JP4505357B2 - 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 - Google Patents
感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 Download PDFInfo
- Publication number
- JP4505357B2 JP4505357B2 JP2005075494A JP2005075494A JP4505357B2 JP 4505357 B2 JP4505357 B2 JP 4505357B2 JP 2005075494 A JP2005075494 A JP 2005075494A JP 2005075494 A JP2005075494 A JP 2005075494A JP 4505357 B2 JP4505357 B2 JP 4505357B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- acid
- photosensitive composition
- resin
- examples
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0395—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
- G03F7/0758—Macromolecular compounds containing Si-O, Si-C or Si-N bonds with silicon- containing groups in the side chains
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/122—Sulfur compound containing
- Y10S430/123—Sulfur in heterocyclic ring
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005075494A JP4505357B2 (ja) | 2005-03-16 | 2005-03-16 | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
US11/373,188 US7807329B2 (en) | 2005-03-16 | 2006-03-13 | Photosensitive composition and pattern-forming method using the same |
AT06005324T ATE460685T1 (de) | 2005-03-16 | 2006-03-15 | Lichtempfindliche zusammensetzung und verfahren zur strukturformung damit |
DE602006012749T DE602006012749D1 (de) | 2005-03-16 | 2006-03-15 | Lichtempfindliche Zusammensetzung und Verfahren zur Strukturformung damit |
EP06005324A EP1703326B1 (en) | 2005-03-16 | 2006-03-15 | Photosensitive composition and pattern-forming method using the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005075494A JP4505357B2 (ja) | 2005-03-16 | 2005-03-16 | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006259136A JP2006259136A (ja) | 2006-09-28 |
JP4505357B2 true JP4505357B2 (ja) | 2010-07-21 |
Family
ID=36645599
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005075494A Expired - Fee Related JP4505357B2 (ja) | 2005-03-16 | 2005-03-16 | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
Country Status (5)
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008100988A (ja) * | 2006-09-19 | 2008-05-01 | Fujifilm Corp | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4499591B2 (ja) * | 2005-03-23 | 2010-07-07 | 東京応化工業株式会社 | 厚膜形成用化学増幅型ポジ型ホトレジスト組成物 |
JP4524234B2 (ja) * | 2005-09-26 | 2010-08-11 | 富士フイルム株式会社 | ポジ型レジスト組成物およびそれを用いたパターン形成方法 |
KR20080026066A (ko) * | 2006-09-19 | 2008-03-24 | 후지필름 가부시키가이샤 | 감광성 조성물, 감광성 조성물에 사용하는 화합물 및감광성 조성물을 사용한 패턴형성방법 |
KR101384171B1 (ko) * | 2006-09-29 | 2014-04-10 | 후지필름 가부시키가이샤 | 레지스트 조성물 및 이것을 사용한 패턴형성방법 |
JP2008191644A (ja) * | 2006-10-30 | 2008-08-21 | Rohm & Haas Electronic Materials Llc | 液浸リソグラフィーのための組成物および方法 |
US8530148B2 (en) | 2006-12-25 | 2013-09-10 | Fujifilm Corporation | Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method |
US8637229B2 (en) | 2006-12-25 | 2014-01-28 | Fujifilm Corporation | Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method |
JP4554665B2 (ja) | 2006-12-25 | 2010-09-29 | 富士フイルム株式会社 | パターン形成方法、該パターン形成方法に用いられる多重現像用ポジ型レジスト組成物、該パターン形成方法に用いられるネガ現像用現像液及び該パターン形成方法に用いられるネガ現像用リンス液 |
JP5096796B2 (ja) * | 2007-03-05 | 2012-12-12 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
