JP2001262328A5 - - Google Patents
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- Publication number
- JP2001262328A5 JP2001262328A5 JP2000081091A JP2000081091A JP2001262328A5 JP 2001262328 A5 JP2001262328 A5 JP 2001262328A5 JP 2000081091 A JP2000081091 A JP 2000081091A JP 2000081091 A JP2000081091 A JP 2000081091A JP 2001262328 A5 JP2001262328 A5 JP 2001262328A5
- Authority
- JP
- Japan
- Prior art keywords
- film
- target material
- corrosion resistance
- purity
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000013077 target material Substances 0.000 description 9
- 230000007797 corrosion Effects 0.000 description 5
- 238000005260 corrosion Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910018559 Ni—Nb Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005477 sputtering target Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000081091A JP4487225B2 (ja) | 2000-03-23 | 2000-03-23 | Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000081091A JP4487225B2 (ja) | 2000-03-23 | 2000-03-23 | Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001262328A JP2001262328A (ja) | 2001-09-26 |
| JP2001262328A5 true JP2001262328A5 (enrdf_load_stackoverflow) | 2007-03-29 |
| JP4487225B2 JP4487225B2 (ja) | 2010-06-23 |
Family
ID=18598072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000081091A Expired - Lifetime JP4487225B2 (ja) | 2000-03-23 | 2000-03-23 | Ｎｉ−Ｎｂ系ターゲット材およびロウ材用下地膜 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4487225B2 (enrdf_load_stackoverflow) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4466902B2 (ja) * | 2003-01-10 | 2010-05-26 | 日鉱金属株式会社 | ニッケル合金スパッタリングターゲット |
| JP2005093571A (ja) * | 2003-09-16 | 2005-04-07 | Hitachi Metals Ltd | 薄膜配線層 |
| EP1672086B1 (en) * | 2003-10-07 | 2019-03-13 | JX Nippon Mining & Metals Corporation | HIGH-PURITY Ni-V ALLOY, TARGET THEREFROM, HIGH-PURITY Ni-V ALLOY THIN FILM AND PROCESS FOR PRODUCING HIGH-PURITY Ni-V ALLOY |
| JP4730662B2 (ja) * | 2005-03-02 | 2011-07-20 | 日立金属株式会社 | 薄膜配線層 |
| JP4655281B2 (ja) * | 2005-03-29 | 2011-03-23 | 日立金属株式会社 | 薄膜配線層 |
| JP5203908B2 (ja) * | 2008-12-04 | 2013-06-05 | 新日鉄住金マテリアルズ株式会社 | Ｎｉ−Ｍｏ系合金スパッタリングターゲット板 |
| JP2010133001A (ja) * | 2008-12-08 | 2010-06-17 | Hitachi Metals Ltd | Ｎｉ合金ターゲット材の製造方法 |
| JP5113100B2 (ja) * | 2009-01-28 | 2013-01-09 | Ｊｘ日鉱日石金属株式会社 | 高純度ニッケル合金ターゲット |
-
2000
- 2000-03-23 JP JP2000081091A patent/JP4487225B2/ja not_active Expired - Lifetime
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