JP4458157B2 - 電子部品の放熱構造及び表示装置 - Google Patents

電子部品の放熱構造及び表示装置 Download PDF

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Publication number
JP4458157B2
JP4458157B2 JP2007308282A JP2007308282A JP4458157B2 JP 4458157 B2 JP4458157 B2 JP 4458157B2 JP 2007308282 A JP2007308282 A JP 2007308282A JP 2007308282 A JP2007308282 A JP 2007308282A JP 4458157 B2 JP4458157 B2 JP 4458157B2
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JP
Japan
Prior art keywords
cooling fan
heat sink
heat
arm
groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2007308282A
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English (en)
Japanese (ja)
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JP2009135165A (ja
JP2009135165A5 (enExample
Inventor
竜也 坂田
徹 山内
研一 関
輝孝 簗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
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Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP2007308282A priority Critical patent/JP4458157B2/ja
Priority to US12/325,059 priority patent/US7898798B2/en
Publication of JP2009135165A publication Critical patent/JP2009135165A/ja
Publication of JP2009135165A5 publication Critical patent/JP2009135165A5/ja
Application granted granted Critical
Publication of JP4458157B2 publication Critical patent/JP4458157B2/ja
Expired - Fee Related legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/2099—Liquid coolant with phase change

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2007308282A 2007-11-29 2007-11-29 電子部品の放熱構造及び表示装置 Expired - Fee Related JP4458157B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007308282A JP4458157B2 (ja) 2007-11-29 2007-11-29 電子部品の放熱構造及び表示装置
US12/325,059 US7898798B2 (en) 2007-11-29 2008-11-28 Heat dissipating structure for electronic component and display device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007308282A JP4458157B2 (ja) 2007-11-29 2007-11-29 電子部品の放熱構造及び表示装置

Publications (3)

Publication Number Publication Date
JP2009135165A JP2009135165A (ja) 2009-06-18
JP2009135165A5 JP2009135165A5 (enExample) 2009-07-30
JP4458157B2 true JP4458157B2 (ja) 2010-04-28

Family

ID=40675479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007308282A Expired - Fee Related JP4458157B2 (ja) 2007-11-29 2007-11-29 電子部品の放熱構造及び表示装置

Country Status (2)

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US (1) US7898798B2 (enExample)
JP (1) JP4458157B2 (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102091540B1 (ko) * 2012-09-28 2020-03-20 삼성전자주식회사 디스플레이 장치 및 이를 포함하는 단말기
US9357670B2 (en) * 2014-02-18 2016-05-31 Lockheed Martin Corporation Efficient heat transfer from conduction-cooled circuit cards
CN105451513B (zh) 2014-09-21 2018-11-09 宏达国际电子股份有限公司 一种电子装置
WO2016085018A1 (ko) * 2014-11-27 2016-06-02 엘지전자 주식회사 디스플레이 장치
CN105764307B (zh) * 2016-04-11 2018-06-01 联想(北京)有限公司 散热装置及电子设备
JP6780422B2 (ja) * 2016-09-30 2020-11-04 オムロン株式会社 電子機器
CN111433549A (zh) 2017-07-17 2020-07-17 分形散热器技术有限责任公司 多重分形散热器系统及方法
JP7195770B2 (ja) * 2018-05-30 2022-12-26 キヤノン株式会社 冷却ユニットを用いた撮像装置および電子機器
JP2020030694A (ja) * 2018-08-23 2020-02-27 レノボ・シンガポール・プライベート・リミテッド 電子機器
CN118765033B (zh) * 2024-09-06 2024-11-15 龙南鼎泰电子科技有限公司 一种新能源汽车上的配电线路板

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5299632A (en) * 1993-02-19 1994-04-05 Lee Lien Jung Fin device for an integrated circuit
US5566749A (en) * 1994-04-12 1996-10-22 Thermalloy, Inc. Stamped and formed heat sink
US5495392A (en) * 1995-03-06 1996-02-27 Shen; Tsan-Jung CPU heat dissipating apparatus
US5664624A (en) * 1996-11-04 1997-09-09 Chin-Fu Tsai Sloped wall type heat radiating member for chip
JP2912304B2 (ja) * 1997-09-04 1999-06-28 群馬日本電気株式会社 ヒートシンクの冷却ファン取付構造
JP2001014067A (ja) 1999-06-25 2001-01-19 Toshiba Corp 小型電子機器
US6302189B1 (en) * 2000-06-16 2001-10-16 Delta Electronics, Inc. Engagement structure of a fan
JP2002076664A (ja) 2000-08-23 2002-03-15 Sony Corp 放熱装置および放熱装置を有する電子機器
KR20030000661A (ko) * 2001-06-26 2003-01-06 주식회사 하이닉스반도체 반도체 소자의 제조 방법
WO2004100262A1 (ja) * 2003-05-07 2004-11-18 Fujitsu Limited 冷却部品、基板及び電子機器
JP2005243925A (ja) 2004-02-26 2005-09-08 Toshiba Home Technology Corp 冷却モジュール
TWI314033B (en) * 2007-01-23 2009-08-21 Sunonwealth Electr Mach Ind Co Mini heat dissipating module

Also Published As

Publication number Publication date
JP2009135165A (ja) 2009-06-18
US20090141450A1 (en) 2009-06-04
US7898798B2 (en) 2011-03-01

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