EP1978408B1 (en) | 2007-03-29 | 2011-10-12 | FUJIFILM Corporation | Negative resist composition and pattern forming method using the same |
JP4958821B2 (ja) * | 2007-03-29 | 2012-06-20 | 富士フイルム株式会社 | ネガ型レジスト組成物及びそれを用いたパターン形成方法 |
JP4982288B2 (ja) * | 2007-04-13 | 2012-07-25 | 富士フイルム株式会社 | パターン形成方法 |
US8034547B2 (en) | 2007-04-13 | 2011-10-11 | Fujifilm Corporation | Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method |
JP4866790B2 (ja) * | 2007-05-23 | 2012-02-01 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
JP5066405B2 (ja) * | 2007-08-02 | 2012-11-07 | 富士フイルム株式会社 | 電子線、x線又はeuv用レジスト組成物及び該組成物を用いたパターン形成方法 |
JP2009053665A (ja) * | 2007-08-02 | 2009-03-12 | Fujifilm Corp | 感光性組成物及び該感光性組成物を用いたパターン形成方法 |
JP5459998B2 (ja) | 2007-09-14 | 2014-04-02 | 富士フイルム株式会社 | ポジ型感光性組成物、該ポジ型感光性組成物を用いたパターン形成方法、及び、該ポジ型感光性組成物に用いられる樹脂 |
JP5276821B2 (ja) * | 2007-10-01 | 2013-08-28 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
US20090098490A1 (en) * | 2007-10-16 | 2009-04-16 | Victor Pham | Radiation-Sensitive, Wet Developable Bottom Antireflective Coating Compositions and Their Applications in Semiconductor Manufacturing |
JP5358112B2 (ja) * | 2008-03-28 | 2013-12-04 | 東京応化工業株式会社 | レジスト組成物およびレジストパターン形成方法 |
JP5364436B2 (ja) * | 2008-05-08 | 2013-12-11 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、新規な化合物、および酸発生剤 |
JP5238354B2 (ja) * | 2008-05-21 | 2013-07-17 | 東京応化工業株式会社 | レジストパターン形成方法 |
JP5481046B2 (ja) * | 2008-08-13 | 2014-04-23 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、新規な化合物および酸発生剤 |
JP5387181B2 (ja) * | 2009-07-08 | 2014-01-15 | 信越化学工業株式会社 | スルホニウム塩、レジスト材料及びパターン形成方法 |
JPWO2012014576A1 (ja) * | 2010-07-30 | 2013-09-12 | Jsr株式会社 | ネガ型感放射線性樹脂組成物 |
KR101229312B1 (ko) | 2011-01-03 | 2013-02-04 | 금호석유화학 주식회사 | 술포늄 화합물, 광산발생제 및 이의 제조방법 |
JP5035466B1 (ja) | 2011-02-04 | 2012-09-26 | Jsr株式会社 | レジストパターン形成用感放射線性樹脂組成物 |
US8932796B2 (en) | 2011-11-10 | 2015-01-13 | International Business Machines Corporation | Hybrid photoresist composition and pattern forming method using thereof |
JP5846889B2 (ja) * | 2011-12-14 | 2016-01-20 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、化合物 |
US11009790B2 (en) | 2016-07-28 | 2021-05-18 | Samsung Electronics Co., Ltd. | Photoacid generator and photoresist composition including the same |
US20220252977A1 (en) * | 2019-05-20 | 2022-08-11 | Merck Patent Gmbh | A negative tone lift off resist composition comprising an alkali soluble resin and a photo acid generator, and a method for manufacturing metal film patterns on a substrate. |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002049151A (ja) * | 2000-01-17 | 2002-02-15 | Fuji Photo Film Co Ltd | ネガ型レジスト組成物 |
JP2003149800A (ja) * | 2001-11-12 | 2003-05-21 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
JP2004004557A (ja) * | 2002-02-13 | 2004-01-08 | Fuji Photo Film Co Ltd | 電子線、euv又はx線用レジスト組成物 |
JP2004250427A (ja) * | 2002-12-25 | 2004-09-09 | Jsr Corp | オニウム塩化合物、感放射線性酸発生剤およびポジ型感放射線性樹脂組成物 |
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US5106885A (en) * | 1989-11-03 | 1992-04-21 | Isp Investments Inc. | Radiation curable compositions containing multifunctional vinyl ether monomers and protective coatings formed therefrom |
