JP4729122B2 - 回転可能なマグネトロンの大面積アセンブリを有するコーター - Google Patents
回転可能なマグネトロンの大面積アセンブリを有するコーター Download PDFInfo
- Publication number
- JP4729122B2 JP4729122B2 JP2010087024A JP2010087024A JP4729122B2 JP 4729122 B2 JP4729122 B2 JP 4729122B2 JP 2010087024 A JP2010087024 A JP 2010087024A JP 2010087024 A JP2010087024 A JP 2010087024A JP 4729122 B2 JP4729122 B2 JP 4729122B2
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- magnet
- cathode
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- 238000000576 coating method Methods 0.000 claims abstract description 76
- 239000011248 coating agent Substances 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 36
- 238000000429 assembly Methods 0.000 claims description 10
- 230000000712 assembly Effects 0.000 claims description 10
- 238000004544 sputter deposition Methods 0.000 claims description 3
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical group N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 claims 1
- 238000000151 deposition Methods 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000008092 positive effect Effects 0.000 description 2
- 239000005328 architectural glass Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62M—RIDER PROPULSION OF WHEELED VEHICLES OR SLEDGES; POWERED PROPULSION OF SLEDGES OR SINGLE-TRACK CYCLES; TRANSMISSIONS SPECIALLY ADAPTED FOR SUCH VEHICLES
- B62M1/00—Rider propulsion of wheeled vehicles
- B62M1/24—Rider propulsion of wheeled vehicles with reciprocating levers, e.g. foot levers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3455—Movable magnets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62K—CYCLES; CYCLE FRAMES; CYCLE STEERING DEVICES; RIDER-OPERATED TERMINAL CONTROLS SPECIALLY ADAPTED FOR CYCLES; CYCLE AXLE SUSPENSIONS; CYCLE SIDE-CARS, FORECARS, OR THE LIKE
- B62K3/00—Bicycles
- B62K3/002—Bicycles without a seat, i.e. the rider operating the vehicle in a standing position, e.g. non-motorized scooters; non-motorized scooters with skis or runners
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3322—Problems associated with coating
- H01J2237/3325—Problems associated with coating large area
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Physical Vapour Deposition (AREA)
Description
Claims (10)
- 大面積の基板を陰極スパッタによってコーティングするためのコーターであって、コーティングチャンバと、前記コーティングチャンバ内に配置された陰極アセンブリ(2)と、
を有しており、前記陰極アセンブリ(2)では、スパッタされる材料が、円筒面を有するターゲット(4)上に配置されており、前記ターゲット(4)の内部には、磁石(3)または磁石アセンブリが配置されており、当該コーターがコーティングプロセス中に前記磁石または磁石アセンブリの周囲において前記ターゲットを連続的に回転させるコーターにおいて、
凝集コーティング領域のための単一のコーティングチャンバ内において、回転可能な円筒のターゲット(4)を持つ4つ以上の陰極アセンブリ(2)が、並んで位置決めされており、前記陰極アセンブリは隣接する陰極アセンブリに対して等距離に配置され、前記陰極アセンブリの並びの両端にある2つの外側陰極アセンブリのみが隣接する陰極アセンブリに対してより接近していることを特徴とする、コーター。 - 前記回転可能な円筒のターゲット(4)を持つ前記陰極アセンブリ(2)が、前記円筒ターゲットの一方の終端において片持ちされることを特徴とする、請求項1に記載のコーター。
- 前記回転可能な円筒のターゲット(4)を持つ陰極アセンブリ(2)が、陰極の長手軸を中心として回転可能または旋回可能である前記磁石(3)または前記磁石アセンブリを有することを特徴とする、請求項1又は2に記載のコーター。
- 前記磁石アセンブリの磁石の並びの端にある外側磁石(3)が、磁界領域(6)を拡張するために、旋回可能または変位可能であることを特徴とする、請求項1又は2に記載のコーター。
- 前記陰極アセンブリの前記磁石または磁石アセンブリは、前記陰極アセンブリの長手軸を中心として同心円に設けられるとともに前記コーティング領域に向けられ、前記磁石または磁石アセンブリは、前記磁石の位置を中心として、規定の速度で揺動可能であることを特徴とする、請求項3又は4に記載のコーター。
- 追加の磁石または磁石アセンブリが、前記コーティング領域に面しない側面に備えられ、前記追加の磁石または磁石アセンブリが前記コーティングプロセス中にプラズマを生成することによって再堆積を防止することを特徴とする、請求項3〜5のいずれか1項に記載のコーター。
- 前記基板が、前記コーティングプロセス中に移送装置によって移動されることを特徴とする、請求項1〜6のいずれか1項に記載のコーター。
- 前記コーティング領域が平面であることを特徴とする、請求項1〜7のいずれか1項に記載のコーター。
- 前記4つ以上の陰極アセンブリが、前記コーティング領域に配置されるべき前記基板から異なる距離に位置決めされることを特徴とする、請求項1〜8のいずれか1項に記載のコーター。
