 | 2022-11-15 | キヤノン株式会社 | 成膜装置およびそれを用いた成膜方法 |
CN109750267B (zh) * | 2019-03-26 | 2021-10-26 | 合肥京东方显示技术有限公司 | 一种磁控溅射装置 |
CN114207181A (zh) * | 2019-08-09 | 2022-03-18 | 应用材料公司 | 涂覆基板的方法和涂覆基板的涂覆设备 |
US20230097276A1 (en) * | 2020-03-13 | 2023-03-30 | Evatec Ag | Apparatus and process with a dc-pulsed cathode array |
WO2022009484A1 (ja) * | 2020-07-08 | 2022-01-13 | 株式会社アルバック | 成膜方法 |
CN116324014A (zh) * | 2020-10-14 | 2023-06-23 | 应用材料公司 | 溅射沉积源、沉积设备和涂覆基板的方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03104864A (ja) * | 1989-09-18 | 1991-05-01 | Hitachi Ltd | スパッタリングカソード |
JPH06158312A (ja) * | 1992-09-29 | 1994-06-07 | Boc Group Inc:The | 酸化金属皮膜の蒸着装置及び蒸着方法 |
JP2000239839A (ja) * | 1999-02-19 | 2000-09-05 | Tadahiro Omi | スパッタリング装置 |
JP3281371B2 (ja) * | 1989-11-08 | 2002-05-13 | ザ ビーオーシー グループ インコーポレイテッド | 広面コーティング用の円筒状回転マグネトロン |
JP2003183823A (ja) * | 2001-12-17 | 2003-07-03 | Sharp Corp | スパッタ装置 |
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-
2004
- 2004-05-05 DE DE502004010804T patent/DE502004010804D1/de not_active Expired - Lifetime
- 2004-05-05 EP EP04010696A patent/EP1594153B1/de not_active Expired - Lifetime
- 2004-05-05 AT AT04010696T patent/ATE459092T1/de not_active IP Right Cessation
-
2005
- 2005-04-27 TW TW094113439A patent/TWI287815B/zh active
- 2005-04-30 CN CNB200510069952XA patent/CN100513633C/zh active Active
- 2005-05-03 KR KR1020050036992A patent/KR100692584B1/ko active IP Right Grant
- 2005-05-04 US US11/121,563 patent/US8137510B2/en active Active
- 2005-05-06 JP JP2005135222A patent/JP4536584B2/ja active Active
-
2010
- 2010-04-05 JP JP2010087024A patent/JP4729122B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03104864A (ja) * | 1989-09-18 | 1991-05-01 | Hitachi Ltd | スパッタリングカソード |
JP3281371B2 (ja) * | 1989-11-08 | 2002-05-13 | ザ ビーオーシー グループ インコーポレイテッド | 広面コーティング用の円筒状回転マグネトロン |
JPH06158312A (ja) * | 1992-09-29 | 1994-06-07 | Boc Group Inc:The | 酸化金属皮膜の蒸着装置及び蒸着方法 |
JP2000239839A (ja) * | 1999-02-19 | 2000-09-05 | Tadahiro Omi | スパッタリング装置 |
JP2003183823A (ja) * | 2001-12-17 | 2003-07-03 | Sharp Corp | スパッタ装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20130100325A (ko) * | 2010-09-30 | 2013-09-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 스퍼터링된 재료의 층을 형성하기 위한 시스템들 및 방법들 |
Also Published As
Publication number | Publication date |
---|---|
JP2010209470A (ja) | 2010-09-24 |
TWI287815B (en) | 2007-10-01 |
CN1693532A (zh) | 2005-11-09 |
KR20060045884A (ko) | 2006-05-17 |
JP2005350768A (ja) | 2005-12-22 |
EP1594153B1 (de) | 2010-02-24 |
KR100692584B1 (ko) | 2007-03-13 |
JP4729122B2 (ja) | 2011-07-20 |
US8137510B2 (en) | 2012-03-20 |
DE502004010804D1 (de) | 2010-04-08 |
CN100513633C (zh) | 2009-07-15 |
TW200603193A (en) | 2006-01-16 |
ATE459092T1 (de) | 2010-03-15 |
EP1594153A1 (de) | 2005-11-09 |
US20050252768A1 (en) | 2005-11-17 |
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