TWI263866B (en) | 1999-01-18 | 2006-10-11 | Sumitomo Chemical Co | Chemical amplification type positive resist composition |
DE60015220T2 (de) * | 1999-03-31 | 2006-02-02 | Sumitomo Chemical Co. Ltd. | Positiv arbeitender Resist vom chemischen Verstärkertyp |
US6479211B1 (en) | 1999-05-26 | 2002-11-12 | Fuji Photo Film Co., Ltd. | Positive photoresist composition for far ultraviolet exposure |
JP2002049154A (ja) | 2000-08-01 | 2002-02-15 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
US6887645B2 (en) * | 2000-08-31 | 2005-05-03 | Fuji Photo Film Co., Ltd. | Negative resist composition |
TW538316B (en) * | 2001-01-19 | 2003-06-21 | Sumitomo Chemical Co | Chemical amplifying type positive resist composition |
BR0205767B1 (pt) * | 2001-07-19 | 2013-10-15 | Sais de sulfônio, composições curáveis por radiação, formulações líquidas, e, método para a preparação dos sais de sulfônio | |
US7521168B2 (en) | 2002-02-13 | 2009-04-21 | Fujifilm Corporation | Resist composition for electron beam, EUV or X-ray |
JP3841400B2 (ja) * | 2002-02-26 | 2006-11-01 | 富士写真フイルム株式会社 | ポジ型レジスト組成物 |
GB0204467D0 (en) * | 2002-02-26 | 2002-04-10 | Coates Brothers Plc | Novel fused ring compounds, and their use as cationic photoinitiators |
US7217492B2 (en) | 2002-12-25 | 2007-05-15 | Jsr Corporation | Onium salt compound and radiation-sensitive resin composition |
JP4115309B2 (ja) * | 2003-03-24 | 2008-07-09 | 富士フイルム株式会社 | ポジ型レジスト組成物 |
US20040265733A1 (en) | 2003-06-30 | 2004-12-30 | Houlihan Francis M. | Photoacid generators |
US7026367B2 (en) * | 2003-09-26 | 2006-04-11 | 3M Innovative Properties Company | Photoiniators having triarylsulfonium and arylsulfinate ions |
US7541131B2 (en) * | 2005-02-18 | 2009-06-02 | Fujifilm Corporation | Resist composition, compound for use in the resist composition and pattern forming method using the resist composition |
-
2005
- 2005-03-16 JP JP2005075494A patent/JP4505357B2/ja not_active Expired - Fee Related
-
2006
- 2006-03-13 US US11/373,188 patent/US7807329B2/en not_active Expired - Fee Related
- 2006-03-15 DE DE602006012749T patent/DE602006012749D1/de active Active
- 2006-03-15 AT AT06005324T patent/ATE460685T1/de not_active IP Right Cessation
- 2006-03-15 EP EP06005324A patent/EP1703326B1/en not_active Not-in-force
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2002049151A (ja) * | 2000-01-17 | 2002-02-15 | Fuji Photo Film Co Ltd | ネガ型レジスト組成物 |
JP2003149800A (ja) * | 2001-11-12 | 2003-05-21 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
JP2004004557A (ja) * | 2002-02-13 | 2004-01-08 | Fuji Photo Film Co Ltd | 電子線、euv又はx線用レジスト組成物 |
JP2004250427A (ja) * | 2002-12-25 | 2004-09-09 | Jsr Corp | オニウム塩化合物、感放射線性酸発生剤およびポジ型感放射線性樹脂組成物 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008100988A (ja) * | 2006-09-19 | 2008-05-01 | Fujifilm Corp | 感光性組成物、該感光性組成物に用いる化合物及び該感光性組成物を用いたパターン形成方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1703326B1 (en) | 2010-03-10 |
ATE460685T1 (de) | 2010-03-15 |
EP1703326A2 (en) | 2006-09-20 |
DE602006012749D1 (de) | 2010-04-22 |
JP2006259136A (ja) | 2006-09-28 |
EP1703326A3 (en) | 2007-11-07 |
US20060210919A1 (en) | 2006-09-21 |
US7807329B2 (en) | 2010-10-05 |
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