- 前記4つ以上の陰極アセンブリが、前記コーティング領域の周りに湾曲する面に沿って位置決めされることを特徴とする、請求項9に記載のコーター。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04010696.5 | 2004-05-05 | ||
EP04010696A EP1594153B1 (de) | 2004-05-05 | 2004-05-05 | Beschichtungsvorrichtung mit grossflächiger Anordnung von drehbaren Magnetronkathoden |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005135222A Division JP4536584B2 (ja) | 2004-05-05 | 2005-05-06 | 回転可能なマグネトロンの大面積アセンブリを有するコーター |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010209470A JP2010209470A (ja) | 2010-09-24 |
JP4729122B2 true JP4729122B2 (ja) | 2011-07-20 |
Family
ID=34924873
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005135222A Active JP4536584B2 (ja) | 2004-05-05 | 2005-05-06 | 回転可能なマグネトロンの大面積アセンブリを有するコーター |
JP2010087024A Active JP4729122B2 (ja) | 2004-05-05 | 2010-04-05 | 回転可能なマグネトロンの大面積アセンブリを有するコーター |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005135222A Active JP4536584B2 (ja) | 2004-05-05 | 2005-05-06 | 回転可能なマグネトロンの大面積アセンブリを有するコーター |
Country Status (8)
Country | Link |
---|---|
US (1) | US8137510B2 (ja) |
EP (1) | EP1594153B1 (ja) |
JP (2) | JP4536584B2 (ja) |
KR (1) | KR100692584B1 (ja) |
CN (1) | CN100513633C (ja) |
AT (1) | ATE459092T1 (ja) |
DE (1) | DE502004010804D1 (ja) |
TW (1) | TWI287815B (ja) |
Families Citing this family (25)
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KR101275924B1 (ko) * | 2006-05-22 | 2013-06-14 | 엘지디스플레이 주식회사 | 스퍼터링 장치, 그 구동 방법 및 이를 이용한 패널 제조방법 |
US20080127887A1 (en) * | 2006-12-01 | 2008-06-05 | Applied Materials, Inc. | Vertically mounted rotary cathodes in sputtering system on elevated rails |
US9175383B2 (en) | 2008-01-16 | 2015-11-03 | Applied Materials, Inc. | Double-coating device with one process chamber |
EP2081212B1 (en) | 2008-01-16 | 2016-03-23 | Applied Materials, Inc. | Double-Coating Device with one Process Chamber |
US20090178919A1 (en) * | 2008-01-16 | 2009-07-16 | Applied Materials, Inc. | Sputter coating device |
EP2091067A1 (en) | 2008-02-14 | 2009-08-19 | Applied Materials, Inc. | Apparatus for treating a substrate |
US8083911B2 (en) | 2008-02-14 | 2011-12-27 | Applied Materials, Inc. | Apparatus for treating a substrate |
CN101805889B (zh) * | 2009-02-13 | 2012-01-11 | 北京京东方光电科技有限公司 | 磁靶及具有该磁靶的磁控溅射设备 |
CN101877300B (zh) * | 2009-04-30 | 2012-01-04 | 深圳市豪威薄膜技术有限公司 | 溅射磁控管装置 |
EP2306489A1 (en) * | 2009-10-02 | 2011-04-06 | Applied Materials, Inc. | Method for coating a substrate and coater |
EP2437280A1 (en) * | 2010-09-30 | 2012-04-04 | Applied Materials, Inc. | Systems and methods for forming a layer of sputtered material |
US20130032476A1 (en) * | 2011-08-04 | 2013-02-07 | Sputtering Components, Inc. | Rotary cathodes for magnetron sputtering system |
KR20150023472A (ko) * | 2012-05-29 | 2015-03-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판 코팅 방법 및 코팅기 |
WO2015072046A1 (ja) * | 2013-11-14 | 2015-05-21 | 株式会社Joled | スパッタリング装置 |
CN106165058B (zh) * | 2014-04-17 | 2019-01-18 | 应用材料公司 | Pvd阵列涂覆器中的边缘均匀性改善 |
BE1021296B1 (nl) * | 2014-04-18 | 2015-10-23 | Soleras Advanced Coatings Bvba | Sputter systeem voor uniform sputteren |
CN106878547A (zh) * | 2017-01-06 | 2017-06-20 | 宇龙计算机通信科技(深圳)有限公司 | 屏幕切换方法和屏幕切换装置 |
CN108570648A (zh) * | 2017-03-08 | 2018-09-25 | 中国南玻集团股份有限公司 | 可调平面阴极机构及真空镀膜装置 |
US11274364B2 (en) | 2017-06-28 | 2022-03-15 | Solayer Gmbh | Sputter devices and methods |
JP7171270B2 (ja) * | 2018-07-02 | 2022-11-15 | キヤノン株式会社 | 成膜装置およびそれを用いた成膜方法 |
CN109750267B (zh) * | 2019-03-26 | 2021-10-26 | 合肥京东方显示技术有限公司 | 一种磁控溅射装置 |
