JP4525193B2 - 光半導体素子用パッケージとそれを用いた発光装置 - Google Patents

光半導体素子用パッケージとそれを用いた発光装置 Download PDF

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Publication number
JP4525193B2
JP4525193B2 JP2004176833A JP2004176833A JP4525193B2 JP 4525193 B2 JP4525193 B2 JP 4525193B2 JP 2004176833 A JP2004176833 A JP 2004176833A JP 2004176833 A JP2004176833 A JP 2004176833A JP 4525193 B2 JP4525193 B2 JP 4525193B2
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JP
Japan
Prior art keywords
optical semiconductor
semiconductor element
package
mounting
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004176833A
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English (en)
Japanese (ja)
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JP2006004987A5 (enExample
JP2006004987A (ja
Inventor
清之 石田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corp, Matsushita Electric Industrial Co Ltd filed Critical Panasonic Corp
Priority to JP2004176833A priority Critical patent/JP4525193B2/ja
Publication of JP2006004987A publication Critical patent/JP2006004987A/ja
Publication of JP2006004987A5 publication Critical patent/JP2006004987A5/ja
Application granted granted Critical
Publication of JP4525193B2 publication Critical patent/JP4525193B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Led Device Packages (AREA)
JP2004176833A 2004-06-15 2004-06-15 光半導体素子用パッケージとそれを用いた発光装置 Expired - Fee Related JP4525193B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004176833A JP4525193B2 (ja) 2004-06-15 2004-06-15 光半導体素子用パッケージとそれを用いた発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004176833A JP4525193B2 (ja) 2004-06-15 2004-06-15 光半導体素子用パッケージとそれを用いた発光装置

Publications (3)

Publication Number Publication Date
JP2006004987A JP2006004987A (ja) 2006-01-05
JP2006004987A5 JP2006004987A5 (enExample) 2006-11-24
JP4525193B2 true JP4525193B2 (ja) 2010-08-18

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ID=35773134

Family Applications (1)

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JP2004176833A Expired - Fee Related JP4525193B2 (ja) 2004-06-15 2004-06-15 光半導体素子用パッケージとそれを用いた発光装置

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JP (1) JP4525193B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4841348B2 (ja) * 2006-07-27 2011-12-21 京セラ株式会社 発光素子用配線基板および発光装置
JP4795293B2 (ja) * 2007-03-30 2011-10-19 ローム株式会社 半導体発光装置
JP5030296B2 (ja) * 2008-04-24 2012-09-19 パナソニック株式会社 照明器具およびその組み立て方法
CN102017194A (zh) * 2008-04-25 2011-04-13 松下电器产业株式会社 光学元件封装体、半导体发光装置和照明装置
EP2548530B1 (de) 2011-07-19 2014-03-19 W & H Dentalwerk Bürmoos GmbH Beleuchtungsvorrichtung für ein medizinisches, insbesondere dentales, Instrument

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153537U (ja) * 1984-03-22 1985-10-12 関西日本電気株式会社 気密端子
JP3572924B2 (ja) * 1997-03-06 2004-10-06 松下電器産業株式会社 発光装置及びそれを用いた記録装置
JP2000294832A (ja) * 1999-04-05 2000-10-20 Matsushita Electronics Industry Corp 発光ダイオード装置及びその製造方法
DE10117889A1 (de) * 2001-04-10 2002-10-24 Osram Opto Semiconductors Gmbh Leiterrahmen und Gehäuse für ein strahlungsemittierendes Bauelement, strahlungsemittierendes Bauelement sowie Verfahren zu dessen Herstellung
JP4122784B2 (ja) * 2001-09-19 2008-07-23 松下電工株式会社 発光装置
CN1323441C (zh) * 2001-10-12 2007-06-27 日亚化学工业株式会社 发光装置及其制造方法
JP2003163382A (ja) * 2001-11-29 2003-06-06 Matsushita Electric Ind Co Ltd 受光素子または発光素子用パッケージ
JP4023723B2 (ja) * 2002-04-05 2007-12-19 シチズン電子株式会社 表面実装型発光ダイオード
JP4407204B2 (ja) * 2002-08-30 2010-02-03 日亜化学工業株式会社 発光装置

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JP2006004987A (ja) 2006-01-05

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