JP4472593B2 - プローブカード - Google Patents

プローブカード Download PDF

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Publication number
JP4472593B2
JP4472593B2 JP2005203285A JP2005203285A JP4472593B2 JP 4472593 B2 JP4472593 B2 JP 4472593B2 JP 2005203285 A JP2005203285 A JP 2005203285A JP 2005203285 A JP2005203285 A JP 2005203285A JP 4472593 B2 JP4472593 B2 JP 4472593B2
Authority
JP
Japan
Prior art keywords
contactor
elasticity
probe
probe card
center
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2005203285A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007024533A (ja
Inventor
貴 雨宮
久富 保坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005203285A priority Critical patent/JP4472593B2/ja
Priority to US11/883,885 priority patent/US7541820B2/en
Priority to KR1020077014131A priority patent/KR100915179B1/ko
Priority to PCT/JP2006/312790 priority patent/WO2007007544A1/ja
Priority to TW095123260A priority patent/TW200716987A/zh
Publication of JP2007024533A publication Critical patent/JP2007024533A/ja
Application granted granted Critical
Publication of JP4472593B2 publication Critical patent/JP4472593B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
JP2005203285A 2005-07-12 2005-07-12 プローブカード Expired - Fee Related JP4472593B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005203285A JP4472593B2 (ja) 2005-07-12 2005-07-12 プローブカード
US11/883,885 US7541820B2 (en) 2005-07-12 2006-06-27 Probe card
KR1020077014131A KR100915179B1 (ko) 2005-07-12 2006-06-27 프로브 카드
PCT/JP2006/312790 WO2007007544A1 (ja) 2005-07-12 2006-06-27 プローブカード
TW095123260A TW200716987A (en) 2005-07-12 2006-06-28 Probe card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005203285A JP4472593B2 (ja) 2005-07-12 2005-07-12 プローブカード

Publications (2)

Publication Number Publication Date
JP2007024533A JP2007024533A (ja) 2007-02-01
JP4472593B2 true JP4472593B2 (ja) 2010-06-02

Family

ID=37636940

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005203285A Expired - Fee Related JP4472593B2 (ja) 2005-07-12 2005-07-12 プローブカード

Country Status (5)

Country Link
US (1) US7541820B2 (enrdf_load_stackoverflow)
JP (1) JP4472593B2 (enrdf_load_stackoverflow)
KR (1) KR100915179B1 (enrdf_load_stackoverflow)
TW (1) TW200716987A (enrdf_load_stackoverflow)
WO (1) WO2007007544A1 (enrdf_load_stackoverflow)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200525675A (en) * 2004-01-20 2005-08-01 Tokyo Electron Ltd Probe guard
JP4588711B2 (ja) * 2005-03-08 2010-12-01 東京エレクトロン株式会社 接続ピンの形成方法，プローブ，接続ピン，プローブカード及びプローブカードの製造方法
KR100851392B1 (ko) * 2007-03-16 2008-08-11 (주)엠투엔 평탄화 수단을 구비한 프로브 카드
KR101402144B1 (ko) * 2007-03-30 2014-06-03 주식회사 아이에스시 이방 도전성 커넥터, 프로브 부재 및 웨이퍼 검사 장치
JP5015671B2 (ja) * 2007-06-21 2012-08-29 日本電子材料株式会社 プローブカード
JP2009133722A (ja) * 2007-11-30 2009-06-18 Tokyo Electron Ltd プローブ装置
JP5188161B2 (ja) * 2007-11-30 2013-04-24 東京エレクトロン株式会社 プローブカード
JP2009204393A (ja) * 2008-02-27 2009-09-10 Renesas Technology Corp プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法
JP2009301859A (ja) * 2008-06-12 2009-12-24 Japan Electronic Materials Corp Ｉｃピンフレームおよびｉｃピンを用いたプローブカード
KR101593521B1 (ko) * 2009-08-07 2016-02-15 삼성전자주식회사 테스터 및 이를 구비한 반도체 디바이스 검사 장치
DE202009014987U1 (de) * 2009-10-28 2010-02-18 Feinmetall Gmbh Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen
US8643394B2 (en) * 2010-04-16 2014-02-04 Taiwan Semiconductor Manufacturing Company, Ltd. Non-reflow probe card structure
JP5681213B2 (ja) * 2011-01-16 2015-03-04 日本電子材料株式会社 プローブカード及びその製造方法
US9891273B2 (en) * 2011-06-29 2018-02-13 Taiwan Semiconductor Manufacturing Company, Ltd. Test structures and testing methods for semiconductor devices
JP7075725B2 (ja) * 2017-05-30 2022-05-26 株式会社日本マイクロニクス 電気的接続装置
JP7590820B2 (ja) * 2020-06-17 2024-11-27 株式会社ヨコオ プローブカード

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5854534A (en) * 1992-08-05 1998-12-29 Fujitsu Limited Controlled impedence interposer substrate
DE69530103T2 (de) 1994-11-15 2003-12-11 Formfactor, Inc. Verbindungselemente für mikroelektronische komponenten
US6483328B1 (en) * 1995-11-09 2002-11-19 Formfactor, Inc. Probe card for probing wafers with raised contact elements
US5828226A (en) * 1996-11-06 1998-10-27 Cerprobe Corporation Probe card assembly for high density integrated circuits
EP1365479B1 (en) * 2001-02-09 2011-01-05 JSR Corporation Anisotropic conductive connector, its manufacture method and probe member
US7396236B2 (en) * 2001-03-16 2008-07-08 Formfactor, Inc. Wafer level interposer
JP3891798B2 (ja) * 2001-06-19 2007-03-14 松下電器産業株式会社 プローブ装置
US6677771B2 (en) * 2001-06-20 2004-01-13 Advantest Corp. Probe contact system having planarity adjustment mechanism
TW525273B (en) * 2002-02-07 2003-03-21 Via Tech Inc Elastomer interposer for fixing package onto printed circuit board and fabrication method thereof
JP3621938B2 (ja) 2002-08-09 2005-02-23 日本電子材料株式会社 プローブカード
US7372286B2 (en) * 2006-01-03 2008-05-13 Chipmos Technologies (Bermuda) Ltd. Modular probe card

Also Published As

Publication number Publication date
JP2007024533A (ja) 2007-02-01
KR20070104531A (ko) 2007-10-26
US7541820B2 (en) 2009-06-02
KR100915179B1 (ko) 2009-09-02
TWI293120B (enrdf_load_stackoverflow) 2008-02-01
US20080150558A1 (en) 2008-06-26
WO2007007544A1 (ja) 2007-01-18
TW200716987A (en) 2007-05-01

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