JP4498829B2 - カードホルダ - Google Patents
カードホルダ Download PDFInfo
- Publication number
- JP4498829B2 JP4498829B2 JP2004175475A JP2004175475A JP4498829B2 JP 4498829 B2 JP4498829 B2 JP 4498829B2 JP 2004175475 A JP2004175475 A JP 2004175475A JP 2004175475 A JP2004175475 A JP 2004175475A JP 4498829 B2 JP4498829 B2 JP 4498829B2
- Authority
- JP
- Japan
- Prior art keywords
- outer peripheral
- probe
- support
- probe card
- card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/695,792 US6831455B2 (en) | 2002-11-01 | 2003-10-30 | Mechanism for fixing probe card |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2005181284A JP2005181284A (ja) | 2005-07-07 |
| JP2005181284A5 JP2005181284A5 (enExample) | 2006-04-13 |
| JP4498829B2 true JP4498829B2 (ja) | 2010-07-07 |
Family
ID=34794552
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004175475A Expired - Fee Related JP4498829B2 (ja) | 2003-10-30 | 2004-06-14 | カードホルダ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4498829B2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012178599A (ja) * | 2012-05-14 | 2012-09-13 | Tokyo Seimitsu Co Ltd | プローバおよびプローバの温度制御方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4695447B2 (ja) * | 2005-06-23 | 2011-06-08 | 株式会社日本マイクロニクス | プローブ組立体およびこれを用いた電気的接続装置 |
| DE102007057815A1 (de) * | 2006-12-19 | 2008-06-26 | Feinmetall Gmbh | Kontaktiervorrichtung für eine Berührungskontaktierung eines elektrischen Prüflings sowie entsprechendes Verfahren |
| WO2008078939A1 (en) * | 2006-12-27 | 2008-07-03 | Secron Co., Ltd. | Probe station, and testing method of wafer using the same |
| JP2008286657A (ja) * | 2007-05-18 | 2008-11-27 | Advantest Corp | プローブカードおよびそれを備えた電子部品試験装置 |
| JP6259590B2 (ja) * | 2013-06-12 | 2018-01-10 | 株式会社日本マイクロニクス | プローブカード及びその製造方法 |
| TWI597503B (zh) * | 2016-08-24 | 2017-09-01 | 美亞國際電子有限公司 | 探針卡 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0792479B2 (ja) * | 1993-03-18 | 1995-10-09 | 東京エレクトロン株式会社 | プローブ装置の平行度調整方法 |
| JP2601408B2 (ja) * | 1994-04-28 | 1997-04-16 | 日本電子材料株式会社 | 高温測定用プローブカード及びそれに用いられるマザーボード |
| JP3364401B2 (ja) * | 1996-12-27 | 2003-01-08 | 東京エレクトロン株式会社 | プローブカードクランプ機構及びプローブ装置 |
-
2004
- 2004-06-14 JP JP2004175475A patent/JP4498829B2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012178599A (ja) * | 2012-05-14 | 2012-09-13 | Tokyo Seimitsu Co Ltd | プローバおよびプローバの温度制御方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005181284A (ja) | 2005-07-07 |
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