KR20220042452A (ko) * | 2019-08-09 | 2022-04-05 | 어플라이드 머티어리얼스, 인코포레이티드 | 기판을 코팅하는 방법 및 기판을 코팅하기 위한 코팅 장치 |
US20230097276A1 (en) * | 2020-03-13 | 2023-03-30 | Evatec Ag | Apparatus and process with a dc-pulsed cathode array |
WO2022009484A1 (ja) * | 2020-07-08 | 2022-01-13 | 株式会社アルバック | 成膜方法 |
CN116324014A (zh) * | 2020-10-14 | 2023-06-23 | 应用材料公司 | 溅射沉积源、沉积设备和涂覆基板的方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03104864A (ja) * | 1989-09-18 | 1991-05-01 | Hitachi Ltd | スパッタリングカソード |
JPH06158312A (ja) * | 1992-09-29 | 1994-06-07 | Boc Group Inc:The | 酸化金属皮膜の蒸着装置及び蒸着方法 |
JP2000239839A (ja) * | 1999-02-19 | 2000-09-05 | Tadahiro Omi | スパッタリング装置 |
JP3281371B2 (ja) * | 1989-11-08 | 2002-05-13 | ザ ビーオーシー グループ インコーポレイテッド | 広面コーティング用の円筒状回転マグネトロン |
JP2003183823A (ja) * | 2001-12-17 | 2003-07-03 | Sharp Corp | スパッタ装置 |
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US4417968A (en) * | 1983-03-21 | 1983-11-29 | Shatterproof Glass Corporation | Magnetron cathode sputtering apparatus |
DE4126236C2 (de) * | 1991-08-08 | 2000-01-05 | Leybold Ag | Rotierende Magnetron-Kathode und Verwendung einer rotierenden Magnetron-Kathode |
US5344718A (en) * | 1992-04-30 | 1994-09-06 | Guardian Industries Corp. | High performance, durable, low-E glass |
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JPH0835064A (ja) * | 1994-07-20 | 1996-02-06 | Matsushita Electric Ind Co Ltd | スパッタリング装置 |
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WO2000028104A1 (en) * | 1998-11-06 | 2000-05-18 | Scivac | Sputtering apparatus and process for high rate coatings |
JP2003096561A (ja) * | 2001-09-25 | 2003-04-03 | Sharp Corp | スパッタ装置 |
US20040074770A1 (en) * | 2002-07-02 | 2004-04-22 | George Wityak | Rotary target |
-
2004
- 2004-05-05 EP EP04010696A patent/EP1594153B1/de not_active Expired - Lifetime
- 2004-05-05 AT AT04010696T patent/ATE459092T1/de not_active IP Right Cessation
- 2004-05-05 DE DE502004010804T patent/DE502004010804D1/de not_active Expired - Lifetime
-
2005
- 2005-04-27 TW TW094113439A patent/TWI287815B/zh active
- 2005-04-30 CN CNB200510069952XA patent/CN100513633C/zh active Active
- 2005-05-03 KR KR1020050036992A patent/KR100692584B1/ko active IP Right Grant
- 2005-05-04 US US11/121,563 patent/US8137510B2/en active Active
- 2005-05-06 JP JP2005135222A patent/JP4536584B2/ja active Active
-
2010
- 2010-04-05 JP JP2010087024A patent/JP4729122B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03104864A (ja) * | 1989-09-18 | 1991-05-01 | Hitachi Ltd | スパッタリングカソード |
JP3281371B2 (ja) * | 1989-11-08 | 2002-05-13 | ザ ビーオーシー グループ インコーポレイテッド | 広面コーティング用の円筒状回転マグネトロン |
JPH06158312A (ja) * | 1992-09-29 | 1994-06-07 | Boc Group Inc:The | 酸化金属皮膜の蒸着装置及び蒸着方法 |
JP2000239839A (ja) * | 1999-02-19 | 2000-09-05 | Tadahiro Omi | スパッタリング装置 |
JP2003183823A (ja) * | 2001-12-17 | 2003-07-03 | Sharp Corp | スパッタ装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2010209470A (ja) | 2010-09-24 |
US20050252768A1 (en) | 2005-11-17 |
DE502004010804D1 (de) | 2010-04-08 |
JP2005350768A (ja) | 2005-12-22 |
CN1693532A (zh) | 2005-11-09 |
CN100513633C (zh) | 2009-07-15 |
EP1594153A1 (de) | 2005-11-09 |
JP4536584B2 (ja) | 2010-09-01 |
TWI287815B (en) | 2007-10-01 |
KR100692584B1 (ko) | 2007-03-13 |
TW200603193A (en) | 2006-01-16 |
US8137510B2 (en) | 2012-03-20 |
ATE459092T1 (de) | 2010-03-15 |
EP1594153B1 (de) | 2010-02-24 |
KR20060045884A (ko) | 2006-05-17 |
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