JP4454226B2 - シリコンとltccを含む電子装置の製造方法及びそれにより製造された電子装置 - Google Patents
シリコンとltccを含む電子装置の製造方法及びそれにより製造された電子装置 Download PDFInfo
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- JP4454226B2 JP4454226B2 JP2002551895A JP2002551895A JP4454226B2 JP 4454226 B2 JP4454226 B2 JP 4454226B2 JP 2002551895 A JP2002551895 A JP 2002551895A JP 2002551895 A JP2002551895 A JP 2002551895A JP 4454226 B2 JP4454226 B2 JP 4454226B2
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- cooling structure
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- microfluidic cooling
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- integrated circuit
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Micromachines (AREA)
- Ceramic Products (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/741,754 US6809424B2 (en) | 2000-12-19 | 2000-12-19 | Method for making electronic devices including silicon and LTCC and devices produced thereby |
| PCT/US2001/046775 WO2002050888A2 (en) | 2000-12-19 | 2001-12-10 | Method for making electronic devices including silicon and ltcc |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004537156A JP2004537156A (ja) | 2004-12-09 |
| JP2004537156A5 JP2004537156A5 (enExample) | 2005-04-28 |
| JP4454226B2 true JP4454226B2 (ja) | 2010-04-21 |
Family
ID=24982035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002551895A Expired - Fee Related JP4454226B2 (ja) | 2000-12-19 | 2001-12-10 | シリコンとltccを含む電子装置の製造方法及びそれにより製造された電子装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US6809424B2 (enExample) |
| EP (1) | EP1362368A2 (enExample) |
| JP (1) | JP4454226B2 (enExample) |
| KR (1) | KR100574582B1 (enExample) |
| CN (1) | CN1494739A (enExample) |
| AU (1) | AU2002225952A1 (enExample) |
| WO (1) | WO2002050888A2 (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6976527B2 (en) * | 2001-07-17 | 2005-12-20 | The Regents Of The University Of California | MEMS microcapillary pumped loop for chip-level temperature control |
| JP3896840B2 (ja) * | 2001-12-13 | 2007-03-22 | ソニー株式会社 | 冷却装置、電子機器装置及び冷却装置の製造方法 |
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-
2000
- 2000-12-19 US US09/741,754 patent/US6809424B2/en not_active Expired - Lifetime
-
2001
- 2001-12-10 CN CNA018221300A patent/CN1494739A/zh active Pending
- 2001-12-10 EP EP01995388A patent/EP1362368A2/en not_active Withdrawn
- 2001-12-10 WO PCT/US2001/046775 patent/WO2002050888A2/en not_active Ceased
- 2001-12-10 AU AU2002225952A patent/AU2002225952A1/en not_active Abandoned
- 2001-12-10 JP JP2002551895A patent/JP4454226B2/ja not_active Expired - Fee Related
- 2001-12-10 KR KR1020037008195A patent/KR100574582B1/ko not_active Expired - Lifetime
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- 2004-08-19 US US10/921,511 patent/US6987033B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| CN1494739A (zh) | 2004-05-05 |
| KR100574582B1 (ko) | 2006-04-28 |
| US20050019986A1 (en) | 2005-01-27 |
| US6987033B2 (en) | 2006-01-17 |
| US6809424B2 (en) | 2004-10-26 |
| EP1362368A2 (en) | 2003-11-19 |
| KR20040064602A (ko) | 2004-07-19 |
| WO2002050888A3 (en) | 2003-08-07 |
| WO2002050888A2 (en) | 2002-06-27 |
| AU2002225952A1 (en) | 2002-07-01 |
| JP2004537156A (ja) | 2004-12-09 |
| US20020130408A1 (en) | 2002-09-19 |
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