JP4526449B2 - ウェハ搬送装置 - Google Patents
ウェハ搬送装置 Download PDFInfo
- Publication number
- JP4526449B2 JP4526449B2 JP2005189315A JP2005189315A JP4526449B2 JP 4526449 B2 JP4526449 B2 JP 4526449B2 JP 2005189315 A JP2005189315 A JP 2005189315A JP 2005189315 A JP2005189315 A JP 2005189315A JP 4526449 B2 JP4526449 B2 JP 4526449B2
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- JP
- Japan
- Prior art keywords
- wafer
- suction pad
- bending strength
- polishing
- suction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Manipulator (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
(第1の実施形態)
まず,本発明の第1の実施形態にかかる研磨装置について説明する。なお,図1は,本実施形態にかかる研磨装置1の全体構成を示す斜視図である。
次に,実施例として,従来のウェハ搬送装置と,本発明のウェハ搬送装置とについて,それぞれのウェハ搬送装置により搬送されたウェハWの抗折強度を測定し,その比較結果を示す。
110,112 搬送アーム
111,113 保持部
120 ウェハ搬送装置
122 吸着パッド
W ウェハ
C チップ
Claims (1)
- 表面研削により変質したウェハの研削面を研磨する研磨装置に備えられ,前記ウェハを吸着部により吸着保持して,前記ウェハを保持するチャックテーブルから前記ウェハを洗浄する洗浄手段へ搬送するウェハ搬送装置であって,
前記吸着部は,アルミナを主成分とした材料から形成され,気孔率が34〜40%であり,
前記吸着部の表面における気孔以外の部分の表面粗さRyは,5μm以下であることを特徴とする,ウェハ搬送装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189315A JP4526449B2 (ja) | 2005-06-29 | 2005-06-29 | ウェハ搬送装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005189315A JP4526449B2 (ja) | 2005-06-29 | 2005-06-29 | ウェハ搬送装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007012737A JP2007012737A (ja) | 2007-01-18 |
JP4526449B2 true JP4526449B2 (ja) | 2010-08-18 |
Family
ID=37750881
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2005189315A Active JP4526449B2 (ja) | 2005-06-29 | 2005-06-29 | ウェハ搬送装置 |
Country Status (1)
Country | Link |
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JP (1) | JP4526449B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5179928B2 (ja) * | 2008-04-11 | 2013-04-10 | 株式会社ディスコ | ウエーハの搬出方法 |
JP5877719B2 (ja) * | 2012-01-13 | 2016-03-08 | 株式会社ディスコ | 搬送方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH068086A (ja) * | 1991-11-29 | 1994-01-18 | Kyocera Corp | 真空吸着装置 |
JPH0855896A (ja) * | 1994-08-11 | 1996-02-27 | Disco Abrasive Syst Ltd | ウェーハ搬送手段 |
JP2001351961A (ja) * | 2000-06-07 | 2001-12-21 | Taiheiyo Cement Corp | Siウェハ搬送治具及びその製造方法 |
JP2004140132A (ja) * | 2002-10-17 | 2004-05-13 | Taiheiyo Cement Corp | 試料載置ステージ |
-
2005
- 2005-06-29 JP JP2005189315A patent/JP4526449B2/ja active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH068086A (ja) * | 1991-11-29 | 1994-01-18 | Kyocera Corp | 真空吸着装置 |
JPH0855896A (ja) * | 1994-08-11 | 1996-02-27 | Disco Abrasive Syst Ltd | ウェーハ搬送手段 |
JP2001351961A (ja) * | 2000-06-07 | 2001-12-21 | Taiheiyo Cement Corp | Siウェハ搬送治具及びその製造方法 |
JP2004140132A (ja) * | 2002-10-17 | 2004-05-13 | Taiheiyo Cement Corp | 試料載置ステージ |
Also Published As
Publication number | Publication date |
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JP2007012737A (ja) | 2007-01-18 |
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