JP4500031B2 - 液状部材の滴下装置及び液状部材の滴下方法 - Google Patents
液状部材の滴下装置及び液状部材の滴下方法 Download PDFInfo
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- JP4500031B2 JP4500031B2 JP2003341311A JP2003341311A JP4500031B2 JP 4500031 B2 JP4500031 B2 JP 4500031B2 JP 2003341311 A JP2003341311 A JP 2003341311A JP 2003341311 A JP2003341311 A JP 2003341311A JP 4500031 B2 JP4500031 B2 JP 4500031B2
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- dropping
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- substrate
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- liquid crystal
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003341311A JP4500031B2 (ja) | 2003-09-30 | 2003-09-30 | 液状部材の滴下装置及び液状部材の滴下方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003341311A JP4500031B2 (ja) | 2003-09-30 | 2003-09-30 | 液状部材の滴下装置及び液状部材の滴下方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005103463A JP2005103463A (ja) | 2005-04-21 |
| JP2005103463A5 JP2005103463A5 (https=) | 2006-11-16 |
| JP4500031B2 true JP4500031B2 (ja) | 2010-07-14 |
Family
ID=34535950
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003341311A Expired - Fee Related JP4500031B2 (ja) | 2003-09-30 | 2003-09-30 | 液状部材の滴下装置及び液状部材の滴下方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4500031B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010104861A (ja) * | 2008-10-28 | 2010-05-13 | Seiko Epson Corp | 液状体の吐出方法、カラーフィルタの製造方法および有機el装置の製造方法 |
| KR101550361B1 (ko) | 2009-02-17 | 2015-09-04 | 주식회사 탑 엔지니어링 | 스테이지를 구비한 디스펜서 제어방법 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05281562A (ja) * | 1992-04-01 | 1993-10-29 | Matsushita Electric Ind Co Ltd | 液晶パネルの製造方法 |
| JPH05285434A (ja) * | 1992-04-14 | 1993-11-02 | Omron Corp | 液体吐出装置 |
| JP3113212B2 (ja) * | 1996-05-09 | 2000-11-27 | 富士通株式会社 | プラズマディスプレイパネルの蛍光体層形成装置および蛍光体塗布方法 |
| JP3886211B2 (ja) * | 1997-06-06 | 2007-02-28 | 松下電器産業株式会社 | 部品装着用接着剤塗布ヘッド、部品装着用接着剤塗布装置、及び部品装着用接着剤塗布方法 |
| JP2000288450A (ja) * | 1999-04-07 | 2000-10-17 | Tokyo Electron Ltd | 塗布膜形成方法および塗布装置 |
| JP2000301042A (ja) * | 1999-04-19 | 2000-10-31 | Nec Corp | 樹脂塗布装置 |
| JP2001044609A (ja) * | 1999-07-29 | 2001-02-16 | Matsushita Electric Ind Co Ltd | 粘性流体塗布装置および方法 |
| JP4206660B2 (ja) * | 2001-11-13 | 2009-01-14 | 株式会社日立プラントテクノロジー | シール印刷・液晶滴下装置と液晶表示パネル組立装置 |
| JP4082910B2 (ja) * | 2002-01-31 | 2008-04-30 | 東芝松下ディスプレイテクノロジー株式会社 | 液晶表示素子の製造方法 |
| JP2003241208A (ja) * | 2002-02-19 | 2003-08-27 | Shibaura Mechatronics Corp | 液晶滴下装置及び方法並びに液晶表示パネル製造装置 |
-
2003
- 2003-09-30 JP JP2003341311A patent/JP4500031B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005103463A (ja) | 2005-04-21 |
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