JP4472593B2 - プローブカード - Google Patents
プローブカード Download PDFInfo
- Publication number
- JP4472593B2 JP4472593B2 JP2005203285A JP2005203285A JP4472593B2 JP 4472593 B2 JP4472593 B2 JP 4472593B2 JP 2005203285 A JP2005203285 A JP 2005203285A JP 2005203285 A JP2005203285 A JP 2005203285A JP 4472593 B2 JP4472593 B2 JP 4472593B2
- Authority
- JP
- Japan
- Prior art keywords
- contactor
- elasticity
- probe
- probe card
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- H10P74/00—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005203285A JP4472593B2 (ja) | 2005-07-12 | 2005-07-12 | プローブカード |
| US11/883,885 US7541820B2 (en) | 2005-07-12 | 2006-06-27 | Probe card |
| PCT/JP2006/312790 WO2007007544A1 (ja) | 2005-07-12 | 2006-06-27 | プローブカード |
| KR1020077014131A KR100915179B1 (ko) | 2005-07-12 | 2006-06-27 | 프로브 카드 |
| TW095123260A TW200716987A (en) | 2005-07-12 | 2006-06-28 | Probe card |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005203285A JP4472593B2 (ja) | 2005-07-12 | 2005-07-12 | プローブカード |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007024533A JP2007024533A (ja) | 2007-02-01 |
| JP4472593B2 true JP4472593B2 (ja) | 2010-06-02 |
Family
ID=37636940
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005203285A Expired - Fee Related JP4472593B2 (ja) | 2005-07-12 | 2005-07-12 | プローブカード |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7541820B2 (OSRAM) |
| JP (1) | JP4472593B2 (OSRAM) |
| KR (1) | KR100915179B1 (OSRAM) |
| TW (1) | TW200716987A (OSRAM) |
| WO (1) | WO2007007544A1 (OSRAM) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200525675A (en) * | 2004-01-20 | 2005-08-01 | Tokyo Electron Ltd | Probe guard |
| KR100788208B1 (ko) * | 2005-03-08 | 2007-12-26 | 동경 엘렉트론 주식회사 | 접속핀의 형성 방법, 프로브, 접속핀, 프로브 카드 및프로브의 제조 방법 |
| KR100851392B1 (ko) * | 2007-03-16 | 2008-08-11 | (주)엠투엔 | 평탄화 수단을 구비한 프로브 카드 |
| US8410808B2 (en) * | 2007-03-30 | 2013-04-02 | Jsr Corporation | Anisotropic conductive connector, probe member and wafer inspection system |
| JP5015671B2 (ja) * | 2007-06-21 | 2012-08-29 | 日本電子材料株式会社 | プローブカード |
| JP2009133722A (ja) * | 2007-11-30 | 2009-06-18 | Tokyo Electron Ltd | プローブ装置 |
| JP5188161B2 (ja) * | 2007-11-30 | 2013-04-24 | 東京エレクトロン株式会社 | プローブカード |
| JP2009204393A (ja) * | 2008-02-27 | 2009-09-10 | Renesas Technology Corp | プローブカード、プローブカードの製造方法、半導体検査装置および半導体装置の製造方法 |
| JP2009301859A (ja) * | 2008-06-12 | 2009-12-24 | Japan Electronic Materials Corp | Icピンフレームおよびicピンを用いたプローブカード |
| KR101593521B1 (ko) * | 2009-08-07 | 2016-02-15 | 삼성전자주식회사 | 테스터 및 이를 구비한 반도체 디바이스 검사 장치 |
| DE202009014987U1 (de) * | 2009-10-28 | 2010-02-18 | Feinmetall Gmbh | Prüfvorrichtung zur elektrischen Prüfung von elektrischen Prüflingen |
| US8643394B2 (en) * | 2010-04-16 | 2014-02-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Non-reflow probe card structure |
| US20130265073A1 (en) * | 2011-01-16 | 2013-10-10 | Japan Electronic Materials Corporation | Probe Card And Manufacturing Method Therefor |
| US9891273B2 (en) * | 2011-06-29 | 2018-02-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Test structures and testing methods for semiconductor devices |
| JP7075725B2 (ja) * | 2017-05-30 | 2022-05-26 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP7590820B2 (ja) * | 2020-06-17 | 2024-11-27 | 株式会社ヨコオ | プローブカード |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5854534A (en) * | 1992-08-05 | 1998-12-29 | Fujitsu Limited | Controlled impedence interposer substrate |
| EP1198001A3 (en) | 1994-11-15 | 2008-07-23 | FormFactor, Inc. | Method of testing and mounting devices using a resilient contact structure |
| US6483328B1 (en) | 1995-11-09 | 2002-11-19 | Formfactor, Inc. | Probe card for probing wafers with raised contact elements |
| US5828226A (en) * | 1996-11-06 | 1998-10-27 | Cerprobe Corporation | Probe card assembly for high density integrated circuits |
| US6969622B1 (en) * | 2001-02-09 | 2005-11-29 | Jsr Corporation | Anisotropically conductive connector, its manufacture method and probe member |
| US7396236B2 (en) * | 2001-03-16 | 2008-07-08 | Formfactor, Inc. | Wafer level interposer |
| JP3891798B2 (ja) * | 2001-06-19 | 2007-03-14 | 松下電器産業株式会社 | プローブ装置 |
| US6677771B2 (en) * | 2001-06-20 | 2004-01-13 | Advantest Corp. | Probe contact system having planarity adjustment mechanism |
| TW525273B (en) * | 2002-02-07 | 2003-03-21 | Via Tech Inc | Elastomer interposer for fixing package onto printed circuit board and fabrication method thereof |
| JP3621938B2 (ja) | 2002-08-09 | 2005-02-23 | 日本電子材料株式会社 | プローブカード |
| US7372286B2 (en) * | 2006-01-03 | 2008-05-13 | Chipmos Technologies (Bermuda) Ltd. | Modular probe card |
-
2005
- 2005-07-12 JP JP2005203285A patent/JP4472593B2/ja not_active Expired - Fee Related
-
2006
- 2006-06-27 WO PCT/JP2006/312790 patent/WO2007007544A1/ja not_active Ceased
- 2006-06-27 KR KR1020077014131A patent/KR100915179B1/ko not_active Expired - Fee Related
- 2006-06-27 US US11/883,885 patent/US7541820B2/en not_active Expired - Fee Related
- 2006-06-28 TW TW095123260A patent/TW200716987A/zh not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR100915179B1 (ko) | 2009-09-02 |
| TW200716987A (en) | 2007-05-01 |
| TWI293120B (OSRAM) | 2008-02-01 |
| WO2007007544A1 (ja) | 2007-01-18 |
| US7541820B2 (en) | 2009-06-02 |
| JP2007024533A (ja) | 2007-02-01 |
| KR20070104531A (ko) | 2007-10-26 |
| US20080150558A1 (en) | 2008-06-26 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
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| LAPS | Cancellation because of no payment of annual fees |