JP4487225B2 - Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 - Google Patents

Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 Download PDF

Info

Publication number
JP4487225B2
JP4487225B2 JP2000081091A JP2000081091A JP4487225B2 JP 4487225 B2 JP4487225 B2 JP 4487225B2 JP 2000081091 A JP2000081091 A JP 2000081091A JP 2000081091 A JP2000081091 A JP 2000081091A JP 4487225 B2 JP4487225 B2 JP 4487225B2
Authority
JP
Japan
Prior art keywords
target material
film
corrosion resistance
amount
based target
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2000081091A
Other languages
English (en)
Japanese (ja)
Other versions
JP2001262328A (ja
JP2001262328A5 (enrdf_load_stackoverflow
Inventor
英夫 村田
邦親 久保田
俊一郎 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2000081091A priority Critical patent/JP4487225B2/ja
Publication of JP2001262328A publication Critical patent/JP2001262328A/ja
Publication of JP2001262328A5 publication Critical patent/JP2001262328A5/ja
Application granted granted Critical
Publication of JP4487225B2 publication Critical patent/JP4487225B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Images

Landscapes

  • Physical Vapour Deposition (AREA)
JP2000081091A 2000-03-23 2000-03-23 Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 Expired - Lifetime JP4487225B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2000081091A JP4487225B2 (ja) 2000-03-23 2000-03-23 Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000081091A JP4487225B2 (ja) 2000-03-23 2000-03-23 Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜

Publications (3)

Publication Number Publication Date
JP2001262328A JP2001262328A (ja) 2001-09-26
JP2001262328A5 JP2001262328A5 (enrdf_load_stackoverflow) 2007-03-29
JP4487225B2 true JP4487225B2 (ja) 2010-06-23

Family

ID=18598072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000081091A Expired - Lifetime JP4487225B2 (ja) 2000-03-23 2000-03-23 Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜

Country Status (1)

Country Link
JP (1) JP4487225B2 (enrdf_load_stackoverflow)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4466902B2 (ja) * 2003-01-10 2010-05-26 日鉱金属株式会社 ニッケル合金スパッタリングターゲット
JP2005093571A (ja) * 2003-09-16 2005-04-07 Hitachi Metals Ltd 薄膜配線層
EP1672086B1 (en) * 2003-10-07 2019-03-13 JX Nippon Mining & Metals Corporation HIGH-PURITY Ni-V ALLOY, TARGET THEREFROM, HIGH-PURITY Ni-V ALLOY THIN FILM AND PROCESS FOR PRODUCING HIGH-PURITY Ni-V ALLOY
JP4730662B2 (ja) * 2005-03-02 2011-07-20 日立金属株式会社 薄膜配線層
JP4655281B2 (ja) * 2005-03-29 2011-03-23 日立金属株式会社 薄膜配線層
JP5203908B2 (ja) * 2008-12-04 2013-06-05 新日鉄住金マテリアルズ株式会社 Ｎｉ−Ｍｏ系合金スパッタリングターゲット板
JP2010133001A (ja) * 2008-12-08 2010-06-17 Hitachi Metals Ltd Ｎｉ合金ターゲット材の製造方法
JP5113100B2 (ja) * 2009-01-28 2013-01-09 Ｊｘ日鉱日石金属株式会社 高純度ニッケル合金ターゲット

Also Published As

Publication number Publication date
JP2001262328A (ja) 2001-09-26

Similar Documents

Publication Publication Date Title
JP3465108B2 (ja) 電気・電子部品用銅合金
US6884363B2 (en) Method of surface treatment for stainless steel product for fuel cell
JP5468423B2 (ja) 高強度高耐熱性銅合金材
US12035469B2 (en) Pure copper plate, copper/ceramic bonded body, and insulated circuit board
JP2015061943A (ja) 高純度銅マンガン合金スパッタリングターゲット
JP4168077B2 (ja) 酸化膜密着性に優れた電気電子部品用銅合金板
JP4487225B2 (ja) Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜
JP4022891B2 (ja) 配線膜用Ａｌ合金膜および配線膜形成用スパッタリングターゲット材
JP5214282B2 (ja) ダイシング加工性に優れるｑｆｎパッケージ用銅合金板
US5210441A (en) Lead frame formed of a copper-zirconium alloy
JP3819487B2 (ja) 半導体素子の製造方法
JP5291494B2 (ja) 高強度高耐熱性銅合金板
JP2015203148A (ja) 銅合金材、セラミック配線基板及びセラミック配線基板の製造方法
CN111850420A (zh) 一种具有室温零热膨胀效应的合金材料
TW202113093A (zh) 均溫板用鈦銅合金板及均溫板
JP3296709B2 (ja) 電子機器用薄板銅合金およびその製造方法
JP2004193552A (ja) 半導体装置配線シード層形成用銅合金スパッタリングターゲット
JP4459067B2 (ja) 高強度高導電性銅合金
JP4485570B2 (ja) フレキシブル銅基板用バリア膜及びバリア膜形成用スパッタリングターゲット
JP5755892B2 (ja) 銅合金板の製造方法
JP4836359B2 (ja) スパッタターゲット、ゲート絶縁膜および電子部品
JP2005330591A (ja) スパッタリングターゲット
JP4224880B2 (ja) Ｃｏ−Ｎｉ合金スパッタリングターゲット及びその製造方法
JP4158337B2 (ja) 連続鋳造鋳型用クロム・ジルコニウム系銅合金の製造方法
JP5476111B2 (ja) 電子機器用通電部材用Ｃｒ−Ｃｕ合金とＣｒ−Ｃｕ合金の製造方法、ならびにそのＣｒ−Ｃｕ合金を用いたリードフレーム又はバスバーとその製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070214

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070214

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20090820

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090828

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20091015

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20100305

A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20100318

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130409

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Ref document number: 4487225

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130409

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140409

Year of fee payment: 4

EXPY Cancellation because of completion of term