JP4514742B2 - 銅充填後微孔の凹みまたは凸起の分析方法 - Google Patents

銅充填後微孔の凹みまたは凸起の分析方法 Download PDF

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JP4514742B2
JP4514742B2 JP2006267114A JP2006267114A JP4514742B2 JP 4514742 B2 JP4514742 B2 JP 4514742B2 JP 2006267114 A JP2006267114 A JP 2006267114A JP 2006267114 A JP2006267114 A JP 2006267114A JP 4514742 B2 JP4514742 B2 JP 4514742B2
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copper
dent
height
micropore
value
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Japanese (ja)
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JP2007147591A (ja
Inventor
グアン シア ワン
グオ ウェン ルー
イン カイ フン
ウー ユー シーアオ
クン ジー リー
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Machvision Inc
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Machvision Inc
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection

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  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Signal Processing (AREA)
  • Health & Medical Sciences (AREA)
  • Quality & Reliability (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2006267114A 2005-11-29 2006-09-29 銅充填後微孔の凹みまたは凸起の分析方法 Active JP4514742B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW094141861A TWI270656B (en) 2005-11-29 2005-11-29 Analysis method for sag or protrusion of copper-filled micro via

Publications (2)

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JP2007147591A JP2007147591A (ja) 2007-06-14
JP4514742B2 true JP4514742B2 (ja) 2010-07-28

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JP2006267114A Active JP4514742B2 (ja) 2005-11-29 2006-09-29 銅充填後微孔の凹みまたは凸起の分析方法

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JP (1) JP4514742B2 (ko)
KR (1) KR100833382B1 (ko)
TW (1) TWI270656B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114674207B (zh) * 2022-04-28 2024-04-12 马鞍山钢铁股份有限公司 一种平底盲孔的底面平面度测量装置和方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188307A (ja) * 1989-12-19 1991-08-16 Fujitsu Ltd バイアホール検査装置
JPH11289138A (ja) * 1998-04-02 1999-10-19 Ibiden Co Ltd 両面基板およびその充填スルーホールの形成方法
JP2000049204A (ja) * 1998-06-26 2000-02-18 Siemens Ag 半導体デバイス内の誘電体層厚さの光学的測定方法及び装置
JP2001144444A (ja) * 1999-11-17 2001-05-25 Ibiden Co Ltd 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0786477B2 (ja) * 1987-09-28 1995-09-20 株式会社東芝 表面検査装置
US6252412B1 (en) * 1999-01-08 2001-06-26 Schlumberger Technologies, Inc. Method of detecting defects in patterned substrates
FR2812515B1 (fr) * 2000-07-27 2003-08-01 Kermel Procede de realisation d'une circuiterie comportant pistes, pastilles et microtraversees conductrices et utilisation de ce procede pour la realisation de circuits imprimes et de modules multicouches a haute densite d'integration
JP4563170B2 (ja) * 2002-05-02 2010-10-13 オーボテック リミテッド 電気回路パターンの製造方法及びシステム
JP4160811B2 (ja) * 2002-10-07 2008-10-08 住友電工プリントサーキット株式会社 フレキシブル銅張回路基板
JP2004356493A (ja) * 2003-05-30 2004-12-16 Sumitomo Metal Mining Co Ltd 多層プリント配線基板の製造方法
US6919635B2 (en) * 2003-11-04 2005-07-19 International Business Machines Corporation High density microvia substrate with high wireability

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03188307A (ja) * 1989-12-19 1991-08-16 Fujitsu Ltd バイアホール検査装置
JPH11289138A (ja) * 1998-04-02 1999-10-19 Ibiden Co Ltd 両面基板およびその充填スルーホールの形成方法
JP2000049204A (ja) * 1998-06-26 2000-02-18 Siemens Ag 半導体デバイス内の誘電体層厚さの光学的測定方法及び装置
JP2001144444A (ja) * 1999-11-17 2001-05-25 Ibiden Co Ltd 多層プリント配線板並びにそのコア材となる両面プリント配線板及びその製造方法

Also Published As

Publication number Publication date
KR20070056927A (ko) 2007-06-04
KR100833382B1 (ko) 2008-05-28
TW200720623A (en) 2007-06-01
JP2007147591A (ja) 2007-06-14
TWI270656B (en) 2007-01-11

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